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Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging

Xinmeng Zhai (Shanghai Institute of Technology, Shanghai, China)
Yue Chen (Shanghai Institute of Technology, Shanghai, China)
Yuefeng Li (Shanghai Institute of Technology, Shanghai, China)
Jun Zou (Shanghai Institute of Technology, Shanghai, China)
Mingming Shi (Shanghai Institute of Technology, Shanghai, China)
Bobo Yang (Shanghai Institute of Technology, Shanghai, China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 15 February 2022

Issue publication date: 23 September 2022

105

Abstract

Purpose

This study aims to study the mechanical, photoelectric, and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip light-emitting diode (LED) package component during aging. By adding nanoparticles (Ni-multi-walled carbon nanotubes [MWCNTs]) to the solder paste, the shear strength and fatigue resistance of the brazed joint can be improved. However, the aging properties of Ni-modified MWCNTs composite solder joints have not been deeply studied. In this research, the mechanical, photoelectric and thermal reliability of SAC307 packaged flip-chip LEDs with Ni-MWCNTs added during aging were studied.

Design/methodology/approach

Compared with SAC solder alloys, the effects of different contents (0, 0.05, 0.1 and 0.2 Wt.%) of Ni-MWCNTs on the photoelectric and thermal properties of composite solder joints were examined. To study the aging characteristics of composite solder joints, the solder joints were aged at 85°C/85% relative humidity.

Findings

The addition of an appropriate amount of reinforcing agent Ni-MWCNTs reduces the density of the composite solder to 96% of the theoretical value of the SAC solder alloy. In addition, the microhardness increases and the wetting angle decreases. Two different phase compositions were observed in the solder joints with Ni-MWCNTs reinforcement: Cu3Sn and (Cu, Ni)6Sn5. The solder joints of SAC307-0.1Ni-MWCNTs exhibit the highest luminous flux and luminous efficiency of flip-chip LED filaments, the lowest steady-state voltage and junction temperature. And with the extension of the aging time, its aging stability is the best. In short, when the addition amount of Ni-MWCNTs is 0.1 Wt.%, the solder joints exhibit the best wettability and the thinnest intermetallic compound layer. And the shear strength of the tested solder joints is the best, and the void ratio is the lowest. At this time, the enhancement effect of Ni-MWCNTs on the composite solder has been best demonstrated.

Research limitations/implications

The content range of enhancer Ni-MWCNTs needs to be further reduced.

Practical implications

The authors have improved the performance of Ni-modified MWCNTs composite solder joints.

Originality/value

Composite solder with high performance has great practical application significance for improving the reliability and life of the whole device.

Keywords

Acknowledgements

This research was supported by Enterprise Funded Latitudinal Research Projects (J2019-274; J2019-165; J2019-281; J2019-312; J2020-34; J2020-3; J 2020–252 and J 2020–289).

Conflict of interest: The authors declare that they have no conflict of interest.

Citation

Zhai, X., Chen, Y., Li, Y., Zou, J., Shi, M. and Yang, B. (2022), "Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging", Soldering & Surface Mount Technology, Vol. 34 No. 5, pp. 257-265. https://doi.org/10.1108/SSMT-08-2021-0059

Publisher

:

Emerald Publishing Limited

Copyright © 2020, Emerald Publishing Limited

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