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This paper describes the effect of alloying elements such as Nb and Ga on the corrosion behaviour of Nd‐Fe‐B permanent magnetic alloy. The results revealed that the alloying elements are not helpful in improving the corrosion resistance of the base magnet; rather their presence makes the base alloy highly vulnerable to corrosion in acidic environments. In particular, Nb addition is more detrimental to corrosion as was evidenced by potentiodynamic, cyclic polarisation, E_corr vs time, electrochemical impedance and SEM results. The studies also showed that the degradation of the alloys with and without alloying addition takes place due to preferential dissolution of grain boundaries.

This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile properties, hardness and shear strength. Then, the effects of alloying in Sn-Bi solder are compared in terms of the discussed mechanical properties. The fracture morphologies of tensile shear tested solders are also reviewed to correlate the microstructural changes with mechanical properties of Sn-Bi-X solder alloys.

A brief introduction on Sn-Bi solder and reasons to enhance the mechanical properties of Sn-Bi solder. The latest reports on Sn-Bi and Sn-Bi-X solders are combined in the form of tables and figures for each section. The presented data are discussed by comparing the testing method, technical setup, specimen dimension and alloying element weight percentage, which affect the mechanical properties of Sn-Bi solder.

The addition of alloying elements could enhance the tensile properties, hardness and/or shear strength of Sn-Bi solder for low-temperature solder application. Different weight percentage alloying elements affect differently on Sn-Bi solder mechanical properties.

This paper provides a compilation of latest report on tensile properties, hardness, shear strength and deformation of Sn-Bi and Sn-Bi-X solders and the latest trends and in-depth understanding of the effect of alloying elements in Sn-Bi solder mechanical properties.

This study aims to control the oxidation resistance of Co-based deformed superalloys by adding trace elements Hf and Si.

The effects and mechanism of trace elements Hf and Si on the oxidation behavior of Co-Ni-Al-W-based forged superalloys were investigated by cyclic oxidation at 900°C.

The results show that the addition of trace elements Hf and Si does not affect the type of surface oxides of Co-Ni-based superalloys, and the oxidation layers of the alloys are TiO₂, spinel, Cr₂O₃, TaTiO₄, Al₂O₃ and TiN from outside to inside. However, the addition of elements can affect the activity of Cr and Ti elements; decrease the formation of TiO₂ and TaTiO₄ layers, which are harmful to the oxidation performance; and then improve the oxidation resistance of the alloy.

The relevant research results can not only optimize the microalloying element content of Co-Ni-Al-W-based superalloys, but also provide a new perspective for the composition optimization design of superalloys.

The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative solder to overcome the environmental concern of lead (Pb) solder. Many researchers have studied the SAC solder alloy and found that the properties such as melting temperature, wettability, microstructure and interfacial, together with mechanical properties, are better for the SAC solder than the tin – lead (SnPb) solders. Meanwhile, addition of various elements and nanoparticles seems to produce enhancement on the prior bulk solder alloy as well. These benefits suggest that the SAC solder alloy could be the next alternative solder for the electronic packaging industry. Although many studies have been conducted for this particular solder alloy, a compilation of all these properties regarding the SAC solder alloy is still not available for a review to say.

Soldering is identified as the metallurgical joining method in electronic packaging industry which uses filler metal, or well known as the solder, with a melting point < 425°C (Yoon et al., 2009; Ervina and Marini, 2012). The SAC solder has been developed by many methods and even alloying it with some elements to enhance its properties (Law et al., 2006; Tsao et al., 2010; Wang et al., 2002; Gain et al., 2011). The development toward miniaturization, meanwhile, requires much smaller solder joints and fine-pitch interconnections for microelectronic packaging in electronic devices which demand better solder joint reliability of SAC solder Although many studies have been done based on the SAC solder, a review based on the important characteristics and the fundamental factor involving the SAC solder is still not sufficient. Henceforth, this paper resolves in stating all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

Various Pb-free solders have been studied and investigated to overcome the health and environmental concern of the SnPb solder. In terms of the melting temperature, the SAC solder seems to possess a high melting temperature of 227°C than the Pb solder SnPb. Here, the melting temperature of this solder falls within the range of the average reflow temperature in the electronic packaging industry and would not really affect the process of connection. A good amendment here is, this melting temperature can actually be reduced by adding some element such as titanium and zinc. The addition of these elements tends to decrease the melting temperature of the SAC solder alloy to about 3°C. Adding nanoparticles, meanwhile, tend to increase the melting temperature slightly; nonetheless, this increment was not seemed to damage other devices due to the very slight increment and no drastic changes in the solidification temperature. Henceforth, this paper reviews all the properties of the Pb-free SAC solder system by how it is developed from overcoming environmental problem to achieving and sustaining as the viable candidate in the electronic packaging industry. The Pb-free SAC solder can be the alternative to all drawbacks that the traditional SnPb solder possesses and also an upcoming new invention for the future needs. Although many studies have been done in this particular solder, not much information is gathered in a review to give better understanding for SAC solder alloy. In that, this paper reviews and gathers the importance of this SAC solder in the electronic packaging industry and provides information for better knowledge.

This paper resolves in stating of all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

This paper reviews the role of alloying elements in aluminium and alloy fabrication on performance during surface treatment and surface finishing. Such elements may be present in solid solution as fine segregates, strengthening phase and equilibrium phases. For surface treatment and finishes, which generally proceed in the presence of alumina film, knowledge of the processes proceeding at the alloy/film and film/electrolyte interfaces, and those within anodic alumina films, gives rise to the possibility of controlling features of nanoscale dimensions, for improved performance, arises. Its influence on nanotextures at treated surfaces and compositionally and morphologically modified films is explained briefly.

Due to the special service environment of superalloys, this paper aims to obtain effects of temperature and Ti addition on high temperature oxidation behavior of Co-Al-W-B alloys.

Isothermal oxidation experiment of Co-Al-W-based alloys were carried out at 800°C, 900°C and 1000°C for different times (3, 5, 10, 20, 50 and 100 h) referring to the method of HB5258-2000. Oxidation weight gain curves and oxidation products were detected.

The results showed that the average oxidation rates of Co-Al-W-B alloy at 800 °C and 900 °C were 0.489 g·m⁻²·h⁻¹ and 0.888 g·m⁻²·h⁻¹, respectively, which belonged to an antioxidant grade. However, the average oxidation rate at 1000 °C was 2.068 g m⁻²·h⁻¹, belonging to the secondary oxidation resistance class. In the alloy with Ti addition, dense Ti oxides film were formed at the early oxidation stage and then gradually diffused later, which can increase the oxidation resistance of the alloys to some extent. By analyzing the oxidation products of Co-Al-W-B alloy, it was found that a dense Al₂O₃ layer could be formed when the alloy was oxidized at 800°C. The continuous Al₂O₃ layer would prevent the oxygen from further spreading and make the alloy into the stable oxidation stage. However, only a non-dense Al₂O₃ layer were observed with 900°C oxidation.

It can provide references for the composition design, preparation process optimization and protective coating selection of the γ′ phase strengthened cobalt-base superalloys.

This paper aims to present a broad review of near-a titanium alloys for high-temperature applications.

Following a brief introduction of titanium (Ti) alloys, this paper considers the near-α group of Ti alloys, which are the most popular high-temperature Ti alloys developed for a high-temperature application, particularly in compressor disc and blades in aero-engines. The paper is relied on literature within the past decade to discuss phase stability and microstructural effect of alloying elements, plastic deformation and reinforcements used in the development of these alloys.

The near-a Ti alloys show high potential for high-temperature applications, and many researchers have explored the incorporation of TiC, TiB SiC, Y₂O₃, La₂O₃ and Al₂O₃ reinforcements for improved mechanical properties. Rolling, extrusion, forging and some severe plastic deformation (SPD) techniques, as well as heat treatment methods, have also been explored extensively. There is, however, a paucity of information on SiC, Y₂O₃ and carbon nanotube reinforcements and their combinations for improved mechanical properties. Information on some SPD techniques such as cyclic extrusion compression, multiaxial compression/forging and repeated corrugation and straightening for this class of alloys is also limited.

This paper provides a topical, technical insight into developments in near-a Ti alloys using literature from within the past decade. It also outlines the future developments of this class of Ti alloys.

The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free solder for high-temperature applications.

Effect of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element.

The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC). The addition of Tb could effectively reduce the onset and melting point. The elastic modulus of Tb-containing solders was enhanced to about 90% at 0.5 Tb. The higher elastic modulus may be attributed to solid solution strengthening effect, solubility extension, microstructure refinement and precipitation hardening of uniform distribution Ag99.5Bi0.5 IMC particles which can reasonably modify the microstructure, as well as inhibit the segregation and hinder the motion of dislocations.

It is recommended that the lead-free Bi-0.5Ag-0.5Tb solder be a candidate instead of common solder alloy (Sn-37Pb) for high temperature and high performance applications.

Anodizing is used widely in the surface treatment of aluminium alloys for aerospace applications. Considers recent advances in understanding of the influences of alloying elements in anodizing of aluminium alloys and, in particular, their applicability to second phase particles during anodizing of commercial alloys. Through more precise knowledge of the response of second phase materials to anodic polarization, improved anodizing and related surface treatment processes may be developed in order to enhance the performance of aluminium alloys.

The purpose of this paper is to discuss the reliability of board level Sn‐Ag‐Cu (SAC) solder joints in terms of both thermal cycling and drop impact loading conditions, and further modification of the characteristics of low Ag‐content SAC solder joints using minor alloying elements to withstand both thermal cycle and drop impact loads.

The thermal cycling and drop impact reliability of different Ag‐content SAC bulk solder will be discussed from the viewpoints of mechanical and micro‐structural properties.

The best SAC composition for drop performance is not necessarily the best composition for optimum thermal cycling reliability. The content level of silver in SAC solder alloys can be an advantage or a disadvantage depending on the application, package and reliability requirements. The low Ag‐content SAC alloys with different minor alloying elements such as Mn, Ce, Bi, Ni and Ti display good performance in terms of both thermal cycling and drop impact loading conditions.

The paper details the mechanical and micro‐structural properties requirements to design a robust bulk SAC solder joint. These properties provide design and manufacturing engineers with the necessary information when deciding on a solder alloy for their specific application.