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Article
Publication date: 1 April 2004

37

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Soldering & Surface Mount Technology, vol. 16 no. 1
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 December 1999

28

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Soldering & Surface Mount Technology, vol. 11 no. 3
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 April 2000

29

Abstract

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Soldering & Surface Mount Technology, vol. 12 no. 1
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 April 2000

62

Abstract

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Soldering & Surface Mount Technology, vol. 12 no. 1
Type: Research Article
ISSN: 0954-0911

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Content available
Article
Publication date: 1 August 2002

31

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Soldering & Surface Mount Technology, vol. 14 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 April 2000

23

Abstract

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Soldering & Surface Mount Technology, vol. 12 no. 1
Type: Research Article
ISSN: 0954-0911

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Content available
Article
Publication date: 1 March 2005

25

Abstract

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Soldering & Surface Mount Technology, vol. 17 no. 1
Type: Research Article
ISSN: 0954-0911

Content available
Article
Publication date: 1 August 2000

34

Abstract

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Soldering & Surface Mount Technology, vol. 12 no. 2
Type: Research Article
ISSN: 0954-0911

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Article
Publication date: 1 March 1993

Design for manufacture and testability seems to be a very hot topic. This seminar organised by Bob Willis was over‐subscribed within the first two weeks of announcement, and the…

Abstract

Design for manufacture and testability seems to be a very hot topic. This seminar organised by Bob Willis was over‐subscribed within the first two weeks of announcement, and the standby places were already sufficient to warrant a repeat seminar during September. This will be held in Chelmsford on 9 September.

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Soldering & Surface Mount Technology, vol. 5 no. 3
Type: Research Article
ISSN: 0954-0911

Article
Publication date: 1 March 1992

Colin Lea, Bob Willis, Mike Judd, Bob Willis, John Beamish and Karen Moore

This conference was the second in the National Physical Laboratory series focusing in turn on each of the non‐CFC options for de‐fluxing soldered electronics assemblies. The first…

Abstract

This conference was the second in the National Physical Laboratory series focusing in turn on each of the non‐CFC options for de‐fluxing soldered electronics assemblies. The first conference was on Controlled Atmosphere Soldering and the third will be on New Solvents.

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Soldering & Surface Mount Technology, vol. 4 no. 3
Type: Research Article
ISSN: 0954-0911

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