Keywords
Citation
(2000), "NPL Electronics Interconnection Group publications", Soldering & Surface Mount Technology, Vol. 12 No. 1. https://doi.org/10.1108/ssmt.2000.21912aab.018
Publisher
:Emerald Group Publishing Limited
Copyright © 2000, MCB UP Limited
NPL Electronics Interconnection Group publications
NPL Electronics Interconnection Group publications
Keywords: NPL, Internet, Publication
The National Physical Laboratory recently launched its new Web site and has received 1,600 visits since implementation. One of the most popular areas of interest is the list of reports from the Electronics Interconnection Group listing 25 titles, all available at £25 in the UK and £40 outside the UK.
The most recent titles include:
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The impact of solderability on reliability and yield of surface mount assembly - CMMT(A)214.
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The prediction of creep damage in surface mount components using finite element modelling - CMMT(A)218.
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Influence of rework conditions on microstructure in tin-lead solder joints - CMMT(A)216.
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Optimum pad design and solder joint shape for reliability - CMMT(A)215
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Solderability measurements with lead-free alloys - CMMT(A)213
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Benchmarking assisted and automatic optical inspection of electronic assemblies - CMMT(A)173.
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Stencil printing codes of practice - CMMT(A)165.