NPL Electronics Interconnection Group publications

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2000




(2000), "NPL Electronics Interconnection Group publications", Soldering & Surface Mount Technology, Vol. 12 No. 1.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

NPL Electronics Interconnection Group publications

NPL Electronics Interconnection Group publications

Keywords: NPL, Internet, Publication

The National Physical Laboratory recently launched its new Web site and has received 1,600 visits since implementation. One of the most popular areas of interest is the list of reports from the Electronics Interconnection Group listing 25 titles, all available at £25 in the UK and £40 outside the UK.

The most recent titles include:

  • The impact of solderability on reliability and yield of surface mount assembly - CMMT(A)214.

  • The prediction of creep damage in surface mount components using finite element modelling - CMMT(A)218.

  • Influence of rework conditions on microstructure in tin-lead solder joints - CMMT(A)216.

  • Optimum pad design and solder joint shape for reliability - CMMT(A)215

  • Solderability measurements with lead-free alloys - CMMT(A)213

  • Benchmarking assisted and automatic optical inspection of electronic assemblies - CMMT(A)173.

  • Stencil printing codes of practice - CMMT(A)165.

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