Keywords
Citation
(2002), "IPC. SSTC and SMART Group Meeting", Soldering & Surface Mount Technology, Vol. 14 No. 2. https://doi.org/10.1108/ssmt.2002.21914bab.004
Publisher
:Emerald Group Publishing Limited
Copyright © 2002, MCB UP Limited
IPC. SSTC and SMART Group Meeting
Keywords: SSTC, SMART Group
Advanced Printing TechnologyDate: 25 June 2002Venue: National Physical Laboratory (NPL)
NPL's Soldering Science & Technology Club and the SMART Group are jointly organising a one- day conference on Advanced Printing Technology. The meeting will cover issues associated with fine pitch printing within a surface mount assembly process. The work will draw n the latest research at NPL with the latest advances from DEK and Speedline Technologies.
The following papers will be presented:
Modern surface mount assemblyBob Willis, The SMART Group
An accurate and robust measurement method for characterising solder pasteMilos Dusek, NPL
Comparison of enclosed and squeegee systems for fine pitch printingChris Hunt, NPL
Paste development strategyBruce Seaton, Speedline Technologies
Effect of metal content and particle size on printingLing Zou, NPL
Solder paste for wafer bumpingSteve Dowds
Designing a process for intrusive printingBob Willis, The SMART Group
Approaches for stencil printing conductive and non-conductive adhesivesMartin Wickham, SSTC
Pump printing, and application examplesAlan Hobby, DEK
Pitfalls and best practice for dispensingAlan Brewin, NPL
For more information contact Dr Chris Hunt at NPL Tel: +44 (0)20 8943 6065 E-mail: chris.hunt@npl.co.uk