NPL. New issue of NPL Microelectronics News

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2000




(2000), "NPL. New issue of NPL Microelectronics News", Soldering & Surface Mount Technology, Vol. 12 No. 1.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

NPL. New issue of NPL Microelectronics News

New issue of NPL Microelectronics News

Keywords: NPL, Publication, Microelectronics, United Kingdom

The National Physical Laboratory has released the latest issue of Microelectronics News which updates the electronics industry on what is happening in the UK. Included is the announcement of the new EMERnet Flip-Chip Action Group formed to act as a focus for information exchange, to support co-ordinated research and to arrange workshops and meetings.

Following a successful collaboration between NPL and industry, a project has been concluded that compares X-ray equipment. With the drive to using ball grid arrays (BGAs) with "uninspectable" solder joints, the industry is looking at the wider uses of equipment for joint evaluation. This study investigates the performance of systems which were compared using assembled BGAs with known defects, using misalignments, missing balls, non-wetted pads and partially re-flowed joints.

Microelectronics News provides details of various upcoming workshops, a new test for pcb reliability, a stencil printing code of practice and a project looking at the capability of automated optical inspection (AOI) equipment; all make this an interesting issue of this publication that is circulated three times a year. Copies can be requested by calling Glenis Tellett on 020 8943 6701.

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