To read the full version of this content please select one of the options below:

SMART group news

Colin Lea (National Physical Laboratory)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 March 1992

Abstract

This conference was the second in the National Physical Laboratory series focusing in turn on each of the non‐CFC options for de‐fluxing soldered electronics assemblies. The first conference was on Controlled Atmosphere Soldering and the third will be on New Solvents.

Citation

Lea, C., Willis, B., Judd, M., Willis, B., Beamish, J. and Moore, K. (1992), "SMART group news", Soldering & Surface Mount Technology, Vol. 4 No. 3, pp. 55-61. https://doi.org/10.1108/eb037803

Publisher

:

MCB UP Ltd

Copyright © 1992, MCB UP Limited