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The 50th anniversary of Fox's Beyond Contract and Man Mismanagement coincides with another vital contribution to the sociology of work from 1974: Braverman's Labor and Monopoly Capital. This article analyses these two scholars' complementary approaches to job design and the extent to which Fox's ideas influenced subsequent labour process thought.

The article's methodological approach is a historiographical reading of Fox and Braverman's thought in the context of their times and later scholarship.

The article demonstrates that despite some noteworthy overlap with Braverman concerning scientific management, Fox's insights were marginal to later iterations of labour process analysis. It delves into the reasons for this relative neglect, providing an understanding of the dynamics at play.

This paper's value lies in its combined industrial relations and labour process historiography. It offers a fresh perspective on Alan Fox's relationship to the latter field of study.

Social media has emerged as a prominent platform for marketers and brands to disseminate brand-related information. This study aims to investigate the impact of color congruence between themes and background on marketing effectiveness, focusing specifically on Instagram.

A laboratory experiment was conducted to investigate how color congruence between themes and background in brand posts influences flow and aesthetic experience, subsequently affecting marketing communication parameters such as brand attitude, visit intention, and eWOM on Instagram. Moreover, Adidas Originals was selected as the focal brand, and blue and white color was chosen as the primary color palette for the experimental material.

This study demonstrates that color congruence, regardless of brand layout or post, significantly influences flow and aesthetic experience, subsequently affecting marketing effectiveness.

This study contributes to the theoretical understanding of congruence theory and social media marketing, providing valuable insights for brands to enhance their communication through photographs and effectively manage their official Instagram accounts.

The purpose of this paper is to present an up-to-date survey on the non-orthogonal multiple access (NOMA) technique with co-operative strategy, a fast-evolving fifth-generation (5 G) technology. NOMA is used for serving many mobile users, both in power and code domains. This paper considers the power-domain NOMA, which is now discussed as NOMA.

The first part of the paper discusses NOMA-based cooperative relay systems using different relay strategies over different channel models. In various research works, the analytical expressions of many performance metrics were derived, measured and simulated for better performance of the NOMA systems. In the second part, a brief introduction to diversity techniques is discussed. The multiple input and multiple output system merged with cooperative NOMA technology, and its future challenges were also presented in this part. In the third part, the paper surveys some new conceptions such as cognitive radio, index modulation multiple access, space-shift keying and reconfigurable intelligent surface that can be combined with NOMA systems for better performance.

The paper presents a brief survey of diverse research projects being carried out in the field of NOMA. The paper also surveyed two different relaying strategies that were implemented in cooperative NOMA over different channels and compared several performance parameters that were evaluated and derived in these implementations.

The paper provides a scope for recognizable future work and presents a brief idea of the new techniques that can be united with NOMA for better performance in wireless systems.

Although the significance of technological progress in economic development is well-established in theory and policy, it has remained challenging to agree upon shared priorities for strategies and policies. This paper aims to develop a model of how policymakers can develop effective and easy to communicate strategies for science, technology and economic development.

By integrating insights from economic complexity, competitiveness and foresight literature, a replicable research framework for analysing the opportunities and challenges of technological revolutions for small catching-up countries is developed. The authors highlight key lessons from piloting this framework for informing the strategy and policies for bioeconomy in Estonia towards 2030–2050.

The integration of economic complexity research with traditional foresight methods establishes a solid analytical basis for a data-driven analysis of the opportunities for industrial upgrading. The increase in the importance of regional alliances in the global economy calls for further advancement of the analytical toolbox. Integration of complexity, global value chains and export potential assessment approaches offers valuable direction for further research, as it enables discussion of the opportunities of moving towards more knowledge-intensive economic activities along with the opportunities for winning international market share.

The research merges insights from the economic complexity, competitiveness and foresight literature in a novel way and illustrates the applicability and priority-setting in a real-life setting.

At the beginning of the 21st century, a new class of information workers, the “information have-less” has risen. This class of workers alleviates the influence of information and communication technologies (ICTs) revolution on poverty and unemployment. The purpose of this study is to investigate the presence of this class of workers in Egypt and assess the size and potential growth of this category of workers.

The study clarifies the conceptual framework of the new division of labor, in the information age. The Central Agency for Public Mobilization and Statistics, American Chamber of Commerce in Egypt, Ministry of Communications and Information Technology and Information and Decision Support Center websites provided secondary data for this study. These data are used to assess the size of “the information have less” in Egypt.

The division of work and class, in the 21st century, depends on the level of skills possessed to work with ICTs. So, class and labor nowadays could be divided into self-programmable labor (Innovators). Information have-less labor class, adding value to the economy by learning skills and presenting repetitive work. Generic labor class, who cannot work with ICTs, and work in jobs, that do not need computers or other ICTs. The study has shown that the “information have-less” labor class is present in Egypt since the beginning of the 21st century, in all its categories; entrepreneurism, the service sector and the manufacturing sector. There are approximately 50% of this labor class in the service sector and only 13% of the information have-less works in manufacturing sector despite the great opportunities that Egypt has to expand manufacturing to absorb more employment. The inclusion of information technology (IT), in all domains, has not decreased employment in Western countries but has reallocated information have-less employment toward the service sector, and there would probably be the same effect in Egypt.

The study highlights the need for Egyptian policymakers to encourage the manufacturing and service sectors to provide huge working opportunities. The Egyptian government has to change the educational policies, at all stages, to include digital learning skills so IT can be incorporated in a wide range of economic activities. Further research includes: conducting a survey to measure the contribution of the entrepreneurial part of the information have-less employment in Egypt. In addition, a model may be developed, by the researcher to examine the reallocation of employees in Egypt.

Studying employment, in Egypt, using the conceptual framework of the information age is rarely being done.

Previous research has analyzed the consequence of network stability; however, little is known about how partner type diversity influence network stability in R&D network. Based on knowledge-based view and social network theory, the purpose of this paper is to unravel the internal mechanisms between partner type diversity and network stability through the mediating role of knowledge recombination in R&D network.

The authors collected an unbalanced panel patent data set from information communication technology industry for the period 1994–2016. Then, the authors tested the different dimensions of partner type variety and its relevance in the R&D network and the mediating role of knowledge recombination through adopting the multiple linear regression.

Results indicate an inverted U-shaped relationship between partner type diversity (variety and relevance) and network stability, whereas knowledge recombination partially mediate these relationships.

From the perspective of R&D networks, this paper explores that there are the under-researched phenomena the antecedent of network stability through nodal attributes (i.e. partner type variety and partner type relevance). Moreover, this paper empirically examined the mediating role of knowledge recombination in the partner type diversity–network stability relationships. The novel perspective allows focal firm to recognize importance of nodal attributes, which are critical to fully excavate the potential capabilities of cooperating partners in R&D network.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.

This examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.

The utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.

This study aims to characterize the mechanical properties of sintered nano-silver under various sintering processes by nano-indentation tests.

Through microstructure observations and characterization, the influences of sintering process on the microstructure evolutions of sintered nano-silver were presented. And, the indentation load, indentation displacement curves of sintered silver under various sintering processes were measured by using nano-indentation test. Based on the nano-indentation test, a reverse analysis of the finite element calculation was used to determine the yielding stress and hardening exponent.

The porosity decreases with the increase of the sintering temperature, while the average particle size of sintered nano-silver increases with the increase of sintering temperature and sintering time. In addition, the porosity reduced from 34.88%, 30.52%, to 25.04% if the ramp rate was decreased from 25°C/min, 15°C/min, to 5°C/min, respectively. The particle size appears more frequently within 1 µm and 2 µm under the lower ramp rate. With reverse analysis, the strain hardening exponent gradually heightened with the increase of temperature, while the yielding stress value decreased significantly with the increase of temperature. When the sintering time increased, the strain hardening exponent increased slightly.

The mechanical properties of sintered nano-silver under different sintering processes are clearly understood.

This paper could provide a novel perspective on understanding the sintering process effects on the mechanical properties of sintered nano-silver.