Search results

As it is known, the electrostatic discharge (ESD) protection design of integrated circuit is very important, among which the silicon controlled rectifier (SCR) is one of the most commonly used ESD protection devices. However, the traditional SCR has the disadvantages of too high trigger voltage, too low holding voltage after the snapback and longer turn-on time. The purpose of this paper is to design a high-performance SCR in accordance with the design window under 0.25 µm process, and provide a new scheme for SCR design to reduce the trigger voltage, improve the holding voltage and reduce the turn-on time.

Based on the traditional SCR, an RC-INV trigger circuit is introduced. Through theoretical analysis, TCAD simulation and tape-out verification, it is shown that RC-INV triggering SCR can reduce the trigger voltage, increase the holding voltage and reduce the turn-on time of the device on the premise of maintaining good robustness.

The RC-INV triggering SCR has great performance, and the test shows that the transmission line pulse curve with almost no snapback can be obtained. Compared with the traditional SCR, the trigger voltage decreased from 32.39 to 16.24 V, the holding voltage increased from 3.12 to 14.18 V and the turn-on time decreased from 29.6 to 16.6 ns, decreasing by 43.9% the level of human body model reached 18 kV+.

Under 0.25 µm BCD process, this study propose a high-performance RC-INV triggering SCR ESD protection device. The work presented in this paper has a certain guiding significance for the design of SCR ESD protection devices.

Laser soldering has attracted attention as an alternative soldering process for microsoldering due to its localized and noncontact heating, a rapid rise and fall in temperature, fluxless and easy automation compared to reflow soldering.

In this study, the metallurgical and mechanical properties of the Sn3.0Ag0.5Cu/Ni-P joints after laser and reflow soldering and isothermal aging were compared and analyzed.

In the as-soldered Sn3.0Ag0.5Cu/Ni-P joints, a small granular and loose (Cu,Ni)6Sn5 intermetallic compound (IMC) structure was formed by laser soldering regardless of the laser energy, and a long and needlelike (Cu,Ni)6Sn5 IMC structure was generated by reflow soldering. During aging at 150°C, the growth rate of the IMC layer was faster by laser soldering than by reflow soldering. The shear strength of as-soldered joints for reflow soldering was similar to that of laser soldering with 7.5 mJ, which sharply decreased from 0 to 100 h for both cases and then was maintained at a similar level with increasing aging time.

Laser soldering with certain energy is effective for reducing the thickness of IMCs, and ensuring the mechanical property of the joints was similar to reflow soldering.

The purpose of this paper is to find a closed relation for the phase noise of LC oscillators.

The governing equation of oscillators is generally a stochastic nonlinear differential equation. In this paper, a closed relation for the phase noise of LC oscillators was obtained by approximating the I–V characteristic of the oscillator with third-degree polynomials and analyzing its differential equation.

This relation expresses phase noise directly in terms of circuit parameters, including the sizes of the transistors and the bias. Next, for evaluation, the phase noise of the cross-coupled oscillator without tail current was calculated with the proposed model. In this approach, the obtained equations are expressed independently of technology by combining the obtained phase noise relation and g_m/I_D method.

A technology-independent method using the g_m/I_D method and the closed relationship is provided to calculate phase noise.

This paper aims to find a closed-form expression for the frequency and amplitude of single-ended ring oscillators when transistors experience all regions.

In this paper, the analytical relationships presented for ring oscillator amplitude and frequency are approximately derived due to the nonlinear nature of this oscillator, taking into account the differential equation that governs the ring oscillator and its output waveform.

In the case where the transistors experience the cut-off region, the relationships presented so far have no connection between the frequency and the dimensions of the transistor, which is not valid in practice. The relationship is presented for the frequency, including the dimensions of the transistor. Also, a simple and approximately accurate relationship for the oscillator amplitude is provided in this case.

The validity of these relationships has been investigated by analyzing and simulating a single-ended oscillator in 0.18 µm technology.

The purpose of this study is to numerically investigate the geometric influence of different corrugation profiles (rectangular, trapezoidal and triangular) of varying heights on the flow and the natural convection heat transfer process over isothermal plates.

This work is an extension and finalization of previous studies of the leading author. The numerical methodology was proposed and experimentally validated in previous studies. Using OpenFOAM® and other free and open-source numerical-computational tools, three-dimensional numerical models were built to simulate the flow and the natural convection heat transfer process over isothermal corrugation plates with variable and constant heights.

The influence of different geometric arrangements of corrugated plates on the flow and natural convection heat transfer over isothermal plates is investigated. The influence of the height ratio parameter, as well as the resulting concave and convex profiles, on the parameters average Nusselt number, corrected average Nusselt number and convective thermal efficiency gain, is analyzed. It is shown that the total convective heat transfer and the convective thermal efficiency gain increase with the increase of the height ratio. The numerical results confirm previous findings about the predominant effects on the predominant impact of increasing the heat transfer area on the thermal efficiency gain in corrugated surfaces, in contrast to the adverse effects caused on the flow. In corrugations with heights resulting in concave profiles, the geometry with triangular corrugations presented the highest total convection heat transfer, followed by trapezoidal and rectangular. For arrangements with the same area, it was demonstrated that corrugations of constant and variable height are approximately equivalent in terms of natural convection heat transfer.

The results allowed a better understanding of the flow characteristics and the natural convection heat transfer process over isothermal plates with corrugations of variable height. The advantages of the surfaces studied in terms of increasing convective thermal efficiency were demonstrated, with the potential to be used in cooling systems exclusively by natural convection (or with reduced dependence on forced convection cooling systems), including in technological applications of microelectronics, robotics, internet of things (IoT), artificial intelligence, information technology, industry 4.0, etc.

To the best of the authors’ knowledge, the results presented are new in the scientific literature. Unlike previous studies conducted by the leading author, this analysis specifically analyzed the natural convection phenomenon over plates with variable-height corrugations. The obtained results will contribute to projects to improve and optimize natural convection cooling systems.

This study comprehensively examines entropy generation and thermosolutal performance of a ternary hybrid nanofluid in a partially active porous cabinet. The purpose of this study is to comprehend the intricate phenomena of double diffusion by investigating the dispersion behavior of Al₂O₃, CuO, and Ag nanoparticles in water.

The cabinet design consists of two horizontal walls and two curved walls with the lower border divided into a heated and concentrated region of length b and the remaining sections are adiabatic. The vertical borders are cold and low concentration, while the upper border is adiabatic. Two cavity configurations such as convex and concave are considered. A uniform porous medium is taken within the ternary hybrid nanofluid. This has been characterized by the Brinkman-extended Darcy model. Thermosolutal phenomena are governed by the Navier-Stokes equations and are solved by adopting a higher-order compact scheme.

The present study focuses on exploring the influence of several well-defined parameters, including Rayleigh number, Darcy number, Lewis number, Buoyancy ratio number, nanoparticle volume concentration and heater size. The results indicate that the ternary hybrid nanofluid outperforms both the mono and hybrid nanofluids in all considered aspects.

This study brings forth a significant contribution by uncovering novel flow features that have previously remained unexplored. By addressing a well-defined problem, the work provides valuable insights into the enhancement of thermal transport, with direct implications for diverse engineering devices such as solar collectors, heat exchangers and microelectronics.

By investigating the thermal-mechanical interaction between the through silicon via (TSV) and the Cu pad, this study aimed to determine the effect of electroplating defects on the upper surface protrusion and internal stress distribution of the TSV at various temperatures and to provide guidelines for the positioning of TSVs and the optimization of the electroplating process.

A simplified model that consisted of a TSV (100 µm in diameter and 300 µm in height), a covering Cu pad (2 µm thick) and an internal drop-like electroplating defect (which had various dimensions and locations) was developed. The surface overall deformation and stress distribution of these models under various thermal conditions were analyzed and compared.

The Cu pad could barely suppress the upper surface protrusion of the TSV if the temperature was below 250 ?. Interfacial delamination started at the collar of the TSV at about 250 ? and became increasingly pronounced at higher temperatures. The electroplating defect constantly experienced the highest level of strain and stress during the temperature increase, despite its geometry or location. But as its radius expanded or its distance to the upper surface increased, the overall deformation of the upper surface and the stress concentration at the collar of the TSV showed a downward trend.

Previous studies have not examined the influence of the electroplating void on the thermal behavior of the TSV. However, with the proposed methodology, the strain and stress distribution of the TSV under different conditions in terms of temperature, dimension and location of the electroplating void were thoroughly investigated, which might be beneficial to the positioning of TSVs and the optimization of the electroplating process.

Solder bumps for chip interconnections are downsizing from current approximately 100 µm to the expected 1 µm in future. As a result, the Cu-Ni cross-interaction in Cu/Solder/Ni solder joints will be more complicated and then strongly influence the growth of the intermetallic compounds (IMCs). Thus, it is critical to understand the fundamental aspects of interfacial reaction in micro solder joints. This paper aims to reveal the effect mechanism of reflow temperature and solder size on the interfacial reaction in Cu/Solder/Ni solder joints.

The Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints with 50 and 100 µm solder sizes at 250°C and 300°C were observed, respectively. The line-type interconnects were soaked in silicone oil, and the temperature of the line-type interconnects was 250 ± 3°C and 300 ± 3°C, which were monitored by a fine K-type thermocouple, and followed by an isothermal aging process at various times. After aging, the specimens were removed from the silicone oil and cooled in the air to room temperature.

The major interfacial reaction product on both interfaces was (Cu,Ni)₆Sn₅, and the asymmetric growth of (Cu,Ni)₆Sn₅, evidenced by the thickness of (Cu,Ni)₆Sn₅ IMCs at the Sn/Ni interface was always larger than that at the Sn/Cu interface, resulted from the directional migration of Cu atoms toward the Sn/Ni interface under Cu concentration gradient. The morphology of (Cu,Ni)₆Sn₅ IMC at Sn/Cu interface was columnlike at 250°C, and which changed from columnlike to scallop with large aspect ratio at 300°C, while that at Sn/Ni interface gradually evolved from needlelike to the mixture of needlelike and layered at 250°C, and which evolved from needlelike to scallop with large aspect ratio at 300°C. The evolution of morphology of (Cu,Ni)₆Sn₅ is attributed to the content of Ni. Furthermore, the results indicate that the Cu-Ni cross-interaction was stronger with small solder size and relatively low temperature in the Cu/Sn/Ni micro solder joints.

The asymmetric growth of (Cu,Ni)₆Sn₅ in the Cu/Sn/Ni micro solder joints, evidenced by the thickness of (Cu,Ni)₆Sn₅ IMCs at the Sn/Ni interface, was always larger than that at the Sn/Cu interface. The morphology evolution of (Cu,Ni)₆Sn₅ IMC at both interfaces was attributed to the content of Ni. The Cu-Ni cross-interaction was stronger with small solder size and relatively low temperature in the Cu/Sn/Ni micro solder joints.

This study aims to simulate molded printed circuit board (PCB) warpage behavior under reflow temperature distribution. Simulation models are used to estimate dynamic warpage behavior for different form factor sizes.

This study analyzes warpage during the reflow process. The shadow moiré experiment methodology is used to collect data on the dynamic warpage performance of a model with a form factor of 10mm × 10mm × 1mm. The temperature profile with heating from 25°C to 300°C at intervals of 50°C is used, and the sample is made to undergo a cooling process until it reaches the room temperature. Subsequently, ANSYS static structural simulation is performed on similar form factor models to ascertain the accuracy of the simulation results.

Results show that the deformation and total force induced by coefficient of thermal expansion (CTE) mismatch are examined based on the warpage performance of models with different sizes, that is, 45mm × 45mm × 1mm and 45mm × 15mm × 1mm. Compared with the experimental data, the simulated modeling accuracy yields a less than 5% deviation in the dynamic warpage prediction at a reflow temperature of 300°C. Results also reveal that the larger the model, the larger the warpage changes under the reflow temperature.

The simulated warpage is limited to the temperature and force induced by CTE mismatch between two materials. The form factor of the ball-grid array model is limited to only three different sizes. The model is assumed to be steady, isothermal and static. The simulation adopts homogenous materials, as it cannot accurately model nonhomogeneous multilayered composite materials.

This study can provide engineers and researchers with a profound understanding of molded PCB warpage, minimal resource utilization and the improved product development process.

The accurate prediction of molded PCB warpage can enable efficient product development and reduce resources and production time, thereby creating a sustainable environment.

The literature review points out that warpage in various types of PCBs was successfully examined, and that considerable efforts were exerted to investigate warpage reduction in PCB modules. However, PCB warpage studies are limited to bare PCBs. To the best of the authors’ knowledge, the examination of warpage in a molded PCB designed with a molded compound cover, as depicted in Figure 3, is yet to be conducted. A molded compound provides strong lattice support for PCBs to prevent deformation during the reflow process, which is a topic of considerable interest and should be explored.

The hygroscopic properties of 3D-printed filaments and moisture absorption itself during the process result in dimensional inaccuracy, particularly for nozzle movement along the x-axis and for micro-scale features. In view of that, this study aims to analyze in depth the dimensional errors and deviations of the fused filament fabrication (FFF)/fused deposition modeling (FDM) 3D-printed micropillars (MPs) from the reference values. A detailed analysis into the variability in printed dimensions below 1 mm in width without any deformations in the printed shape of the designed features, for challenging filaments like polymethyl methacrylate (PMMA) has been done. The study also explores whether the printed shape retains the designed structure.

A reference model for MPs of width 800 µm and height 2,000 µm is selected to generate a g-code model after pre-processing of slicing and meshing parameters for 3D printing of micro-scale structure with defined boundaries. Three SETs, SET-A, SET-B and SET-C, for nozzle diameter of 0.2 mm, 0.25 mm and 0.3 mm, respectively, have been prepared. The SETs containing the MPs were fabricated with the spacing (S) of 2,000 µm, 3,200 µm and 4,000 µm along the print head x-axis. The MPs were measured by taking three consecutive measurements (top, bottom and middle) for the width and one for the height.

The prominent highlight of this study is the successful FFF/FDM 3D printing of thin features (<1mm) without any deformation. The mathematical analysis of the variance of the optical microscopy measurements concluded that printed dimensions for micropillar widths did not vary significantly, retaining more than 65% of the recording within the first standard deviation (SD) (±1 s). The minimum value of SD is obtained from the samples of SET-B, that is, 31.96 µm and 35.865 µm, for height and width, respectively. The %RE for SET-B samples is 5.09% for S = 2,000µm, 3.86% for S = 3,200µm and 1.09% for S = 4,000µm. The error percentage is so small that it could be easily compensated by redesigning.

The study does not cover other 3D printing techniques of additive manufacturing like stereolithography, digital light processing and material jetting.

The presented study can be potentially implemented for the rapid prototyping of microfluidics mixer, bioseparator and lab-on-chip devices, both for membrane-free bioseparation based on microfiltration, plasma extraction from whole blood, size-selection trapping of unwanted blood cells, and also for membrane-based plasma extraction that requires supporting microstructures. Our developed process may prove to be far more economical than the other existing techniques for such applications.

For the first time, this work presents a comprehensive analysis of the fabrication of micropillars using FDM/FFF 3D printing and PMMA in filament form. The primary focus of the study is to minimize the dimensional inaccuracies in the 3D printed devices containing thin features, especially in the area of biomedical engineering, by delivering benefits from the choice of the parameters. Thus, on the basis of errors and deviations, a thorough comparison of the three SETs of the fabricated micropillars has been done.