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The purpose of this paper is to explore concepts and manufacturing issues for the emerging piezo on silicon technology being used in ultra‐sound devices. Development of 3D silicon‐on‐silicon structures is now under way. Additional functionality can be achieved using piezoelectric‐on‐silicon structures and work in this area has started. A commercialisation road map is required, specifying development of the design and fabrication techniques from research to high volume and lower volume high‐value manufacture of niche products.

This conceptual paper outlines processes needed, along with their possible sources with illustrations of present capabilities. Included are surface finishing techniques such as grinding, bonding technology for dissimilar materials, and through‐wafer‐via fabrication. Control of acoustic propagation, thermal expansion and electric field fringing effects will be considered.

Areas that require research and development are identified with possible starting points using techniques already used in other applications. Strong emphasis on empirical research highlights possible issues with examples including surface finishing and wafer dicing to show current methods.

Archetypal pixellated piezoelectric‐on‐silicon structures highlight critical points. In the authors' work, such pixellated structures occur in 1‐3 connectivity piezoelectric ceramic‐polymer composites with unit cell length scales from several millimetres, manufactured with mechanical dicing, to less than 50 μm, manufactured with micro‐moulding.

A forward looking approach of “thinking freely” is taken, this opens up potential manufacturing routes and ideas precluded from an iterative approach.

The conclusion suggests the criteria for a “design for” approach linked to either bottom up or top down assembly techniques for the integration of conventional and unusual piezoelectric materials with silicon in 3D structures.

This paper aims to design, optimize and simulate the Radio Frequency (RF) micro electromechanical system (MEMS) Switch which is stimulated by electrostatically voltage.

The geometric structure of the switch was extracted based on the design of Taguchi-based experiment using the mathematical programming and obtaining objective function by the genetic meta-heuristic algorithm.

The RF parameters of the switch were calculated for the design of Taguchi-based S11 = −5.649 dB and S21 = −46.428 dB at the working frequency of 40 GHz. The pull-in voltage of the switch was 2.8 V and the axial residual stress of the proposed design was obtained 28 MPa and the design of Taguchi-based S11 = −4.422 dB and S21 = −48.705dB at the working frequency of 40 GHz. The pull-in voltage of the switch was 2.5 V and the axial residual stress of the proposed design was obtained 25 MPa.

A novel complex strategy in the design and optimization of capacitive RF switch MEMS modeling is proposed.

The purpose of this paper is to provide a review of recent progress into the development of biomimetic adhesives, particularly those that mimic the attachment mechanism of the gecko lizard's foot.

This paper first discusses the discovery of the gecko's adhesion mechanism. It then describes key “gecko glue” developments and summarises the properties of experimental adhesives that exploit this effect. It concludes with a consideration of anticipated applications.

This paper shows that, following the discovery of the gecko's adhesion mechanism in 2002, which is based on van der Waals forces, biomimetic adhesives have become the topic of a major research effort. These developments are poised to yield families of novel adhesive materials with superior properties which are likely to find uses in industries ranging from defence and nanotechnology to healthcare and sport.

The paper provides a unique insight into the latest developments in biomimetic adhesive technology.

This paper aims to provide an insight into recent innovations in adhesive technology by considering a selection of commercial developments and academic research activities.

Following an introduction, this paper first discusses a selection of commercially developed adhesives used in the healthcare, photovoltaics and aerospace industries. It then considers biomimetic adhesive research, specifically dry adhesives which mimic the principles of gecko adhesion and wet adhesives based on the chemistry which underpins mussel adhesion. Finally, brief concluding comments are drawn.

This shows that new adhesives continue to be developed to meet a growing range of industrial requirements, and a major research effort into biologically inspired adhesion mechanisms is poised to yield new families of high-performance adhesives.

This provides details of recent commercial and academic developments in adhesive technology.

Material formulation, structuring and modification are key to increasing the unit volume complexity and density of next generation electronic packaging products. Laser processing is finding an increasing number of applications in the fabrication of these advanced microelectronic devices. The purpose of this paper is to discuss the development of new laser‐processing capabilities involving the synthesis and optimization of materials for tunable device applications.

The paper focuses on the application of laser processing to two specific material areas, namely thin films and nanocomposite films. The examples include BaTiO₃‐based thin films and BaTiO₃ polymer‐based nanocomposites.

A variety of new regular and random 3D surface patterns are highlighted. A frequency‐tripled Nd:YAG laser operating at a wavelength of 355 nm is used for the micromachining study. The micromachining is used to make various patterned surface morphologies. Depending on the laser fluence used, one can form a “wavy,” random 3D structure, or an array of regular 3D patterns. Furthermore, the laser was used to generate free‐standing nano and micro particles from thin film surfaces. In the case of BaTiO₃ polymer‐based nanocomposites, micromachining is used to generate arrays of variable‐thickness capacitors. The resultant thickness of the capacitors depends on the number of laser pulses applied. Micromachining is also used to make long, deep, multiple channels in capacitance layers. When these channels are filled with metal, the spacings between two metallized channels acted as individual vertical capacitors, and parallel connection eventually produce vertical multilayer capacitors. For a given volume of capacitor material, theoretical capacitance calculations are made for variable channel widths and spacings. For comparison, calculations are also made for a “normal” capacitor, that is, a horizontal capacitor having a single pair of electrodes.

This technique can be used to prepare capacitors of various thicknesses from the same capacitance layer, and ultimately can produce variable capacitance density, or a library of capacitors. The process is also capable of making vertical 3D multilayer embedded capacitors from a single capacitance layer. The capacitance benefit of the vertical multilayer capacitors is more pronounced for thicker capacitance layers. The application of a laser processing approach can greatly enhance the utility and optimization of new materials and the devices formed from them.

Laser micromaching technology is developed to fabricate several new structures. It is possible to synthesize nano and micro particles from thin film surfaces. Laser micromachining can produce a variety of random, as well as regular, 3D patterns. As the demand grows for complex multifunctional embedded components for advanced organic packaging, laser micromachining will continue to provide unique opportunities.

There has been increasing interest in the development of printable electronics to meet the growing demand for low‐cost, large‐area, miniaturized, flexible and lightweight devices. The purpose of this paper is to discuss the electronic applications of novel printable materials.

The paper addresses the utilization of polymer nanocomposites as it relates to printable and flexible technology for electronic packaging. Printable technology such as screen‐printing, ink‐jet printing, and microcontact printing provides a fully additive, non‐contacting deposition method that is suitable for flexible production.

A variety of printable nanomaterials for electronic packaging have been developed. This includes nanocapacitors and resistors as embedded passives, nanolaser materials, optical materials, etc. Materials can provide high‐capacitance densities, ranging from 5 to 25 nF/in², depending on composition, particle size, and film thickness. The electrical properties of capacitors fabricated from BaTiO₃‐epoxy nanocomposites showed a stable dielectric constant and low loss over a frequency range from 1 to 1,000 MHz. A variety of printable discrete resistors with different sheet resistances, ranging from ohm to Mohm, processed on large panels (19.5×24 inches) have been fabricated. Low‐resistivity materials, with volume resistivity in the range of 10⁻⁴‐10⁻⁶ ohm cm, depending on composition, particle size, and loading, can be used as conductive joints for high‐frequency and high‐density interconnect applications. Thermosetting polymers modified with ceramics or organics can produce low k and lower loss dielectrics. Reliability of the materials was ascertained by (Infrared; IR‐reflow), thermal cycling, pressure cooker test (PCT) and solder shock testing. The change in capacitance after 3× IR‐reflow and after 1,000 cycles of deep thermal cycling between −55°C and +125°C was within 5 per cent. Most of the materials in the test vehicle were stable after IR‐reflow, PCT, and solder shock.

The electronic applications of printable, high‐performance nanocomposite materials such as adhesives (both conductive and non‐conductive), interlayer dielectrics (low‐k, low‐loss dielectrics), embedded passives (capacitors and resistors), and circuits, etc.. are discussed. Also addressed are investigations of printable optically/magnetically active nanocomposite and polymeric materials for fabrication of devices such as inductors, embedded lasers, and optical interconnects.

A thin film printable technology was developed to manufacture large‐area microelectronics with embedded passives, Z‐interconnects and optical waveguides, etc. The overall approach lends itself to package miniaturization because multiple materials and devices can be printed in the same layer to increase functionality.

Low temperature co‐fired ceramics (LTCC) material is introduced as an excellent alternative to silicon, glass, or plastic materials for the fabrication of miniaturised analytical devices, though it is most widely used in the automotive and microwave industries. The paper aims to study the laser ablation of LTCC material.

This kind of green tape material is mechanised by excimer laser (KrF, 248 nm) and UV laser (Nd: YAG, 355 nm), and for the first time by infra‐red laser (1,090 nm). The optical photos and the scanning electronic microscope (SEM) photos of the LTCC ablated by different kinds of laser sources are given in this paper.

When using the UV laser, the tapered structure can be easily seen from the SEM photo. However, a kind of clear and perfect ablation of LTCC can be seen for the first time by the 1,090 nm infra‐red laser ablation.

The laser ablation of LTCC by optical fibre sources is discussed.

This paper aims to provide details of recently reported work on the use of nanomaterials in sensors for physical variables.

Following a short introduction, this paper first discusses research involving the use of a range of nanomaterials for strain sensing. It then considers the applications of these materials to sensors for pressure, force, touch and allied variables. It concludes with a brief discussion and 33 references.

This paper shows that nanomaterials such as carbon nanotubes, graphene, metallic nanoparticles and nanowires are being studied extensively in the physical-sensing context. All manner of sensors have been developed, based on a diversity of principles and technologies, and many offer excellent performance and unique capabilities, making them particularly well-suited to emerging applications such as wearable sensing devices.

This paper provides a detailed and timely review of the rapidly growing body of research into the use of nanomaterials for sensing physical quantities.

The purpose of this paper was to study the influence of properties of printed circuit boards (PCBs) on the temperature during micro drilling and obtain the influential mechanism of PCBs based on temperature measurement.

Experiments were carried out to study the influence mechanism of PCB properties on micro hole drilling temperature under high spindle speed. The temperature measurement platform was applied, then the influence of components ratio of PCBs on the temperature of micro-drilling was analyzed by using comparative analysis method. The mass ratio of each kind of material in the PCB was defined as four levels and the influence mechanism of properties of PCBs based on temperature measurement was summarized.

Average filler and lower resin would have a positive impact on micro hole drilling temperature, and the smaller filler size and the even distribution would make it better.

An infrared temperature measurement platform was applied and influential mechanism of PCB properties on temperature was analyzed, which could provide the reference value on the optimization of temperature during micro drilling.

The purpose of this paper is to present a method for ultrasonically molding polymer powder in a micro plastic part mold. In the method, a printed circuit board (PCB) in which micro‐hole arrays are drilled is used as a micro cavity insert. With the utilization of ultrasonic vibration, the polymer powder, which is prefilled and compacted in a micro cavity, mutually generates great sliding friction heat so as to be rapidly plasticized and molded.

Micro carbide drill bits of which the diameters are 100.0 μm, 150.0 μm and 200.0 μm, respectively, are used for drilling the PCB to form a micro‐hole array insert. Next, two kinds of various ultra‐high molecule weight polyethylene (UHMW‐PE) powder with various grain diameters are directly filled into a charging barrel and a mold cavity with the micro‐hole array insert. Proper process parameters are set on ultrasonic plasticizing and molding equipment so that a molding test can be performed. The melt of UHMW‐PE can be rapidly filled into the cavity. Finally, micro‐column array plastic parts are successfully prepared.

The micro‐hole array PCB is a mold insert which is quite applicable for the ultrasonic molding of the powder in the mold. When a molding material is the coarse UHMW‐PE powder with the grain diameter of about 350 μm, the diameter replication rates of the micro‐column array plastic parts become good in order with the increased micro‐hole diameter of the PCB. When the fine UHMW‐PE powder with the grain diameter of about 80 μm is adopted, the diameter replication rates of the micro‐column array plastic parts become good in order with the decreased micro‐hole diameter of the PCB.

In this paper, the micro‐column array plastic parts with good replicability are successfully prepared by a technique for ultrasonically plasticizing and molding in the cavity. The technique can be applied to the fields of medical treatment, communication, optics, chemistry and so on, such as biological micro needle arrays, micro biological chips, optical memories, and micro chemical reaction chips.