Search results

The purpose of this paper is to present a method for ultrasonically molding polymer powder in a micro plastic part mold. In the method, a printed circuit board (PCB) in which micro‐hole arrays are drilled is used as a micro cavity insert. With the utilization of ultrasonic vibration, the polymer powder, which is prefilled and compacted in a micro cavity, mutually generates great sliding friction heat so as to be rapidly plasticized and molded.

Micro carbide drill bits of which the diameters are 100.0 μm, 150.0 μm and 200.0 μm, respectively, are used for drilling the PCB to form a micro‐hole array insert. Next, two kinds of various ultra‐high molecule weight polyethylene (UHMW‐PE) powder with various grain diameters are directly filled into a charging barrel and a mold cavity with the micro‐hole array insert. Proper process parameters are set on ultrasonic plasticizing and molding equipment so that a molding test can be performed. The melt of UHMW‐PE can be rapidly filled into the cavity. Finally, micro‐column array plastic parts are successfully prepared.

The micro‐hole array PCB is a mold insert which is quite applicable for the ultrasonic molding of the powder in the mold. When a molding material is the coarse UHMW‐PE powder with the grain diameter of about 350 μm, the diameter replication rates of the micro‐column array plastic parts become good in order with the increased micro‐hole diameter of the PCB. When the fine UHMW‐PE powder with the grain diameter of about 80 μm is adopted, the diameter replication rates of the micro‐column array plastic parts become good in order with the decreased micro‐hole diameter of the PCB.

In this paper, the micro‐column array plastic parts with good replicability are successfully prepared by a technique for ultrasonically plasticizing and molding in the cavity. The technique can be applied to the fields of medical treatment, communication, optics, chemistry and so on, such as biological micro needle arrays, micro biological chips, optical memories, and micro chemical reaction chips.

This paper aims to present the main factors affecting the mechanical drilling of the printed circuit board (PCB for short) micro-holes and method of micro-ultrasonic powder molding (micro-UPM for short) by utilizing PCB micro-hole array.

To optimize the drilling process, the paper proposes the on-line monitoring methods for the drilling process including drilling force, drilling temperature, high-speed photography and vibration signals. Taking 0.10 and 0.15 mm micro-drilling as examples, the paper analyzes the drilling process of ultra-small micro-holes. Finally, by taking the PCBs with 0.10 and 0.15 mm micro-hole arrays as the micro-cavity inserts, utilizing ultra-high-molecule weight polyethylene powder with the average particle size of about 150 μm as raw material, two sizes of micro-cylinder array polymer parts are fabricated through micro-UPM process.

PCB micro-cavity inserts with micro-hole arrays fabricated by mechanical drilling has the advantages of low costs, high efficiency and good consistency. Taking 0.10 and 0.15 mm micro-drilling as examples, it is found that the both measured apertures are about 10.0 μm more than the diameter of the micro-drill bits on average. The average diameter of the micro-cylinders by micro-UPM process is smaller than that of the micro-hole with the same specification, while the value of the roughness of the cylinder surface is more than that of the hole-wall surface with the same specification.

This paper describes the challenges and the developments of mechanical drilling and by using PCB micro-cavity inserts with micro-hole arrays fabricated by mechanical drilling, two different micro-cylinder array polymer parts are successfully made and thus the application area of PCB micro-drilling is broadened.

Using a patented measuring technique, the perfecTest system has the ability to give a quantified and accurate measurement down to 25 micron (one mil) for any directional X‐axis and/or Y‐axis inner‐layer shift. Individual inner layers can be distinguished from each other and reviewed in either tabular or graphic format. Control limits are set within the software to provide pass/fail testing and all testing is performed in real time. With functions such as data storage, retrieval and SPC analysis, the system is a very powerful tool to monitor and manage inner‐layer registration problems and can lead the way to improved yield and reliability instead of creating more waste. Hole break‐out is the main cause of intermittent failure in PCBs. As the result of through‐hole plating, there is conductivity along the drill‐hole barrel. PCBs having such severe registration problems will pass in‐circuit and bare‐board tests. However, intermittent failure is often not detected until the product reaches the field and is in use.

There are many advantages of microvia: it requires a much smaller pad, which saves the board size and weight; with microvia, more chips can be placed in less space or a smaller PCB, which results in a low cost; and with microvia, electrical performance improves due to a shorter pathway. Basically, there are five major processes for microvia formation: NC drilling; laser via fabrication including CO₂ laser, YAG laser, and excimer; photo‐defined vias, wet or dry; etch via fabrications including chemical (wet) etching and plasma (dry) etching; and conductive ink formed vias, wet or dry. This paper will discuss the materials and processes of these five major microvia formation methods. At the end, eight key manufacturers from Japan will be briefly illustrated for their research status and current capability of producing smallest microvia.

The purpose of this paper is to demonstrate laser microvia drilling of polyimide thin films from multiple sources before metallic sputtering. This process flow reduces Flexible Printed Circuit Board (FPCB) material, chemical and operational costs by 90 per cent in the construction of flexible circuits.

The UV laser percussion drilling of microvias in 25 μm thick polyimide films with low coefficients of thermal expansion (CTE) and elastic modulii was investigated. Results were obtained using Scanning Electron Microscopy and Surface Profilometry. Polyimide films tested included: Dupont™ Kapton^® EN; Kolon^® GP and LV; Apical^® NPI; and Taimide™ TA‐T.

There was no direct relationship between the top and bottom diameters and ablation depth rates between the polyimide films tested using the same test conditions. There was a direct relationship with exit diameters and etch rates at different laser pulse frequency rates and fluence levels. Laser pulse rates at 30 kHz produced 20 per cent larger exit diameters than at 70 kHz, however at 70 kHz the first pulse etched 16.5 per cent more material. High fluence levels etched more material but with a lower etch efficiency rate. Other microvia quality concerns such as surface swelling, membrane residues on the bottom side and surface debris inside the microvias were observed. Nanoscale powder‐like surface debris was observed on all samples in all test conditions.

This is the first comparison of material specifications and costs for films from multiple polyimide manufactures and laser microvia drilling. The paper also is the first to demonstrate results using a JDSU™ Lightwave Q302^® laser rail. The results provide the first insights into potential microvia membrane issues and debris characteristics.