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This study aims to develop an interface management risk interaction modeling and analysis methodology applicable to complex systems in high-speed rail construction projects, reveal the interaction mechanism of interface management risk and provide theoretical support for project managers to develop appropriate interface management risk response strategies.

This paper introduces the association rule mining technique to improve the complex network modeling method. Taking China as an example, based on the stakeholder perspective, the risk factors and significant accident types of interface management of high-speed rail construction projects are systematically identified, and a database is established. Then, the Apriori algorithm is used to mine and analyze the strong association rules among the factors in the database, construct the complex network, and analyze its topological characteristics to reveal the interaction mechanism of the interface management risk of high-speed rail construction projects.

The results show that the network is both scale-free and small-world, implying that construction accidents are not random events but rather the result of strong interactions between numerous interface management risks. Contractors, technical interfaces, mechanical equipment, and environmental factors are the primary direct causal factors of accidents, while owners and designers are essential indirect causal factors. The global importance of stakeholders such as owners, designers, and supervisors rises significantly after considering the indirect correlations between factors. This theoretically explains the need to consider the interactions between interface management risks.

The interaction mechanism between interface management risks is unclear, which is an essential factor influencing the decision of risk response measures. This study proposes a new methodology for analyzing interface management risk response strategies that incorporate quantitative analysis methods and considers the interaction of interface management risks.

Light emitting diode (LED) has been the best resource for commercial and industrial lighting applications. However, thermal management in high power LEDs is a major challenge in which the thermal resistance (R_th) and rise in junction temperature (T_J) are critical parameters. The purpose of this work is to evaluate the R_th and T_j of the LED attached with the modified heat transfer area of the heatsink to improve thermal management.

This paper deals with the design of metal substrate for heatsink applications where the surface area of the heatsink is modified. Numerical simulation on heat distribution proved the influence of the design aspects and surface area of heatsink.

T_J was low for outward step design when compared to flat heatsink design (ΔT ∼ 38°C) because of increase in surface area from 1,550 mm² (flat) to 3,076 mm² (outward step). On comparison with inward step geometry, the T_J value was low for outward step configuration (ΔT_J ∼ 6.6°C), which is because of efficient heat transfer mechanism with outward step design. The observed results showed that outward step design performs well for LED testing by reducing both R_th and T_J for different driving currents.

This work is authors’ own design and also has the originality for the targeted application. To the best of the authors’ knowledge, the proposed design has not been tried before in the electronic or LED applications.

The aim of this study is to present an overview of sustainable practices in the development of waterproof breathable fabrics for garments. It aims to provide insights into the current state of academic research in this domain and identify and analyze major sustainable trends in the field.

This study conducts a thorough examination of research publications sourced from the Scopus database spanning the years 2013–2023 by employing a systematic approach. The research utilizes both descriptive analysis and content analysis to identify trends, notable journals and leading countries in sustainable waterproof breathable fabric development.

The study reveals a notable increase in studies focusing on sustainable approaches in the development of waterproof breathable fabrics for garments. Descriptive analysis highlights the most prominent journal and leading country in terms of research volume. Content analysis identifies four key trends: minimizing chemical usage, developing easily degradable materials, creating fabrics promoting health and well-being and initiatives to reduce energy consumption.

The main limitation of this research lies in its exclusive reliance on the Scopus database.

The insights derived from this study offer practical guidance for prospective researchers interested in investigating sustainable approaches to developing waterproof breathable fabric for garments. The identified trends provide a foundation for aligning research endeavors with contemporary global perspectives, facilitating the integration of sustainable methodologies into the garment industry.

This systematic literature review contributes original insights by synthesizing current research trends and outlining evolving sustainable practices in the development of waterproof breathable fabrics. The identification of key focus areas adds a novel perspective to existing knowledge.

Polyurethane concrete (PUC), as a new type of steel bridge deck paving material, the bond-slip pattern at the interface with the steel plate is not yet clear. In this study, the mechanical properties of the PUC and steel plate interface under the coupled action of temperature, normal force and tangential force were explored through shear tests and numerical simulations. An analytical model for bond-slip at the PUC/steel plate interface and a predictive model for the shear strength of the PUC/steel plate interface were developed.

The new shear test device designed in this paper overcomes the defect that the traditional oblique shear test cannot test the interface shear performance under the condition of fixed normal force. The universal testing machine (UTM) test machine was used to adjust the test temperature conditions. Combined with the results of the bond-slip test, the finite element simulation of the interface is completed by using the COHENSIVE unit to analyze the local stress distribution characteristics of the interface. The use of variance-based uncertainty analysis guaranteed the validity of the simulation.

The shear strength (τ_f) at the PUC-plate interface was negatively correlated with temperature while it was positively correlated with normal stress. The effect of temperature on the shear properties was more significant than that of normal stress. The slip corresponding to the maximum shear (D₁) positively correlates with both temperature and normal stress. The interfacial shear ductility improves with increasing temperature.

Based on the PUC bond-slip measured curves, the relationship between bond stress and slip at different stages was analyzed, and the bond-slip analytical model at different stages was established; the model was defined by key parameters such as elastic ultimate shear stress τ₀, peak stress τ_f and interface fracture energy G_f.

The purpose of this paper is to compile a comprehensive status report on pipes/piping networks across different industrial sectors, along with specifications of materials and sizes, and showcase welding avenues. It further extends to highlight the promising friction stir welding as a single solid-state pipe welding procedure. This paper will enable all piping, welding and friction stir welding stakeholders to identify scope for their engagement in a single window.

The paper is a review paper, and it is mainly structured around sections on materials, sizes and standards for pipes in different sectors and the current welding practice for joining pipe and pipe connections; on the process and principle of friction stir welding (FSW) for pipes; identification of main welding process parameters for the FSW of pipes; effects of process parameters; and a well-carved-out concluding summary.

A well-carved-out concluding summary of extracts from thoroughly studied research is presented in a structured way in which the avenues for the engagement of FSW are identified.

The implications of the research are far-reaching. The FSW is currently expanding very fast in the welding of flat surfaces and has evolved into a vast number of variants because of its advantages and versatility. The application of FSW is coming up late but catching up fast, and as a late starter, the outcomes of such a review paper may support stake holders to expand the application of this process from pipe welding to pipe manufacturing, cladding and other high-end applications. Because the process is inherently inclined towards automation, its throughput rate is high and it does not need any consumables, the ultimate benefit can be passed on to the industry in terms of financial gains.

To the best of the authors’ knowledge, this is the only review exclusively for the friction stir welding of pipes with a well-organized piping specification detailed about industrial sectors. The current pipe welding practice in each sector has been presented, and the avenues for engaging FSW have been highlighted. The FSW pipe process parameters are characteristically distinguished from the conventional FSW, and the effects of the process parameters have been presented. The summary is concise yet comprehensive and organized in a structured manner.

Polymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested and reported. The purpose of this paper is suggesting thin film-based TIM to sustain the light-emiting diode (LED) performance and electronic device miniaturization.

Consequently, ZnO thin film at various thicknesses was prepared by chemical vapour deposition (CVD) method and tested their thermal behaviour using thermal transient analysis as solid TIM for high-power LED.

Low value in total thermal resistance (R_th-tot) was observed for ZnO thin film boundary condition than bare Al boundary condition. The measured interface (ZnO thin film) resistance {(R_th-bhs) thermal resistance of the interface layer (thin film) placed between metal core printed circuit board (MCPCB) board and Al substrates} was nearly equal to Ag paste boundary condition and showed low values for ZnO film prepared at 30 min process time measured at 700 mA. The T_J value of LED mounted on ZnO thin film (prepared at 30 min.) coated Al substrates was measured to be 74.8°C. High value in junction temperature difference (ΔT_J) of about 4.7°C was noticed with 30 min processed ZnO thin film when compared with Al boundary condition. Low correlated colour temperature and high luminous flux values of tested LED were also observed with ZnO thin film boundary condition (processed at 30 min) compared with both Al substrate and Ag paste boundary condition.

Overall, 30 min CVD processed ZnO thin film would be an alternative for commercial TIM to achieve efficient thermal management. This will increase the life span of the LED as the proposed material decreases the T_J values.

The paper aims to clarify the distribution of excess pore pressure during cone penetration in two-layered clay and its influence on penetrometer resistance.

An arbitrary Lagrangian–Eulerian scheme is adopted to preserve the quality of mesh throughout the numerical simulation. Simplified methods of layered penetration and coupled pore pressure analysis of cone penetration have been proposed and verified by previous studies. The investigation is then extended by the present work to study the cone penetration test in a two-layered clay profile assumed to be homogeneous with the modified Cam clay model.

The reduction of the range of pore pressure with decreasing PF will cause a decrease of the sensing distance. The PF of the underlying soil is one of the factors that determine the development distance. The interface can be obtained by taking the position of the maximum curvature of the penetrometer resistance curve in the case of stiff clay overlying soft clay. In the case of soft clay overlying stiff clay, the interface locates at the maximum curvature of the penetrometer resistance curve above about 1.6D.

The cone penetration analyses in this paper are conducted assuming smooth soil-cone contact.

A simplified method based on ALE in Abaqus/Explicit is proposed for layered penetration, which solves the problem of mesh distortion at the interface between two materials. The stiffness equivalent method is also proposed to couple pore pressure during cone penetration, which achieves efficient coupling of pore water pressure in large deformations.

The purpose of this article is to prepare graphene/polyimide composite materials for use as bearing cage materials, improving the friction and wear performance of bearing cages.

The oil absorption and discharge tests were conducted to evaluate the oil content properties of the materials, while the mechanical properties were analyzed through cross-sectional morphology examination. Investigation into the tribological behavior and wear mechanisms encompassed characterization and analysis of wear trace morphology in PPI-based materials. Consequently, the influence of varied graphene nanoplatelets (GN) concentrations on the oil content, mechanical and tribological properties of PPI-based materials was elucidated.

The composites exhibit excellent oil-containing properties due to the increased porosity of PPI-GN composites. The robust formation of covalent bonds between GN and PPI amplifies the adhesive potency of the PPI-GN composites, thereby inducing a substantial enhancement in impact strength. Notably, the PPI-GN composites showed enhanced lubrication properties compared to PPI, which was particularly evident at a GN content of 0.5 Wt.%, as evidenced by the minimization of the average coefficient of friction and the width of the abrasion marks.

This paper includes implications for elucidating the wear mechanism of the polyimide composites under frictional wear conditions and then to guide the optimization of oil content and tribological properties of polyimide bearing cage materials.

In this paper, homogeneously dispersed PPI-GN composites were effectively synthesized by introducing GN into a polyimide matrix through in situ polymerization, and the lubrication mechanism of the PPI composites was compared with that of the PPI-GN composites to illustrate the composites’ superiority.

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-12-2023-0415

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

This review provides an overview of recent advances in electrochemical sensors for analyte detection in saliva, highlighting their potential applications in diagnostics and health care. The purpose of this paper is to summarize the current state of the field, identify challenges and limitations and discuss future prospects for the development of saliva-based electrochemical sensors.

The paper reviews relevant literature and research articles to examine the latest developments in electrochemical sensing technologies for saliva analysis. It explores the use of various electrode materials, including carbon nanomaterial, metal nanoparticles and conducting polymers, as well as the integration of microfluidics, lab-on-a-chip (LOC) devices and wearable/implantable technologies. The design and fabrication methodologies used in these sensors are discussed, along with sample preparation techniques and biorecognition elements for enhancing sensor performance.

Electrochemical sensors for salivary analyte detection have demonstrated excellent potential for noninvasive, rapid and cost-effective diagnostics. Recent advancements have resulted in improved sensor selectivity, stability, sensitivity and compatibility with complex saliva samples. Integration with microfluidics and LOC technologies has shown promise in enhancing sensor efficiency and accuracy. In addition, wearable and implantable sensors enable continuous, real-time monitoring of salivary analytes, opening new avenues for personalized health care and disease management.

This review presents an up-to-date overview of electrochemical sensors for analyte detection in saliva, offering insights into their design, fabrication and performance. It highlights the originality and value of integrating electrochemical sensing with microfluidics, wearable/implantable technologies and point-of-care testing platforms. The review also identifies challenges and limitations, such as interference from other saliva components and the need for improved stability and reproducibility. Future prospects include the development of novel microfluidic devices, advanced materials and user-friendly diagnostic devices to unlock the full potential of saliva-based electrochemical sensing in clinical practice.