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Due to its inexpensive production costs, low stress concentration and maintenance-friendliness, the adhesive bonded pipe joint is frequently utilized for pipe connection. However, further theoretical analysis is needed to understand the debonding failure mechanism of such bonded pipe joints under axial tension.

In this study, based on the bi-linear cohesive zone model, the integrated closed-form solutions were derived by considering the axial stiffness ratio and failure stage to determine the relative interfacial slip, interfacial shear stress and relationship of tension–displacement in the bonded pipe joint.

Additionally, solutions for the critical bonded length and the ultimate load capacity were put forth. Besides, the numerical study was conducted to verify the theoretical solutions regarding the load–displacement relationship. The interfacial shear stress distribution at different failure stages was presented to understand the interfacial shear stress transmission and debonding process. The effect of bonded length on the ultimate load and ductility of pipe joints was also discussed.

The findings in this study can give a reference for the design of bonded pipe joints in their actual engineering applications.

In order to connect a fiberglass composite structure to a steel structure, a hybrid composite made of glass and steel fibers has been studied. The hybrid composite has one end section with all glass fibers and the opposite end section with all steel fibers. As a result, it contains a transition section in the middle of the hybrid composite changing from glass fibers to steel fibers. The purpose of this paper is to examine interface strength at the glass to steel fiber transition section, in order to evaluate the effectiveness of the hybrid composite as a joining technique between a polymer composite structure and a metallic structure.

The present micromechanical study considers two types of glass to steel fiber joints: butt and overlap joints. For the butt joint, the end shape of the steel fiber is also modified to determine its effect on interface strength. The interface strength is predicted numerically based on the virtual crack closure technique to determine which joint is the strongest under various loading conditions such as tension, shear and bending. Numerical models include resin layers discretely. A virtual crack is considered inside the resin, at the resin/glass‐layer interface, and at the resin/steel‐layer interface. The crack is located at the critical regions of the joints.

Overall, the butt joint is stronger than the overlap joint regardless of loading types and directions. Furthermore, modification of an end shape of the middle fiber layers in the butt joint shifts the critical failure location.

The paper describes one of a few studies which investigated the interface strength of the hybrid joint made of fiberglass and steel‐fiber composites. This joint is important to connect a polymeric composite structure to a metallic structure without using conventional mechanical joints.

Contact problems are among the most difficult ones in mechanics. Due to its practical importance, the problem has been receiving extensive research work over the years. The finite element method has been widely used to solve contact problems with various grades of complexity. Great progress has been made on both theoretical studies and engineering applications. This paper reviews some of the main developments in contact theories and finite element solution techniques for static contact problems. Classical and variational formulations of the problem are first given and then finite element solution techniques are reviewed. Available constraint methods, friction laws and contact searching algorithms are also briefly described. At the end of the paper, a bibliography is included, listing about seven hundred papers which are related to static contact problems and have been published in various journals and conference proceedings from 1976.

This study aims to analyze the shear strength and fracture mechanism of full Cu-Sn IMCs joints with different Cu₃Sn proportion and joints with the conventional interfacial structure in electronic packaging.

The Cu-Sn IMCs joints with different Cu₃Sn proportion were fabricated through soldering Cu-6 μm Sn-Cu sandwich structure under the extended soldering time and suitable pressure. The joints of conventional interfacial structure were fabricated through soldering Cu-100 μm Sn-Cu sandwich structure. After the shear test was conducted, the fracture mechanism of different joints was studied through observing the cross-sectional fracture morphology and top-view fracture morphology of sheared joints.

The strength of joints with the conventional interfacial structure was 26.6 MPa, while the strength of full Cu-Sn IMCs joints with 46.7, 60.6, 76.7 and 100 per cent Cu₃Sn was, respectively, 33.5, 39.7, 45.7 and 57.9 MPa. The detailed reason for the strength of joints showing such regularity was proposed. For the joint of conventional interfacial structure, the microvoids accumulation fracture happened within the Sn solder. However, for the full Cu-Sn IMCs joint with 46.7 per cent Cu₃Sn, the cleavage fracture happened within the Cu6Sn5. As the Cu₃Sn proportion increased to 60.6 per cent, the inter-granular fracture, which resulted in the interfacial delamination of Cu₃Sn and Cu6Sn5, occurred along the Cu₃Sn/Cu6Sn5 interface, while the cleavage fracture happened within the Cu6Sn5. Then, with the Cu₃Sn proportion increasing to 76.7 per cent, the cleavage fracture happened within the Cu6Sn5, while the transgranular fracture happened within the Cu₃Sn. The inter-granular fracture, which led to the interfacial delamination of Cu₃Sn and Cu, happened along the Cu/Cu₃Sn interface. For the full Cu₃Sn joint, the cleavage fracture happened within the Cu₃Sn.

The shear strength and fracture mechanism of full Cu-Sn IMCs joints was systematically studied. A direct comparison regarding the shear strength and fracture mechanism between the full Cu-Sn IMCs joints and joints with the conventional interfacial structure was conducted.

This paper aims to investigate the effects of different ultrasonic-assisted loading degrees on the microstructure, mechanical properties and the fracture morphology of Cu/Zn+15%SAC0307+15%Cu/Al solder joints.

A new method in which 45 μm Zn particles were mixed with 15% 500 nm Cu particles and 15% 500 nm SAC0307 particles as solders (SACZ) and five different ultrasonic loading degrees were applied for realizing the soldering between Cu and Al at 240 °C and 8 MPa. Then, SEM was used to observe and analyze the soldering seam, interface microstructure and fracture morphology; the structural composition was determined by EDS; the phase of the soldering seam was characterized by XRD; and a PTR-1102 bonding tester was adopted to test the average shear strength.

The results manifest that Al–Zn solid solution is formed on the Al side of the Cu/SACZ/Al joints, while the interface IMC (Cu₅Zn₈) is formed on the Cu side of the Cu/SACZ/Al joints. When single ultrasonic was used in soldering, the interface IMC (Cu₅Zn₈) gradually thickens with the increase of ultrasonic degree. It is observed that the proportion of Zn or ZnO areas in solders decreases, and the proportion of Cu–Zn compound areas increases with the variation of ultrasonic degree. The maximum shear strength of joint reaches 46.01 MPa when the dual ultrasonic degree is 60°. The fracture position of the joint gradually shifts from the Al side interface to the solders and then to the Cu side interface.

The mechanism of ultrasonic action on micro-nanoparticles is further studied. By using different ultrasonic loading degrees to realize Cu/Al soldering, it is believed that the understandings gained in this study may offer some new insights for the development of low-temperature soldering methodology for heterogeneous materials.

This paper aims to assess precise correlations between intermetallic compounds (IMCs) microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using thermal shock (TS) tests.

This paper uses 200-µm pitch silicon flip chips with nickel (Ni) pads and stand-off height of approximately 60 µm, assembled on substrates with copper (Cu) pads. After assembly, the samples were subjected to air-to-air thermal shock testing from 55 to 125 per cent. The transfer time was less than 5 s, and the dwell time at each temperature extreme was 15 min. To investigate the microstructure evolution and crack growth, two samples were removed from the thermal shock chamber at 0, 400, 1,200, 2,000, 5,800 and 7,000 cycles.

The results showed that one (Cu, Ni)₆Sn₅/(Ni, Cu)₃Sn₄ dual-layer structure formed at the Ni pad interface of chip side dominates the micro-joints failure. This is because substantial (Ni, Cu)₃Sn₄ grain boundaries provide a preferential pathway for the catastrophic crack growth. Other IMCs microstructure evolutions that cause the prevalent joints failure as previously reported, i.e. thickened interfacial (Cu, Ni)₆Sn₅ and Ni₃P layer, and coarsened IMCs inside the solder matrix, only contributed to the occurrence of fine cracks. Moreover, the typical interfacial IMCs spalling triggered by thermally induced stress did not take place in this study, showing a positive impact in the micro-joint reliability.

As sustained trends toward multi-functionality and miniaturization of microelectronic devices, the joints size is required to be constantly scaled down in advanced packages. This arises a fact that the reliability of small-size joints is more sensitive to the IMCs because of their high volume proportion and greatly complicated microstructure evolutions. This paper evaluated precise correlations between IMCs microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using TS tests. It found that one (Cu, Ni)₆Sn₅/(Ni, Cu)₃Sn₄ dual-layer structure formed at the Ni pad interface dominate the micro-joints failure, whereas other IMCs microstructure evolutions that cause the prevalent joints failure exhibited nearly negligible effects.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

The main purpose of the present study was to evaluate the metallurgical and mechanical properties of dissimilar metal friction welds (FWs) between aluminium and type 304 stainless steel.

One of the manufacturing methods used to produce parts made from different materials is the FW method. Therefore, in the present study, austenitic stainless steel and aluminium parts were joined by FW. Tensile, fatigue and notch-impact tests were applied to FW specimens, and the results were compared with those for the original materials. Microstructure, energy dispersive X-ray (EDX) and X-ray diffraction (XRD) analysis and hardness variations were conducted on the joints.

It was found from the microstructure and XRD analysis that inter-metallic phases formed in the interface which further caused a decrease in the strength of the joints.

In this study, the rotation speed was kept constant. The effects of the rotation speed on the welding quality can be examined in future. It is important to note that the FW process was successfully accomplished in this study although it was particularly difficult to obtain the weld due to the large deformations at the interface.

Low-density components such as aluminium and magnesium can be joined with steels owing to being cost-effective in industry. Application of classical welding techniques to such materials is difficult because they have different thermal properties. Their welding plays a key part in industrial quality and process control, in the efficient use of energy and other resources, in health and safety. Then, this study will contribute for welded, brazed and soldered materials.

The main value of this paper is to contribute and fulfill the influence of the interface on properties in welding of various materials that is being studied so far in the literature.

The paper considers a plane joint or interface element suitable for implementation into a standard non‐linear finite element code. Sliding of the joint is assumed to be governed by Coulomb friction, with a non‐associated flow rule and no cohesion. The constitutive equations are formulated in a manner appropriate for a backward difference discretization in time along the path of loading. It is shown that the backward difference assumption can lead to an explicit formulation in which no essential distinction need be drawn between opening and closing of the joint and sliding when the joint is closed. However, an inherent limitation of the dilatant Coulomb model becomes evident; the final formulation is internally consistent but does not describe reversed shear displacement in a physically reasonable way. Explicit equations for the consistent tangent stiffness and for the corrector step (or return algorithm) of the standard Newton—Raphson iterative algorithm are given. The equations have been implemented as a user element in the finite element code ABAQUS, and illustrative examples are given.

The purpose of this paper is to apply the novel instantaneous power flow balance (IPFB)-based identification strategy to a specific practical situation like nonlinear lap joints having single and double bolts. The paper also investigates the identification performance of the proposed power flow method over conventional acceleration-matching (AM) methods and other methods in the literature for nonlinear identification.

A parametric model of the joint assembly formulated using generic beam element is used for numerically simulating the experimental response under sinusoidal excitations. The proposed method uses the concept of substructure IPFB criteria, whereby the algebraic sum of power flow components within a substructure is equal to zero, for the formulation of an objective function. The joint parameter identification problem was treated as an inverse formulation by minimizing the objective function using the Particle Swarm Optimization (PSO) algorithm, with the unknown parameters as the optimization variables.

The errors associated with identified numerical results through the instantaneous power flow approach have been compared with the conventional AM method using the same model and are found to be more accurate. The outcome of the proposed method is also compared with other nonlinear time-domain structural identification (SI) methods from the literature to show the acceptability of the results.

In this paper, the concept of IPFB-based identification method was extended to a more specific practical application of nonlinear joints which is not reported in the literature. Identification studies were carried out for both single-bolted and double-bolted lap joints with noise-free and noise-contamination cases. In the current study, only the zone of interest (substructure) needs to be modelled, thus reducing computational complexity, and only interface sensors are required in this method. If the force application point is outside the substructure, there is no need to measure the forcing response also.