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Numerical models of manufacturing processes are useful and provide insight for the practitioner; however, model verification and validation are a prerequisite for expedient application. This paper aims to detail the code-to-code verification of a thermal numerical model for the Bridgman solidification process of alloys in a two-dimensional axisymmetric domain, against an established commercial code (ANSYS Fluent); the work is considered a confidence building step in model development.

A grid sensitivity analysis is carried out to establish grid independence, and this is followed by simulations of two transient solidification scenarios: pulling rate step change and ramp input; the results of which are compared and discussed.

Good conformity of results is achieved; hence, the non-commercial model is code-to-code verified; in addition, the ability of the non-commercial model to deal with radial heat flow is demonstrated.

The ability of the home made model for Bridgman furnace solidification to deal with cases where significant radial heat transfer occurs in the sample was demonstrated. The introduction of front tracking to model the macroscopic growth of dendritic mush and the region of undercooled liquid is identified as the next step in model development.

In this work, with a goal to ultimately forward the advancement of additive manufacturing research, the author applies the Wheeler-Boettinger-McFadden model through a progressive series of increasingly complex solidification problems illustrating the evolution of both dendritic as well as columnar growth morphologies. For purposes of convenience, the author assumes idyllic solutions (i.e. the excess energies associated with mixing solid and liquid phases can be neglected).

In this work, the author applied the phase-field model through a progressive series of increasingly complex solidification problems, illustrating the evolution of both dendritic as well as columnar growth morphologies. Beginning with a non-isothermal treatment of pure Ni, the author further examined the isothermal and directional solidification of Cu–Ni binary alloys.

(1) Consistent with previous simulation results, solidification simulations from each of the three cases revealed the presence of parabolic, dendrite tips evolving along directions of maximum interface energy. (2) For pure Ni simulations, changes in the anisotropy and noise magnitudes resulted in an increase of secondary dendritic branches and changes in the direction of propagation. The overall shape of the primary structure tended also to elongate with increased anisotropy. (3) For simulations of isothermal solidification of Ni–Cu binary alloys, the development of primary and secondary dendrite arm formation followed similar patterns associated with a pure substance. Calculations of dendrite tip velocity tended to increase monotonically with increasing anisotropy in accordance with previous research. (4) Simulations of directional solidification of Ni–Cu binary alloys with a linear temperature profile demonstrated the presence of cellular dendrites with relatively weak side-branching. The occurrence of solute trapping was also apparent between the primary dendrite columns. Dendrite tip velocities increased with increasing cooling rate.

This research, particularly the section devoted to directional solidification of binary alloys, describes a novel numerical framework and platform for the parametric analysis of various microstructural related quantities, including the effects due to changes in temperature gradient and cooling rate. Both the evolution of the phase and concentration are resolved.

The purpose of this work is to explore the forms of intermetallic phase compounds (IMPCs) in Pt/In/Au and Pt/In/Ag joints by using isothermal solidification. This lead-free technique leads to formation of IMPCs having high-temperature stable joints for platinum-based micro-heater gas sensor fabricated on low temperature co-fired ceramic (LTCC) substrate.

Proposed task is to make an interconnection for Pt micro-heater electrode pad to the silver and gold thick-films printed on LTCC substrate. Both Pt/In/Au and Pt/In/Ag configured joints with different interactive areas prepared at 190 and 220°C to study temperature and contact surface area effects on ultimate tensile strength of the joints, for a 20 s reaction time, at 0.2 MPa applied pressure. Those delaminated joint interfaces studied under SEM, EDAX and XRD.

IMPCs identified through material analysis using diffraction analysis of XRD data are InPt3, AgIn2, AgPt, AgPt3, Au9In4 and other stoichiometric compounds. The interactive surface area between thick-films and temperature increment shows improvement in the formations of IMPCs and mechanical stability of joints. These IMPCs-based joints have improved the mechanical stability to the joints to sustain even at high operating temperatures. Elemental mapping of the weak joint contact interface shows unwanted oxide formations also reported. Physical inter-locking followed by the diffusion phenomenon on the silver substrate strengthen the interconnection has been noticed.

Inert gas environment creation inside the chamber to isolate the lead-free joint placed between heating stamp pads to avoid oxide formations at the interface while cooling which adds up to the cost of manufacturing. Most of the oxides at a joint-interface increase minute to moderate resistance with respect to the level of oxides took place. These oxides contributed heat certainly damage the micro-heater based gas sensors while functioning.

These isothermal solidification-based lead-free solder joints formation replace the existing lead-based packaging techniques. These lead-free interconnections on ceramic or LTCC substrate are reliable and durable, especially those designed to work for heavy-duty engines, even at severe environment conditions.

Platinum micro-heater-based gas sensors handles over a wide-range of temperatures about 300 to 500°C. The specific temperature level of different oxide films (SnO2) on the micro-heater is capable of detecting various specific gases. This feature of platinum based gas sensor demands durable and mechanically stable joints for continuous monitoring.

Au/In isothermal solidification technique was evaluated as an alternative method for high performance die attachment. Bonding could be achieved at temperatures between 250°C ‐ 3008C for about five to ten seconds. The microstructures of the bonds were studied and their effects on the reliability analysed. The quality of the bonds depends very much on the surface waviness of the substrate. For high quality substrates, bonding was successfully achieved on 3mm × 3mm dies, which is almost one order of magnitude bigger than the die size achievable for Au/Si eutectic bonding, and the bonds show no obvious degradation after 2,800 cycles between –55°C to 125°C.

Pb-free solders have been developed to replace the standard Sn–Pb eutectic solder since the prohibition on Pb used in solders. The Sn–Ag–Cu series of lead-free solders is the most extensively used in the electronics industry. The Ag₃Sn, which forms during isothermal ageing, can significantly degrade solder joint reliability. Sn–Ag–Cu solder’s high price further hindered its use in the electronics industry. This paper aims to investigate different copper percentages into Sn–xCu solder alloy to improve its microstructure and strength performance.

The solder alloys used in this work were Sn–xCu, where x = 0.0, 0.3, 0.5, 0.7, 1.0 Wt.%, which was soldered onto electroless nickel immersion gold (ENIG) substrate using carbon dioxide (CO₂) gas laser. Then these samples were subjected to isothermal aging for 0, 200, 500, 1,000 and 2,000 h. The Sn–xCu solder alloy was fabricated through a powder metallurgy process.

Microstructure characterization showed that Cu addition resulted in fine and rounded shape of Cu–Sn–Ni particles. Shear strength of Sn–xCu solder joints was increased with increasing Cu content, but at aging duration of 1,000 h, it dropped slightly. It is believed that the strength improved due to the increment of diffusion rate during isothermal aging.

In a Cu–Sn solder, the recommended amount is 1.0 Wt.% of Cu. In extensive aging procedures, it was discovered that Sn1.0Cu solder improved the reliability of solder joints. The findings indicated that the innovative solder alloys might satisfy the needs of high-reliability applications.

The study shows that the right amount of Cu enhances the solidification of Sn–Cu solder, increasing the shear force of the Cu–Sn solder joint. The Sn1.0Cu exhibits a ductile fracture on the top microstructure, improving the joint’s average shear strength.

Two common fixed grid enthalpy methods used in the numerical modelling of phase change problems are the apparent heat capacity and the source based methods. In this paper, a general enthalpy method that includes as subsets both apparent heat capacity and source based methods, is derived. Following this, an optimal enthalpy scheme is identified. The superiority of the optimal scheme over the apparent heat capacity and the source based schemes is illustrated by solving sample phase change problems.

This paper aims to study the features of microstructures and mechanical properties of the joints which were produced by transient liquid phase method. The difference between phases in bonding region identified through metallography pictures and applying hardness and shear strength tests.

The bonding process was carried out at a temperature of 300°C for time durations ranging from 15 to 120 min. The scanning electron microscopy equipped with energy dispersive spectroscopy system and optical microscopy were used to examine microstructural characteristics, and mechanical properties of the joints were studied by applying microhardness and shear tests. The shear tests were conducted by a shear fixture which was mounted on the tensile machine.

The intermetallic compounds of the Cu₆Sn₅ −η and the Cu₃Sn-ε were formed simultaneously in the bonding interface. Although the η-phase, which exhibits scallop-shaped morphology, grows very quickly, upon completion of the isothermal solidification stage, it turns into the ε-phase. The hardness of the bonding interface is significantly higher than that of the substrate. The shear results show that once the bonding process is complete, brittle fracture occurs. Moreover, a greater decrease in strength was observed when the ε-phase is the only phase in the bonding region.

The hardness number of the η-phase is higher than that of the ε-phase. The hardness numbers of the η-phase and the ε-phase are 894 and 689 HV, respectively. The mean shear strength values of the samples that were bonded at 300 °C for 15, 60 and 120 min were 11.7, 9.5 and 5.4 MPa, respectively.

The present paper addresses the computer modelling of pipe formation in metal castings.

As a preliminary, a brief review of the current state‐of‐the‐art in pipe shrinkage computation is presented. Then, in first part, the constitutive equations that have to be considered in thermomechanical computations are presented, followed by the main lines of the mechanical finite element resolution. A detailed presentation of an original arbitrary Lagrangian‐Eulerian (ALE) formulation is given, explaining the connection between the Lagrangian and the quasi Eulerian zones, and the treatment of free surfaces.

Whereas most existing methods are based on thermal considerations only, it is demonstrated in the current paper that this typical evolution of the free surface, originated by shrinkage at solidification front and compensating feeding liquid flow, can be effectively approached by a thermomechanical finite element analysis.

Future work should deal with the following points: identification of thermo‐physical and rheological data, automatic and adaptive mesh refinement, calculation of the coupled deformation of mold components, development of a two‐phase solid/liquid formulation.

An example of industrial application is given. The proposed method has been implemented in the commercial software THERCAST^® dedicated to casting simulation.

The proposed numerical methods provide a comprehensive approach, capable of modelling concurrently all the main phenomena participating in pipe formation.

A multi-physics process model is developed to analyze reactive melt infiltration (RMI) fabrication of ceramic-matrix composite (CMC) materials and components. The paper aims to discuss this issue.

Within this model, the following key physical phenomena governing this process are accounted for: capillary and gravity-driven unsaturated flow of the molten silicon into the SiC/SiC CMC preform; chemical reactions between the silicon melt and carbon (either the one produced by the polymer-binder pyrolysis or the one residing within the dried matrix slurry); thermal-energy transfer and source/sink phenomena accompanying reactive-flow infiltration; volumetric changes accompanying chemical reactions of the molten silicon with the SiC preform and cooling of the as-fabricated CMC component to room temperature; development of residual stresses within, and thermal distortions of, the as-fabricated CMC component; and grain-microstructure development within the SiC matrix during RMI.

The model is validated, at the material level, by comparing its predictions with the experimental and modeling results available in the open literature. The model is subsequently applied to simulate RMI fabrication of a prototypical gas-turbine engine hot-section component, i.e. a shroud. The latter portion of the work revealed the utility of the present computational approach to model fabrication of complex-geometry CMC components via the RMI process.

To the authors’ knowledge, the present work constitutes the first reported attempt to apply a multi-physics RMI process model to a gas-turbine CMC component.

A critical analysis of packaging and sealing methods for integrated circuits, hybrid microcircuits and multichip modules has been done. The best hermetic and high yield weld seal is examined along with other conventional seals like solder seal, frit seal and plastic seal with special emphasis on materials and processes involved in each case. An overview of emerging technology is also presented. A comparative analysis is made for selection of the right technology and material for a particular requirement.