A novel high performance die attach

Abstract

Au/In isothermal solidification technique was evaluated as an alternative method for high performance die attachment. Bonding could be achieved at temperatures between 250°C ‐ 3008C for about five to ten seconds. The microstructures of the bonds were studied and their effects on the reliability analysed. The quality of the bonds depends very much on the surface waviness of the substrate. For high quality substrates, bonding was successfully achieved on 3mm × 3mm dies, which is almost one order of magnitude bigger than the die size achievable for Au/Si eutectic bonding, and the bonds show no obvious degradation after 2,800 cycles between –55°C to 125°C.

Citation

Xie, X.M., Wang, T.B., Shi, J.Z., Ye, R.Q., Stubhan, F. and Freytag, J. (2000), "A novel high performance die attach", Soldering & Surface Mount Technology, Vol. 12 No. 1, pp. 40-44. https://doi.org/10.1108/09540910010312456