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ISHM invites papers for the above Conference, to be held on 29–31 May 1991 in Rotterdam, The Netherlands. Papers should cover areas such as: design, manufacturing, packaging and interconnection, materials and processing, applications, reliability, components, new technologies, marketing and economics, optoelectronics. Summaries should be in English, length 200–300 words. The deadline for receipt of summaries is 30 September 1990. (For full details, see announcement on pp. 54–55.)

On 20 April ISHM‐Benelux held its 1988 Spring meeting at the Grand Hotel Heerlen. This meeting was totally devoted to implantable devices, in particular to the technologies used for these high reliability, extremely demanding devices. For this meeting ISHM‐Benelux was the guest of the Kerkrade facility of Medtronic. Medtronic (headquartered in Minneapolis, USA) is the world's leading manufacturer of implantable electronic devices. Apart from the assembly of pacemakers and heart‐wires, the Kerkrade facility acts as a manufacturing technology centre for Medtronic's European facilities.

ISHM (UK) presented a technical meeting on this topic on the 23rd October 1982 at the Cunard International Hotel, London. The meeting was attended by some 50 engineers, both those involved in the field of hybrids and potential users. It was generally felt that this was a useful meeting but more especially that it would have appealed to many potential users of hybrids, had the right people been able to be contacted.

Printed (circuit) boards have been used in the electronics industry for the past 25 years and more. The technology used to design and manufacture PCBs is well known and accepted. Recently, however, designers of electronic equipment have shown that the use of newer materials and systems, such as flexible and moulded circuits, hybrid circuits, or a combination of these, can significantly improve the cost/performance ratio for electronic interconnects. This paper examines some of the many possibilities open to electronics designers and how these new opportunities can improve the economics and performance of electronic equipment.

In this contribution a linear thermal model for hybrid circuits is presented. Both the heat dissipated in screen printed resistors and in mounted components such as transistors and integrated circuits is taken into account.

The paper presents a two‐dimensional and three‐dimensional thermal model of the power hybrid circuit. Measurement of the accuracy of temperature computation using the two‐dimensional model is carried out. Based on both models, the AUTO_T program for thermal analysis is created. This program chooses the proper model according to the required accuracy of computation. The reduction of the computational time is evident.

In this contribution a short review is given on thermal analysis of hybrid circuits using 2‐D, 3‐D and time‐dependent models. It will be shown which models are necessary to be included in a CAD system for hybrid circuit design.

As announced in the May issue of Hybrid Circuits, ISHM‐Benelux is organising a one‐day conference on applications of hybrid circuit technology.

Dr Setty reports from ISHM‐India, who had their first committee meeting on the 4th October 1985, that the Society is now off the ground and that the Symposium on Hybrid Microelectronics held on February 5th attracted considerable interest, some 150 persons attending. Dr Sonde was the organising committee Chairman and was fortunate in being able to persuade the Department of Electrical Communication Engineering of the Indian Institute of Science in Bangalore, which has set up its thin and thick film hybrid department, to host this important event. Papers were given by visiting speakers from the US, UK and West Germany as well as from India itself. Among the presentations given were papers introducing some of the country's facilities from which it can be seen that microelectronics has an important future here.

The effects and implications of current developments in interconnection technology on print and fire thick film hybrid manufacture are discussed. Particular emphasis is given to the fact that in many cases new techniques complement rather than compete with film hybrids. Alternative substrates, semiconductor packaging, semicustom integrated circuits, surface mount technology and polymer thick film are all included in the paper. Conclusions are drawn which indicate that although these technologies are all of crucial importance they will not replace current thick film technology.