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Despite many years of academic research into organisational integration and effectiveness, organisations still struggle to successfully implement strategy and achieve competitive advantage. However, the rapid evolution of marketing technologies such as big data, marketing analytics, artificial intelligence and personalised consumer interactions offer potential for an integrated marketing communication technological capability that aligns and integrates an organisation. Programmatic advertising is one such integrated marketing communication (IMC) technology capability, applying and learning from customer information and behaviours to align and integrate organisational activity. The literature on programmatic is embryonic and a conceptual framework that links its potential to organisational effectiveness is timely. This paper aims to develop a framework showing the potential for programmatic advertising as an IMC technology capability to enhance organisational integration and performance.

An exploratory methodology gained insight from 15 depth interviews with senior marketing executives from both organisations and external advertising agencies.

Four elements of a programmatic integrated organisation were identified and aligned with seven marketing activity levers to deliver firm performance measures.

This research contributes to theory, affirming IMC as a capability and positioning programmatic as a means of organisational integration.

The model also offers guidance for practitioners looking to integrate programmatic into their organisation.

To the best of the authors’ knowledge, this is the first paper to look at programmatic from an IMC perspective and as a means of organisational integration. It is also the first to apply Moorman and Day’s (2016) model to explore organisational integration and programmatic, developing a new model, specifically contextualised for programmatic advertising.

Solder bumps for chip interconnections are downsizing from current approximately 100 µm to the expected 1 µm in future. As a result, the Cu-Ni cross-interaction in Cu/Solder/Ni solder joints will be more complicated and then strongly influence the growth of the intermetallic compounds (IMCs). Thus, it is critical to understand the fundamental aspects of interfacial reaction in micro solder joints. This paper aims to reveal the effect mechanism of reflow temperature and solder size on the interfacial reaction in Cu/Solder/Ni solder joints.

The Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints with 50 and 100 µm solder sizes at 250°C and 300°C were observed, respectively. The line-type interconnects were soaked in silicone oil, and the temperature of the line-type interconnects was 250 ± 3°C and 300 ± 3°C, which were monitored by a fine K-type thermocouple, and followed by an isothermal aging process at various times. After aging, the specimens were removed from the silicone oil and cooled in the air to room temperature.

The major interfacial reaction product on both interfaces was (Cu,Ni)₆Sn₅, and the asymmetric growth of (Cu,Ni)₆Sn₅, evidenced by the thickness of (Cu,Ni)₆Sn₅ IMCs at the Sn/Ni interface was always larger than that at the Sn/Cu interface, resulted from the directional migration of Cu atoms toward the Sn/Ni interface under Cu concentration gradient. The morphology of (Cu,Ni)₆Sn₅ IMC at Sn/Cu interface was columnlike at 250°C, and which changed from columnlike to scallop with large aspect ratio at 300°C, while that at Sn/Ni interface gradually evolved from needlelike to the mixture of needlelike and layered at 250°C, and which evolved from needlelike to scallop with large aspect ratio at 300°C. The evolution of morphology of (Cu,Ni)₆Sn₅ is attributed to the content of Ni. Furthermore, the results indicate that the Cu-Ni cross-interaction was stronger with small solder size and relatively low temperature in the Cu/Sn/Ni micro solder joints.

The asymmetric growth of (Cu,Ni)₆Sn₅ in the Cu/Sn/Ni micro solder joints, evidenced by the thickness of (Cu,Ni)₆Sn₅ IMCs at the Sn/Ni interface, was always larger than that at the Sn/Cu interface. The morphology evolution of (Cu,Ni)₆Sn₅ IMC at both interfaces was attributed to the content of Ni. The Cu-Ni cross-interaction was stronger with small solder size and relatively low temperature in the Cu/Sn/Ni micro solder joints.

This research aims to examine the moderating role of consumers’ persuasion knowledge (PK) on the persuasive effect of combined advertising and publicity within the same medium. The synergistic effect experienced when two messages are thus combined is reversed for readers with high PK who are first exposed to publicity then to advertising. Believability of the message is found to be a mediator within this context.

Based on a review of the appropriate literatures on PK and integrated marketing communication (IMC), this paper tests the hypotheses using two experimental studies.

The results of two experiments show that publicity-then-advertising yields poorer persuasion than advertising-then-publicity, especially under a high PK condition. The reduced synergistic effect of combinations of advertising and publicity is found especially when consumers activate temporary PK and/or when they have chronically high PK. A mediator for a decrease in the synergistic effect of combinations of advertising and publicity, believability, is examined.

This study contains significant managerial implications for marketing communicators about how to most effectively combine and coordinate publicity and advertising in the implementation of an IMC strategy.

Other than making a contribution to the IMCs’ literature, this research extends understanding of the power of PK within an IMC framework. The research contributes yet another extension to the original PK model of Friestad and Wright (1994) by suggesting an underlying theoretical mechanism to explain how PK works in the IMC domain.

The purpose of this paper is to investigate the morphology of intermetallic (IMC) compounds and the mechanical properties of SAC305 solder alloy under different cooling conditions.

SAC305 solder joints were prepared under different cooling conditions/rates. The performance of three different etching methods was investigated: simple chemical etching, deep etching based on the Jackson method and selective removal of β-Sn by a standard three-electrode cell method. Phase and structural analyses were conducted by X-ray diffraction (XRD). The morphology of etched solder was examined by a field emission scanning electron microscope. The hardness evaluations of the solder joints were conducted by a Vickers microhardness tester.

The Ag₃Sn network was significantly refined by the ice-quenching process. Further, the thickness of the Cu₆Sn₅ layer decreased with an increase in the cooling rate. The finer Ag₃Sn network and the thinner Cu₆Sn₅ IMC layer were the results of the reduced solidification time. The ice-quenched solder joints showed the highest hardness values because of the refinement of the Ag₃Sn and Cu₆Sn₅ phases.

The reduction in the XRD peak intensities showed the influence of the cooling condition on the formation of the different phases. The micrographs prepared by electrochemical etching revealed better observations regarding the shape and texture of the IMC phases than those prepared by the conventional etching method. The lower grain orientation sensitivity of the electrochemical etching method (unlike chemical etching) significantly improved the micrographs and enabled accurate observation of IMC phases.

The surface finish is an essential step in printed circuit boards design because it provides a solderable surface for electronic components. The purpose of this study to investigate the effects of different surface finishes during the soldering and ageing process.

The solder joints of Sn-4.0Ag-0.5Cu/Cu and Sn-4.0Ag-0.5Cu/electroless nickel/immersion silver (ENImAg) were investigated in terms of intermetallic (IMC) thickness, morphology and shear strength. The microstructure and compositions of solder joints are observed, and analyzed by using scanning electron microscopy (SEM-EDX) and optical microscope (OM).

Compounds of Cu₆Sn₅ and (Cu, Ni)₆Sn₅ IMC were formed in SAC405/Cu and SAC405/ENImAg, respectively, as-reflowed. When the sample was exposed to ageing, new layers of Cu₃Sn and (Ni, Cu)₃Sn₅ were observed at the interface. Analogous growth in the thickness of the IMC layer and increased grains size commensurate with ageing time. The results equally revealed an increase in shear strength of SAC405/ENImAg because of the thin layer of IMC and surface finish used compared to SAC405/Cu. Hence, a ductile fracture was observed at the bulk solder. Overall, the ENImAg surface finish showed excellent performance of solder joints than that of bare Cu.

The novel surface finish (ENImAg) has been developed and optimized. This alternative lead-free surface finish solved the challenges in electroless nickel/immersion gold and reduced cost without affecting the performance.

The most marked example of progress in marketing communications is the emergence of Integrated Marketing Communications (IMC). Many organizations now consider IMC to be a key competitive advantage of marketing. This paper reviews the developmental progress of IMC. Now, just a few years into the 21st century, IMC is entering a critical period, with many businesses – and the agencies that service their needs – apparently enmeshed in the first stages of IMC development. The early promise that IMC offered seems to be fading, unless organizations start to take it seriously, even when faced by the realities of organizational exigency.

The purpose of this paper is to study the effects of mandatory inter-municipal cooperation (IMC) in small Italian municipalities. Data from 280 small Italian municipalities on the effects of IMC in terms of higher efficiency, better effectiveness of local public services, and greater institutional legitimacy of the small municipalities participating in IMC have been investigated against four variables: size, geographical area, type of inter-municipal integration, and IMC membership (the presence in the IMC of a bigger municipality, the so-called big brother).

Data were gathered from a mail survey that was sent to a random sample of 1,360 chief financial officers acting in municipalities of under 5,000 inhabitants, stratified by size (0-1,000 and 1,001-5,000) and geographic area (North, Center, and South) criteria. To analyze the dependency relationships between the three potential effects of participating in IMC and possible explanatory variables, the authors used a logistic regression model as the benefits were binarily categorized (presence or absence of benefits).

The findings show that in more than two-thirds of the municipalities participating in IMC, there were benefits in terms of costs reduction and better public services, whereas greater institutional legitimacy was detected in about half of the cases. The statistical analysis with logistic regression highlighted that IMC type is particularly critical for explaining successful IMC. In particular, the positive effects of IMC were mainly detected in those small municipalities that promoted a service delivery organization rather than participating in service delivery agreements or opting for mixed arrangements of joint public services delivery.

The paper focuses on small municipalities where studies are usually scant. The analysis highlighted that the organizational setting is particularly critical for explaining a successful IMC.

This paper aims to study the effect of aging and cooling rate on the reliability of the solder joint using electroless nickel boron (EN-Boron) as a surface finish in the electronic packaging area.

EN-Boron was plated on a Cu substrate through electroless plating method. This process was followed by reflow soldering of Sn–3.0Ag–0.5Cu solder alloy on metallized Cu substrate to form a joining. Then, the specimens were cooled using different cooling mediums such as air (slow cooling) with 15.7 °C/min and water (fast cooling) with 110.5 °C/min. After that, the specimens were subjected to isothermal aging at 150°C for 0, 250 and 1,000 h. Finally, they went through a lap shear test following ASTM D1002. Optical microscope and scanning electron microscopy were used for intermetallic compound (IMC) characterization. The type of IMC formed was confirmed by field emission scanning electron microscope-energy-dispersive X-ray spectroscopy (FESEM-EDX).

The results showed that the IMC type changed from the combination of Ni₃Sn4 and (Ni, Cu)₃Sn4 after reflow soldering into fully (Ni, Cu)₃Sn4 when aged for 1,000 h. The formation of (Ni, Cu)₃Sn4 and Cu₃Sn underneath the IMC layer played a role in reducing the shear strength of joining. Overall, water cooling was reported to provide higher shear strength of solder joint compared to air cooling medium.

The shear strength when using EN-Boron as the surface finish is comparable to the surface finish conventionally used.

This research paper aims to examine the theoretical and practical applicability of integrated marketing communications.

Presents the findings from a two‐country qualitative study concerning the phenomenon. The research used survey methodology to assess the views of advertising agency members of the Institute of Advertising Practitioners (UK) and the Communications Agencies Association of New Zealand (CAANZ)

The findings show that practitioners appear to be constructing and applying IMC concepts that are situation‐specific. Nonetheless, a search for a single empirically testable theory of IMC ignores evidence that practitioners are committed to IMC concepts while at the same time resisting the development of “rigid rules”. Additionally, external factors may be forcing reconsideration of marketing communications and accountability.

The research is limited to a study of ad agency perceptions in two countries. While implications of the findings for other countries are discussed, a major direction for the future is the need for research to be conducted in organisations themselves, not necessarily the agencies which service their needs.

Practical implications include variability in terms of the application of IMC principles. This leads to the idea of differential application with – as stated above – some rejection of “rigid rules” in this dynamic area.

The value of the paper lies in its use of a comparative approach using members of clearly identifiable and relevant samples in two countries in relation to IMC. The notion of differentiation in relation to IMC application, the perceived rejection of rigid rules, and the need for further research to be focused in‐company (rather than in‐agency) assist in moving this emergent paradigm forward in an academic and practitioner sense.

The influence of the thermal reflow profile on the formation and resultant morphology of the intermetallic layer that developed at the Ni particle reinforcements within an eutectic Sn‐Ag composite solder matrix was investigated. The composite solder was fabricated by mechanically dispersing 15 vol% Ni particles into eutectic Sn‐3.5Ag solder paste. Two distinct intermetallic compound (IMC) morphological microstructures were observed around the Ni reinforcements. IMC morphological microstructure apparently varied depending on the amount of heat input and differences in heating rates used in the reflow profile. A “sunflower” IMC morphology was typically noted when the total amount of heat input was small. However, with sufficient heat input, a faceted “blocky” IMC morphology was consistently achieved. Multiple‐reflow thermal profiling experiments were conducted to measure and compare the amount of heat input necessary to change the sunflower IMC morphology around Ni particle reinforcements to the blocky morphology.