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The purpose of this paper is to compile a comprehensive status report on pipes/piping networks across different industrial sectors, along with specifications of materials and sizes, and showcase welding avenues. It further extends to highlight the promising friction stir welding as a single solid-state pipe welding procedure. This paper will enable all piping, welding and friction stir welding stakeholders to identify scope for their engagement in a single window.

The paper is a review paper, and it is mainly structured around sections on materials, sizes and standards for pipes in different sectors and the current welding practice for joining pipe and pipe connections; on the process and principle of friction stir welding (FSW) for pipes; identification of main welding process parameters for the FSW of pipes; effects of process parameters; and a well-carved-out concluding summary.

A well-carved-out concluding summary of extracts from thoroughly studied research is presented in a structured way in which the avenues for the engagement of FSW are identified.

The implications of the research are far-reaching. The FSW is currently expanding very fast in the welding of flat surfaces and has evolved into a vast number of variants because of its advantages and versatility. The application of FSW is coming up late but catching up fast, and as a late starter, the outcomes of such a review paper may support stake holders to expand the application of this process from pipe welding to pipe manufacturing, cladding and other high-end applications. Because the process is inherently inclined towards automation, its throughput rate is high and it does not need any consumables, the ultimate benefit can be passed on to the industry in terms of financial gains.

To the best of the authors’ knowledge, this is the only review exclusively for the friction stir welding of pipes with a well-organized piping specification detailed about industrial sectors. The current pipe welding practice in each sector has been presented, and the avenues for engaging FSW have been highlighted. The FSW pipe process parameters are characteristically distinguished from the conventional FSW, and the effects of the process parameters have been presented. The summary is concise yet comprehensive and organized in a structured manner.

This paper aims to develop a specific type of mobile nonrigid support friction stir welding (FSW) robot, which can adapt to aluminum alloy trucks for rapid online repair.

The friction stir welding robot is designed to complete online repair according to the surface damage of large aluminum alloy trucks. A rotatable telescopic arm unit and a structure for a cutting board in the shape of a petal that was optimized by finite element analysis are designed to give enough top forging force for welding to address the issues of inadequate support and significant deformation in the repair process.

The experimental results indicate that the welding robot is capable of performing online surface repairs for large aluminum alloy trucks without rigid support on the backside, and the welding joint exhibits satisfactory performance.

Compared with other heavy-duty robotic arms and gantry-type friction stir welding robots, this robot can achieve online welding without disassembling the vehicle body, and it requires less axial force. This lays the foundation for the future promotion of lightweight equipment.

The designed friction stir welding robot is capable of performing online repairs without dismantling the aluminum alloy truck body, even in situations where sufficient upset force is unavailable. It ensures welding quality and exhibits high efficiency. This approach is considered novel in the field of lightweight online welding repairs, both domestically and internationally.

Wire-arc-based additive manufacturing (WAAM) is a promising technology for the efficient and economical fabrication of medium-large components. However, the anisotropic behavior of the multilayered WAAM-fabricated components remains a challenging problem.

The purpose of this paper is to conduct a comprehensive study of the grain morphology, crystallographic orientation and texture in three regions of the WAAM printed component. Furthermore, the interdependence of the grain morphology in different regions of the fabricated component with their mechanical and tribological properties was established.

The electron back-scattered diffraction analysis of the top and bottom regions revealed fine recrystallized grains, whereas the middle regions acquired columnar grains with an average size of approximately 8.980 µm. The analysis revealed a higher misorientation angle and an intense crystallographic texture in the upper and lower regions. The investigations found a higher microhardness value of 168.93 ± 1.71 HV with superior wear resistance in the bottom region. The quantitative evaluation of the residual stress detected higher compressive stress in the upper regions. Evidence for comparable ultimate tensile strength and greater elongation (%) compared to its wrought counterpart has been observed.

The study found a good correlation between the grain morphology in different regions of the WAAM-fabricated component and their mechanical and wear properties. The Hall–Petch relationship also established good agreement between the grain morphology and tensile test results. Improved ductility compared to its wrought counterpart was observed. The anisotropy exists with improved mechanical properties along the longitudinal direction. Moreover, cylindrical components have superior tribological properties compared with cuboidal components.

The purpose of this study is to investigate the influence of varying concentrations of nano-SiO₂ particle doping on the structure and properties of the micro-arc oxidation (MAO) coating of 7075 aluminum alloy. This research aims to provide novel insights and methodologies for the surface treatment and protection of 7075 aluminum alloy.

The surface morphology of the MAO coating was characterized using scanning electron microscope. Energy spectrometer was used to characterize the elemental content and distribution on the surface and cross section of the MAO coating. The phase composition of the MAO coating was characterized using X-ray diffractometer. The corrosion resistance of the MAO coating was characterized using an electrochemical workstation.

The results showed that when the addition of nano-SiO₂ particles is 3 g/L, the corrosion resistance is optimal.

This study investigated the influence of different concentrations of nano-SiO₂ particles on the structure and properties of the MAO coating of 7075 aluminum alloy.

In this paper, the authors aim to study the effect of hydrogen on the pitting corrosion behavior of Incoloy 825, a commonly used material for heat exchanger tubes in hydrogenated heat exchangers.

The pitting initiation and propagation behaviors were investigated by electrochemical and chemical immersion experiments and observed and analyzed by scanning electron microscope and energy dispersive spectrometer methods.

The results show that hydrogen significantly affects the electrochemical behavior of Incoloy 825; the self-corrosion potential decreased from −197 mV before hydrogen charging to −263 mV, −270 mV and −657 mV after hydrogen charging, and the corrosion current density increased from 0.049 µA/cm² before hydrogen charging to 2.490 µA/cm², 2.560 µA/cm² and 2.780 µA/cm² after hydrogen charging. The pitting susceptibility of the material increases.

Hydrogen is enriched on the precipitate, and the pitting corrosion also initiates at that location. The synergistic effect of hydrogen and precipitate destroys the passive film on the metal surface and promotes pitting initiation.

The purpose of this study is to reveal the effect of nano-Al₂O₃ particle addition on the nucleation/growth kinetics, microhardness, wear resistance and corrosion resistance of Co–P–xAl₂O₃ nanocomposite plating.

The kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating prepared by electroplating were investigated by electrochemical measurements, scanning electron microscopy, X-ray diffraction, X-ray photoelectron spectroscopy, Vickers microhardness measurement, SRV5 friction and wear tester and atomic force microscopy.

A 12 g/L nano-Al₂O₃ addition in the plating solution can transform the nucleation/growth kinetics of the plating from the 3D progressive model to the 3D instantaneous model. The microhardness of the plating increased with the increase of nano-Al₂O₃ content in plating. The wear resistance of the plating did not adhere strictly to Archard’s law. An even and denser corrosion product film was generated due to the finer grains, with a high corrosion resistance.

The effect of different nano-Al₂O₃ addition on the nucleation/growth kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating was investigated, and an anticorrosion mechanism of Co–P–xAl₂O₃ nanocomposite plating was proposed.

The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.

This examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.

The utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.

The main objective of the present research is to investigate the benefits of using geogrid reinforcement in minimizing the rate of deterioration of ballasted rail track geometry resting on soft clay and to explore the effect of load amplitude, load frequency, presence of geogrid layer in ballast layer and ballast layer thickness on the behavior of track system. These variables are studied both experimentally and numerically. This paper examines the effect of geogrid reinforced ballast laying on a layer of clayey soil as a subgrade layer, where a half full scale railway tests are conducted as well as a theoretical analysis is performed.

The experimental tests work consists of laboratory model tests to investigate the reduction in the compressibility and stress distribution induced in soft clay under a ballast railway reinforced by geogrid reinforcement subjected to dynamic load. Experimental model based on an approximate half scale for general rail track engineering practice is adopted in this study which is used in Iraqi railways. The investigated parameters are load amplitude, load frequency and presence of geogrid reinforcement layer. A half full-scale railway was constructed for carrying out the tests, which consists of two rails 800 mm in length with three wooden sleepers (900 mm × 90 mm × 90 mm). The ballast was overlying 500 mm thick clay layer. The tests were carried out with and without geogrid reinforcement, the tests were carried out in a well tied steel box of 1.5 m length × 1 m width × 1 m height. A series of laboratory tests were conducted to investigate the response of the ballast and the clay layers where the ballast was reinforced by a geogrid. Settlement in ballast and clay, was measured in reinforced and unreinforced ballast cases. In addition to the laboratory tests, the application of numerical analysis was made by using the finite element program PLAXIS 3D 2013.

It was concluded that the settlement increased with increasing the simulated train load amplitude, there is a sharp increase in settlement up to the cycle 500 and after that, there is a gradual increase to level out between, 2,500 and 4,500 cycles depending on the load frequency. There is a little increase in the induced settlement when the load amplitude increased from 0.5 to 1 ton, but it is higher when the load amplitude increased to 2 ton, the increase in settlement depends on the geogrid existence and the other studied parameters. Both experimental and numerical results showed the same behavior. The effect of load frequency on the settlement ratio is almost constant after 500 cycles. In general, for reinforced cases, the effect of load frequency on the settlement ratio is very small ranging between 0.5 and 2% compared with the unreinforced case.

Increasing the ballast layer thickness from 20 cm to 30 cm leads to decrease the settlement by about 50%. This ascertains the efficiency of ballast in spreading the waves induced by the track.

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis.

During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations.

This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.