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The purpose of this paper is to provide a method and system to achieve automated measurement of micro drill bit wear.

A method and system of automated measurement of micro drill bit wear on the basis of machine vision are presented. Experiments are conducted to verify the developed method and system.

The worn area of the primary face is an appropriate index to reflect the wear condition of a micro drill bit. A machine vision based technique is an applicable tool for capturing and characterising images of worn micro drill bit. The developed system can accurately measure and characterise the wear performance of micro drill bits with different materials and different parameter designs.

The paper highlights the method and the system for achieving automated measurement of micro drill bit wear. The developed method and system can provide fast and precise evaluation of micro drill bit wear.

The paper aims to investigate tool wear mechanism and tool geometry optimization of drilling PCB fixture hole.

An experimental study was carried out to investigate the chip formation and tool wear mechanism of drilling PCB fixture holes. Two types of drill with different types of chip-split groove were used in this study. The performances of these two types of drill bots were evaluated by tool wear and the shapes of chips.

The chips of drilling fixture holes contain aluminum chips from the cover board, copper chips from the copper foil, discontinuous glass fiber and resin from the CFRP. Feed rate and drilling speed have a great influence on the chip morphology. Abrasive wear of the drill lip is the main reason of the fixture drill bit in drilling PCB, and micro-chipping is observed on the tool nose and chisel edge. The influence of distance between the chip-split groove and drill point center on the axial force and torque is not obvious.

In this paper, hole wall roughness and drilling temperature were not analyzed in the optimization of drilling parameters. The future research work should consider them.

This paper investigated the mechanism of burr formation and tool wear in drilling of PCB fixture holes. Tool geometry was optimized by adding chip-split grooves.

Micro-holes are drilled and plated in flexible printed circuit boards (FPCs) for connecting circuits from different layers. More holes, with diameters smaller than 0.3 mm, are required to be drilled in smaller areas with flexible circuits’ miniaturization. The micro-hole quality of micro-drilling is one of the biggest issues of the flexible circuit manufacturers’ production. However, it is not easy to control the quality of micro-holes. The purpose of this study was to conduct research on the tool wear characteristics of FPC drilling process and its influence on micro-hole quality to improve the micro-hole quality of FPC.

The tool-wear characteristics of micro-drills after FPC drilling were observed. The influence of spindle speed, feed rate, number of drilled holes and entry board materials on tool-wear was analyzed. The hole qualities of FPC micro-drilling were measured and observed. The relationship between tool-wear and hole quality was analyzed.

The result showed that the tool-wear characteristics of FPC micro-drilling was similar to the tool-wear characteristics of rigid printed circuit board (RPC) micro-drilling. Abrasive wear occurred on both the main cutting edges and the chisel edges of micro-drills, even though there was no glass fiber reinforcing the cloth inside FPC. Resin adhesion was observed on the chisel edge. The influence of feed and number of drilled holes on tool-wear was significant. Tool-wear significantly influences the hole quality of FPC. Tool-wear will largely decrease the hole position accuracy of FPC micro-holes. Tool-wear will increase the thickness of PI nail heads and the height of exit burrs. Fracture was the main difference between tool wear of FPC and RPC micro-drilling. Resin adhesion of RPC was much more severe than FPC micro-drilling. Increasing the spindle speed properly may improve tool life and hole quality.

The technology and manufacturing of FPC has been little investigated. Research on micro-drilling FPC and research data is lacking so far. The micro-hole quality directly affects the reliability of FPC. Thus, improving the micro-hole quality of FPC is very important.

Compared with the traditional printed circuit board (PCB) drilling process, the technology of drilling IC substrate is facing more problems, such as much smaller hole diameter, more intensive hole space, thinner sheet and more complicated materials are drilled in process. Moreover, the base material of IC substrate is different from traditional PCB, more kinds of fillers added in IC substrate which make the drill worn seriously during drilling process. Micro-drills wear and micro holes quality are the most important questions when drilling IC substrate so far. Wear morphology of micro-drill, holes wall roughness and hole location accuracy are researched in this paper. The influence factors of micro-drills wear and micro holes quality are also studied in this drilling process. The paper aims to discuss these issues.

Two drills with same structure and different diameter are used to drill different stacks of IC substrate and drill different holes in this paper. There are four experiments made and the drilling parameters including spindle speed (n), feed rate (v_f) and retraction speed (v_r) are recommended by drill manufacturing company. Wear morphologies of drill are observed, holes wall roughness (R_max) and holes location accuracy (C_pk) are measured in this paper. Analyzing the main factors influence on drill wear, holes wall roughness and holes location accuracy through these experiments.

The micro-drills of IC substrate wear more severely compared with other material of PCB through the experimental results in this paper. Drill diameter has influence on micro-drill wear when drilling IC substrate, the smaller of drill is, the more severely of micro-drill wears. Drill diameter affect the holes wall roughness too, the holes wall roughness of larger holes is better than smaller one in a certain range. The drilled holes number also has influence on micro-drills wear, holes wall roughness and holes location accuracy. The more drilled holes, the seriously of micro-drills wear, and the worn drill would destroy the hole quality. Therefore, the more drilled holes lead the bad holes wall roughness and holes location accuracy in this paper. In addition, stacks of IC substrate affect much on the holes location accuracy, the more stacks, the worse holes location accuracy.

Chinese Mainland is obviously lagging behind in technology and manufacturer of IC substrate which is incompatible with the nation circumstances. There is few research of drilling IC substrate in China and research data are lacking so far. It is most necessary to improve the technology level of drilling IC substrate in China. In order to reduce the wear of micro-drills and improve the quality of micro-holes, many experimental tests about drilling IC substrate are researched in this paper.

The purpose of this study is to solve the oil drill pipe joints and casing excessive wear problems and to improve the drill pipe joint-casing wear resistance and anti-friction properties.

On the surface of the drill pipe joints using oxyacetylene flame bead weld (BW) wear-resistant welding wire ARNCO-100XT^TM prepares welding layer, high-velocity oxygen fuel (HVOF) Cr₃C₂75-NiCr25 prepares coating and subsonic flame spray and remelt (SFSR) Ni60 prepares coating, then comparing and analyzing the friction and wear of the three types of wear-resistant layers and the casing under the condition of 1.8 g/cm³ mud drilling fluid lubrication. The wear resistance and anti-friction performance of the drill pipe joints were evaluated based on the wear situation, finally revealing its friction and wear mechanisms.

Three types of wear-resistant layers can improve the surface wear resistance of drill pipe joints, the wear-resistant layer and the substrate are well combined and the welding layers and coating are both dense and uniform. The wear resistance of the HVOF-Cr₃C₂75-NiCr25 coating is 10.9 times that of the BW-ARNCO-100XT^TM weld layer, and the wear resistance of the SFSR-Ni60 weld layer is 2.45 times that of the BW-ARNCO-100XT^TM weld layer. The anti-friction properties of SFSR-Ni60 welding layer is the best, followed by HVOF-Cr₃C₂75-NiCr25 coating, and the anti-friction properties of BW-ARNCO-100XT^TM welding layer is the worst among the three.

The research results of this paper have great practical value in the process and material of improving the wear resistance and anti-friction performance of the drill pipe joint casing.

This paper aims to investigate and document the effects of copper-clad laminate (CCL) inorganic filler on the hole performance in printed circuit boards drilling process.

Drilling of brittle laminates can result in hole cracking, layer-to-layer delamination and drill-bit wear and tool breakage. Adding large amount of fillers not only shortens the life of the drilling tool but also affects the drilling properties significantly regarding hole quality. This paper introduces the influence of filler content, type, hardness, particle size and the compounding method in the manufacture of the CCL on the drilling performance.

The filler content, filler type, hardness of filler, particle size of filler and the compounding method used for the filler have a great influence on the drilling properties of CCL. The higher the filler content, the larger the particle size and the more the hardness of the filler, the worse the drilling properties. The combination of hard particles like silica with softer particles can improve the drilling performance of CCL.

The paper describes what affects the drilling performance of CCL and how this knowledge can be used to design CCL with good drilling performance.

In an integrated circuit (IC) substrate, more fillers, including talcum powder and aluminium hydroxide, are added, which leads to much higher rigidity and hardness compared with a traditional printed circuit board. However, the micro drilling of IC substrates is harder. This paper aims to test the drilling process of IC substrates to improve the drilling process and the micro hole quality.

Substrate drilling by a micro drill with 0.11-mm diameter was used under several drilling conditions. The influence of drilling conditions on the drilling process was observed. Drilling forces, drill wear and micro hole quality were also studied.

The deformation circle around holes, hole location accuracy, bugle hole and burrs were the major defects of micro holes that were observed during the drilling of the substrate. Reducing the drilling force and drill wear was the effective way to improve hole quality.

The technology and manufacturing of IC substrates has been little investigated. Research data on drilling IC substrates is lacking. The micro hole quality directly affects the reliability of IC substrates. Thus, improving the drilling technology of IC substrates is very important.

The objective of this study is to develop an automated tool condition monitoring scheme for PCB drilling.

Vibration signals are used to distinguish micro drill wear stages with proper features extraction and classifier design. Then a tool condition monitoring system is built up through a back propagation neural network (BPNN).

Experimental results show that BPNN is a practical method of modeling tool wear, and with this method a tool condition monitoring system is built up using energy ratio, root mean square (RMS) and kurtosis coefficient that transformed by vibration signals.

In the further investigation, more signal samples should be computed as monitoring features for BPNN modeling. In addition, in order to build the best monitoring model, it is necessary to evaluate the performance of the BPNN model in advance, and optimize the process.

The paper provides a method and a system for PCB drill wear monitoring. The method and system can achieve on‐line monitoring of PCB drill condition.

The flexible printed circuit (FPC) board with the characteristic of light and thin strengthened confronted the growing miniaturization requirements of the electronic product and the popularity of wearable devices. The reliability of circuit could be influenced by the hole quality of FPC, such as burrs, which is one of the major problem in FPC.

In this paper, micro-drill with a diameter of 0.1 mm was used to drill the double-sided flexible copper clad laminate. The thrust force, the burr and tool wear were investigated. The influencing factors of the height of the burrs were studied. The relationship between the thrust force and the height of the burrs was also explored. Finally, the formation mechanism of burrs was analyzed.

The entrance burrs were usually less than the exit burrs. The burr height increased with the feed per rotation. The height of the burr increased with the increase of the thrust force for the plastic deformation of the copper foil was dominant. The abrasion of the drill gave rise to increase the height of burr. In micro-hole drilling, the growth of burrs can be suppressed effectively by reducing the clearance between the FPC and the backup plate. The thrust force would be controlled in a certain range to reduce the burr with specific drilling parameters. There existed a certain relationship of Gaussian distribution between the height of the burrs and the thrust force of FPC.

The reliability of the integrated circuit was directly affected by the burrs of the FPC. This research on the formation mechanism of FPC burrs and forecast of burr height provided a firm foundation for further work in the area of improvement of the micro-hole quality.

Large capacity current carrier printed circuit board (PCB) imposes strict control requirements on the hole wall roughness. The key factors are chip removal, drilling temperature and tool wear. This paper aims to find out a cryogenic drilling process to control the chip removal, chip morphology, tool wear and finally reduce the hole wall roughness.

The chip removal process, chip morphology, tool wear and hole wall roughness of glass fiber epoxy resin copper clad laminate (FR-4) drilling were observed and analyzed. The influence of cold air on the chip removal process, chip morphology, tool wear and hole wall roughness was also investigated. An optimization process of cold air auxiliary drilling was proposed to control the hole wall roughness of FR-4.

The results showed that the discharge time of copper foil chips with obvious characteristics can be used as the evaluation criterion for the smoothness of chip removal. The cold air can promote chip removal and reduce tool wear. In addition, the chip removal and cooling performance will be the best when using −4.7 °C cold air with the injection angle consisted with the angle of helical flute of the drill. The hole wall roughness of FR-4 could be controlled by drilling with −4.7°C cold air.

This paper was the first study of the effect of three kinds of cold air on PCB drilling. This provided a reference for the possibility that the cryogenic drilling methods apply to PCB drilling. A new cold air auxiliary drilling process was developed for large capacity current carrier FR-4 manufacturing.