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Large capacity current carrier printed circuit board (PCB) imposes strict control requirements on the hole wall roughness. The key factors are chip removal, drilling temperature and tool wear. This paper aims to find out a cryogenic drilling process to control the chip removal, chip morphology, tool wear and finally reduce the hole wall roughness.

The chip removal process, chip morphology, tool wear and hole wall roughness of glass fiber epoxy resin copper clad laminate (FR-4) drilling were observed and analyzed. The influence of cold air on the chip removal process, chip morphology, tool wear and hole wall roughness was also investigated. An optimization process of cold air auxiliary drilling was proposed to control the hole wall roughness of FR-4.

The results showed that the discharge time of copper foil chips with obvious characteristics can be used as the evaluation criterion for the smoothness of chip removal. The cold air can promote chip removal and reduce tool wear. In addition, the chip removal and cooling performance will be the best when using −4.7 °C cold air with the injection angle consisted with the angle of helical flute of the drill. The hole wall roughness of FR-4 could be controlled by drilling with −4.7°C cold air.

This paper was the first study of the effect of three kinds of cold air on PCB drilling. This provided a reference for the possibility that the cryogenic drilling methods apply to PCB drilling. A new cold air auxiliary drilling process was developed for large capacity current carrier FR-4 manufacturing.

This paper discusses chip removal and replacement processes of flip chip assemblies (FCAs) on printed wiring boards (PWBs). The original chip connection is achieved via mass reflow as in a surface mount assembly process. The FCA interconnection is one involving a surrogate solder bump on a chip and a lower melt solder on the PWB pads that fuses with the bump during reflow. The chip removal process thus entails melting the lower melt solder locally using hot gas. The following considerations will be discussed in the paper: chip size, chip removal methodology, local vs mass reflow for replacement attachment, solder height, the impact of multiple reflows on the solder joint integrity of assemblies. The use of the flip chip rework machine to remove ball grid arrays (BGAs) and quad flatpacks (QFPs) will be briefly addressed.

This paper will review rework of multi‐chip modules (MCMs). The issues of die removal from substrates (i.e., PCBs) with different chip‐to‐substrate interconnect technologies will be explored in detail. These different interconnect technologies (e.g., wire bonding, tape automated bonding and flip chip bonding) and die‐attachment methods (e.g., eutectic and adhesive) have a strong influence on the MCM rework process and equipment selection. Traditional surface mount (SM) and current MCM rework technologies are also compared. It will be shown that traditional SMT rework processes and equipment are unable to solve the level of difficulty involved in fine‐pitch MCM device removal—especially for systems which require heat removal through the substrate.

Machining operations on multilayer circuit boards play the two major roles of establishing the finished geometry of the board and leading to the interconnection of the various conductor layers and it is likely that for some considerable time carbide cutting tools will continue to be used in the machining process. Fundamental and detailed considerations of the parameters influencing machining are presented prior to analysing the two predominant areas of use. Mention is made of some advanced machining techniques, involving mechanical, chemical and laser methods.

Component removal for rework and repair is traditionally achieved by re‐melting of the solder, but the exposure of the assembly or its component parts to repeated soldering/ desoldering cycles may cause both immediate damage and create a significant long term reliability hazard. Rework is labour intensive and requires skilled operators. Area array components further increase the complexity of the rework process because of the number and inaccessibility of the solder joints. There is a growing requirement to recycle/reclaim electronic waste, creating the need for an effective process for dismantling of printed circuit board assemblies (PCBAs). This paper will present a brief review of alternative non‐thermal techniques for rework or dismantling of conventional soldered assemblies, including both chemical etchants and mechanical techniques. Results will then be presented on trials of chemical etchants, where rates of solder removal consistent with realistic times for component removal have been readily achieved using commercially available tin‐lead strippers. Electrochemical techniques are also shown to be usable in specific applications, i.e. where electrical contact can be readily made to the solder joints to be removed, and have the advantage of reclaiming the removed solder directly from the electrolyte.

FROM a machinability aspect, stainless steels may be classified into three categories, the general analysis of which influences the machinability factor.

This paper aims to examine an investigation of high-pressure coolant (HPC) drilling process with regard to experimental models of output parameters, effect of input parameters on output parameters and simultaneous optimization of the output parameters.

Experimental plan was designed using response surface method and experiments were conducted on HPC drilling set up. Measurements for output parameters were carried out and mathematical models were obtained. Multi response optimization using a composite desirability function approach was used to obtain optimum values of input parameters for simultaneous optimization of output parameters.

Optimal value of input parameters for optimization of HPC drilling process were obtained as; coolant pressure: 21 bar, spindle speed: 3,970 rpm, feed rate: 0.084 mm/rev and peck depth: 5.50 mm. The composite desirability obtained is 0.9412, which indicates that the performance of HPC drilling process was significantly optimized. Developed mathematical models of the output parameters accurately represent the entire design space under investigation.

This is the first study that involves variation of higher coolant pressure and investigation of HPC drilling process using response surface methodology and multi response optimization technique with desirability function.

Compared with the traditional printed circuit board (PCB) drilling process, the technology of drilling IC substrate is facing more problems, such as much smaller hole diameter, more intensive hole space, thinner sheet and more complicated materials are drilled in process. Moreover, the base material of IC substrate is different from traditional PCB, more kinds of fillers added in IC substrate which make the drill worn seriously during drilling process. Micro-drills wear and micro holes quality are the most important questions when drilling IC substrate so far. Wear morphology of micro-drill, holes wall roughness and hole location accuracy are researched in this paper. The influence factors of micro-drills wear and micro holes quality are also studied in this drilling process. The paper aims to discuss these issues.

Two drills with same structure and different diameter are used to drill different stacks of IC substrate and drill different holes in this paper. There are four experiments made and the drilling parameters including spindle speed (n), feed rate (v_f) and retraction speed (v_r) are recommended by drill manufacturing company. Wear morphologies of drill are observed, holes wall roughness (R_max) and holes location accuracy (C_pk) are measured in this paper. Analyzing the main factors influence on drill wear, holes wall roughness and holes location accuracy through these experiments.

The micro-drills of IC substrate wear more severely compared with other material of PCB through the experimental results in this paper. Drill diameter has influence on micro-drill wear when drilling IC substrate, the smaller of drill is, the more severely of micro-drill wears. Drill diameter affect the holes wall roughness too, the holes wall roughness of larger holes is better than smaller one in a certain range. The drilled holes number also has influence on micro-drills wear, holes wall roughness and holes location accuracy. The more drilled holes, the seriously of micro-drills wear, and the worn drill would destroy the hole quality. Therefore, the more drilled holes lead the bad holes wall roughness and holes location accuracy in this paper. In addition, stacks of IC substrate affect much on the holes location accuracy, the more stacks, the worse holes location accuracy.

Chinese Mainland is obviously lagging behind in technology and manufacturer of IC substrate which is incompatible with the nation circumstances. There is few research of drilling IC substrate in China and research data are lacking so far. It is most necessary to improve the technology level of drilling IC substrate in China. In order to reduce the wear of micro-drills and improve the quality of micro-holes, many experimental tests about drilling IC substrate are researched in this paper.

The purpose of this paper is to present a method for the environmental impact analysis of machine-tool cutting, which enables the detailed analysis of inventory data on resource consumption and waste emissions, as well as the quantitative evaluation of environmental impact.

The proposed environmental impact analysis method is based on the life cycle assessment (LCA) methodology. In this method, the system boundary of the cutting unit is first defined, and inventory data on energy and material consumptions are analyzed. Subsequently, through classification, five important environmental impact categories are proposed, namely, primary energy demand, global warming potential, acidification potential, eutrophication potential and photochemical ozone creation potential. Finally, the environmental impact results are obtained through characterization and normalization.

This method is applied on a case study involving a machine-tool turning unit. Results show that primary energy demand and global warming potential exert the serious environmental impact in the turning unit. Suggestions for improving the environmental performance of the machine-tool turning are proposed.

The environmental impact analysis method is applicable to different machine tools and cutting-unit processes. Moreover, it can guide and support the development of green manufacturing by machinery manufacturers.

THE article that appears in this issue entitled ‘Machine Design and the Work Study Analyst’ illustrates that the techniques of work study can be equally well applied in fields outside of production.