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Large capacity current carrier printed circuit board (PCB) imposes strict control requirements on the hole wall roughness. The key factors are chip removal, drilling temperature and tool wear. This paper aims to find out a cryogenic drilling process to control the chip removal, chip morphology, tool wear and finally reduce the hole wall roughness.

The chip removal process, chip morphology, tool wear and hole wall roughness of glass fiber epoxy resin copper clad laminate (FR-4) drilling were observed and analyzed. The influence of cold air on the chip removal process, chip morphology, tool wear and hole wall roughness was also investigated. An optimization process of cold air auxiliary drilling was proposed to control the hole wall roughness of FR-4.

The results showed that the discharge time of copper foil chips with obvious characteristics can be used as the evaluation criterion for the smoothness of chip removal. The cold air can promote chip removal and reduce tool wear. In addition, the chip removal and cooling performance will be the best when using −4.7 °C cold air with the injection angle consisted with the angle of helical flute of the drill. The hole wall roughness of FR-4 could be controlled by drilling with −4.7°C cold air.

This paper was the first study of the effect of three kinds of cold air on PCB drilling. This provided a reference for the possibility that the cryogenic drilling methods apply to PCB drilling. A new cold air auxiliary drilling process was developed for large capacity current carrier FR-4 manufacturing.

This study aims to investigate the effect of microtextured tools on the geometric morphology of serrated chips, and further improve the cutting performance of polycrystalline cubic boron nitride (PCBN) tool and extend the tool life and the surface quality of the machined surface.

A three-dimensional finite element cutting model of hardened steel AISI D2 with microtextured PCBN tools were established using the finite element software Abaqus, and cutting tests were carried out. Furthermore, the stress distribution in the primary deformation zone was investigated based on the triaxiality of stress, and the influence of microtexture on the geometric morphology of serrated chips and crack development was researched.

The results show that compared with nontexture tools, elliptical pits and wavy grooves microtexture tools have lower serrated degree Gs, higher serrated frequency f per unit length and more miniature serrated step Pc. The serrated phenomenon is intensified because the tensile stress zone of chips generated by nontextured tools is longer than that of elliptic pits and wavy grooves microtexture tools. Simultaneously, the maximum value of triaxiality in the tensile stress zone achieved by nontexture tools is larger than that of the two microtexture tools, and chips obtained by nontextured tools are more susceptible to propagation fractures.

This paper mainly studies the effect of microtexture on chip microgeometry, which is relatively little studied at present. At the same time, this paper has a certain engineering significance for PCBN tool turning hardening steel.

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-05-2023-0149/

This work aims to describe the face milling analysis on Inconel X-750 superalloy using coated carbides. The formed chips and tool wear were further analyzed at different cutting parameters. The various impact of cutting parameters on chip morphology was also analyzed. Superalloys, often referred to as heat-resistant alloys, have exceptional tensile, ductile and creep strength at high operating temperatures and good fatigue strength, and often better corrosion and oxidation resistance at extreme heat. Because of these qualities, these alloys account for more than half of the weight of sophisticated aviation, biomedical and thermal power plants today. Inconel X-750 is a high-temperature nickel-based superalloy that is hard to machine because of its extensive properties. At last, the discussion regarding the tool wear mechanism was analyzed and discussed in this article.

The machining parameters for the study are cutting speed, feed rate and depth of cut. One factor at a time approach was implemented to investigate the effect of cutting parameters on the cutting forces, surface roughness and material removal rate. The scatter plot was plotted between cutting parameters and target functions (cutting forces, surface roughness and material removal rate). The six levels of cutting speed, feed rate and depth of cut were taken as cutting parameters.

The cutting forces are primarily affected by the cutting parameters, tool geometry, work material etc. The maximum forces Fx were encountered at 10 mm/min cutting speed, 0.15 mm/rev feed rate and 0.4 mm depth of cut, further maximum forces Fy were attained at 10 mm/min cutting speed, 0.25 mm/rev feed rate and 0.4 mm depth of cut and maximum forces Fz were attained at 50 mm/min cutting speed, 0.05 mm/rev feed rate and 0.4 mm depth of cut. The maximum surface roughness value was observed at 40 mm/min cutting speed, 0.15 mm/rev feed rate and 0.5 mm depth of cut.

The effect of machining parameters on cutting forces, surface roughness, chip morphology and tool wear for milling of Inconel X-750 high-temperature superalloy is being less researched in the present literature. Therefore, this research paper will give a direction for researchers for further studies to be carried out in the domain of high-temperature superalloys. Furthermore, the different tool wear mechanisms at separate experimental trials have been explored to evaluate and validate the process performance by conducting scanning electron microscopy analysis. Chip morphology has also been evaluated and analyzed under the variation of selected process inputs at different levels.

The paper aims to investigate tool wear mechanism and tool geometry optimization of drilling PCB fixture hole.

An experimental study was carried out to investigate the chip formation and tool wear mechanism of drilling PCB fixture holes. Two types of drill with different types of chip-split groove were used in this study. The performances of these two types of drill bots were evaluated by tool wear and the shapes of chips.

The chips of drilling fixture holes contain aluminum chips from the cover board, copper chips from the copper foil, discontinuous glass fiber and resin from the CFRP. Feed rate and drilling speed have a great influence on the chip morphology. Abrasive wear of the drill lip is the main reason of the fixture drill bit in drilling PCB, and micro-chipping is observed on the tool nose and chisel edge. The influence of distance between the chip-split groove and drill point center on the axial force and torque is not obvious.

In this paper, hole wall roughness and drilling temperature were not analyzed in the optimization of drilling parameters. The future research work should consider them.

This paper investigated the mechanism of burr formation and tool wear in drilling of PCB fixture holes. Tool geometry was optimized by adding chip-split grooves.

This paper presents the results of mean unit weight of chips and their time to ignition measured on a test stand specially designed for this purpose. In addition, the temperature of chips in the cutting area and the morphology of chips produced in HSM milling (as a temperature indicator in the cutting area) are investigated. Also, different fractions of chips produced in the dry milling of Mg alloys AZ31 and AZ91HP by a PCD end mill are examined. Finally, the paper presents conclusions and recommendations with regard to safety and efficiency of dry milling processes for the aforementioned magnesium alloys.

Milling can be used as a finishing operation, particularly when using PCD end mills. The application of this mill type isparticularly important when producing different machine and device components, especially in the aircraft industry. What can occur in dry machining operations is self-ignition. It is therefore justified to investigate chip temperature in the cutting zone, to classify produced chip fractions and to determine their mass. Safe ranges of technological parameters can be additionally determined based on metallographic analysis of chip edge partial-melting.

The experimental results helped determine the effect of technological parameters of milling on chip temperature in the cutting zone, chip mass and fragmentation and chip morphology images.

The results reported in this work are innovative in both cognitive and practical aspect. The authors are convinced that this work can contribute to overcoming the mistrust of industrial practitioners toward dry milling of Mg alloys, and also with respect to the application of relatively higher cutting speeds in dry milling of these alloys than it is common practice in industry today. The study investigates the problem of safety in dry milling of Mg alloys. The study was motivated by the milling process itself and the formation of broken chip, which causes a significant change in the character of heat transfer.

The paper presents a method for multi-criteria safety assessment in dry milling operations. Safe and effective parameter ranges are defined with respect to chip temperature in the cutting zone, fraction number and chip mass.

The purpose of this paper is to examine the quality of the turned surface. The quality of the surface produced depends on the nature of the chips, which are produced while turning metal matrix composites. This quality is a function of the machining parameters, tool material, tool configuration and elements of the composites.

In this study, the turning of AA7075/15 wt.% SiC (particle size 20–40 µm) composites is investigated. Thirty experiments were conducted, and the chip-formation mechanism in turning AA7075/SiCp composites at various combinations of cutting speeds, feed and depth of cuts was studied.

It is observed from the response surface methodology-based experimentation that in turning of coarser reinforcement (particle size 20–40 µm) composites, total gross fracture occurs. This causes small slices of chips and a higher shear plane angle. The nature of chips produced at various combinations of cutting speeds, feed and depth of cuts is different. The chips generated were segmented, spiral in cylindrical form, connected C type, chips with saw tooth, curled chips, washer C type chips, half-curved segmented chips and small-radii segmented chips.

The novelty of this research is that, so far, very little work has been published on the detailed analysis of chips produced during turning of AA7075/15 wt.% SiC (particle size 20–40 µm) composites.

The purpose of this paper is to present a clear picture of the challenges of micro drill bit and the developments of novel micro‐drill bits for flexible circuit boards, environmental‐friendly printed circuit boards (PCBs), high aspect ratio drill bit and ultra‐small micro drill bit, as well as the developments of geometry design of micro drill bit.

The paper details the developments trend and challenges of micro drill and PCBs first. Then the current research status of novel micro drill bits for flexible circuit boards, environmental‐friendly PCBs, high aspect ratio drill bit, ultra‐small micro drill bit are described. Finally, the developments of geometry design and drilling process are reviewed.

To achieve excellent performance for drilling flexible PCB, a large helical angle, large flute/land ratio and small web thickness that guarantee the sharp evacuation capability, are adopted in drill bit design. A small helix angle and an appropriate primary face angle are employed for drill bit to process environmental‐friendly printed circuit boards. It is beneficial to implement big helix angle, small primary face angles and small point angles in the design of ultra‐small micro drill bit. An optimum web thickness and step feed should be taken into consideration in high aspect ratio drill bits design.

The paper reviews different solutions of micro drill bits for the state‐of‐the‐art PCB and the developments of geometry design of drill bit for printed circuit boards.

The purpose of this paper is to determine time-to-ignition of magnesium alloy chips and the ignition-preceding stages as well as to examine chip morphology. The tests were conducted according to the following pattern: directly after a milling operation, after ignition using a special test stand located outside the machine tool and after intensive oxidation which prevented ignition.

Milling is a machining process widely used in the manufacturing of various parts that are applied, e.g. in the aircraft industry. Milling is used for both roughing and finishing machining. In the dry machining of magnesium alloys, spontaneous ignition can occur; therefore, the analysis of chip temperature in the cutting area is of great significance. Additionally, time-to-ignition and chip morphology are crucial when considering the safety of magnesium alloy machining processes.

The experimental results demonstrate the effect of parameters of the milling process on time-to-ignition of chips made of magnesium alloys AZ31 and AZ91HP. The experiments also involved examining the morphology of a selection of chips produced at the maximum cutting velocity vc and feed per tooth fz. In addition, we analysed the morphology of both ignition products and chips subjected to high temperature where ignition did not occur.

Based on the time-to-ignition and chip morphology results, it is possible to indicate both safety levels in machining and the efficient range of parameters in the milling of aircraft parts made of magnesium alloys.

The paper presents a new approach to assessing safety in milling operations. The results of the tests of chip flammability (time-to-ignition) which were run at a special test stand placed outside the machine tool enabled determination of both safety and efficiency range of the milling process.

The purpose of the work is to provide a comprehensive review of the digital image correlation (DIC) technique for those who are interested in performing the DIC technique in the area of manufacturing.

No methodology was used because the paper is a review article.

no fundings.

Herein, the historical development, main strengths and measurement setup of DIC are introduced. Subsequently, the basic principles of the DIC technique are outlined in detail. The analysis of measurement accuracy associated with experimental factors and correlation algorithms is discussed and some useful recommendations for reducing measurement errors are also offered. Then, the utilization of DIC in different manufacturing fields (e.g. cutting, welding, forming and additive manufacturing) is summarized. Finally, the current challenges and prospects of DIC in intelligent manufacturing are discussed.

In the flip‐chip technology (FCT) used in current microelectronic packages, a Ni‐based under‐bump metallurgy (UBM) is widely used due to its slow reaction rate with Sn. In this study, solders joints of eutectic Pb‐Sn with a Ni UBM were employed to investigate the intermetallic compound (IMC) formation after aging at 150°C for various periods of time.

The compositions and elemental re‐distribution in the IMC formed due to the interfacial reaction between the Ni/Cu UBM and eutectic Sn‐Pb solders were evaluated with an electron probe microanalyzer. The interfacial morphologies were revealed with the aid of a field‐emission scanning electron microscope through a special etching technique.

At the centre of the chip side, two IMCs were found between the solder and Ni metallization. The scalloped‐like IMC was determined to be (Cu, Ni)₆Sn₅, while the nodule‐like IMC was (Ni,Cu)₃Sn₄. However, at the edge of the chip side, three IMCs were revealed. The scalloped‐like IMC was (Cu_1−y,Ni_y)₆Sn₅, the nodule‐like IMC was (Ni_1−x,Cu_x)₃Sn₄, and the layer‐type IMC was (Cu_1−z,Ni_z)₃Sn.

On the basis of the elemental distributions from the quantitative analysis of the IMC and the related phase transitions during the IMC formation, two distinct diffusion paths are proposed to illustrate the interfacial reaction and phase transformation between IMCs and solder in Sn‐Pb joints aged at 150°C. These diffusion paths demonstrated two kinds of phase equilibrium, including (Cu_1−z,Ni_z)₃Sn/(Cu_1−y,Ni_y)₆Sn₅/solder and (Ni_1−x,Cu_x)₃Sn₄/(Cu_1−yNi_y)₆Sn₅/solder.