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Nanotechnology (NT) advancements in personal protective textiles (PPT) or personal protective equipment (PPE) have alleviated spread and transmission of this highly contagious viral disease, and enabled enhancement of PPE, thereby fortifying antiviral behavior.

Review of a series of state of the art research papers on the subject matter.

This paper expounds on novel nanotechnological advancements in polymeric textile composites, emerging applications and fight against COVID-19 pandemic.

As a panacea to “public droplet prevention,” textiles have proven to be potentially effective as environmental droplet barriers (EDBs).

PPT in form of healthcare materials including surgical face masks (SFMs), gloves, goggles, respirators, gowns, uniforms, scrub-suits and other apparels play critical role in hindering the spreading of COVID-19 and other “oral-respiratory droplet contamination” both within and outside hospitals.

When used as double-layers, textiles display effectiveness as SFMs or surgical-fabrics, which reduces droplet transmission to <10 cm, within circumference of ∼0.3%.

NT advancements in textiles through nanoparticles, and sensor integration within textile materials have enhanced versatile sensory capabilities, robotics, flame retardancy, self-cleaning, electrical conductivity, flexibility and comfort, thereby availing it for health, medical, sporting, advanced engineering, pharmaceuticals, aerospace, military, automobile, food and agricultural applications, and more. Therefore, this paper expounds on recently emerging trends in nanotechnological influence in textiles for engineering and fight against COVID-19 pandemic.

The aim of this review is to present together the studies on textile-based moisture sensors developed using innovative technologies in recent years.

The integration levels of the sensors studied with the textile materials are changing. Some research teams have used a combination of printing and textile technologies to produce sensors, while a group of researchers have used traditional technologies such as weaving and embroidery. Others have taken advantage of new technologies such as electro-spinning, polymerization and other techniques. In this way, they tried to combine the good working efficiency of the sensors and the flexibility of the textile. All these approaches are presented in this article.

The presentation of the latest technologies used to develop textile sensors together will give researchers an idea about new studies that can be done on highly sensitive and efficient textile-based moisture sensor systems.

In this paper humidity sensors have been explained in terms of measuring principle as capacitive and resistive. Then, studies conducted in the last 20 years on the textile-based humidity sensors have been presented in detail. This is a comprehensive review study that presents the latest developments together in this area for researchers.

This study aims to evaluate in situ oxidative polymerization of aniline (Ani) as a post-processing method to promote extrusion-based 3D printed parts, made from insulating polymers, to components with functional properties, including electrical conductivity and chemical sensitivity.

Extrusion-based 3D printed parts of polyethylene terephthalate modified with glycol (PETG) and polypropylene (PP) were coated in an aqueous acid solution via in situ oxidative polymerization of Ani. First, the feedstocks were characterized. Densely printed samples were then used to assess the adhesion of polyaniline (PAni) and electrical conductivity on printed parts. The best feedstock candidate for PAni coating was selected for further analysis. Last, a Taguchi methodology was used to evaluate the influence of printing parameters on the coating of porous samples. Analysis of variance and Tukey post hoc test were used to identify the best levels for each parameter.

Colorimetry measurements showed significant color shifts in PP samples and no shifts in PETG samples upon pullout testing. The incorporation of PAni content and electrical conductivity were, respectively, 41% and 571% higher for PETG in comparison to PP. Upon coating, the surface energy of both materials decreased. Additionally, the dynamic mechanical analysis test showed minimal influence of PAni over the dynamic mechanical properties of PETG. The parametric study indicated that only layer thickness and infill pattern had a significant influence on PAni incorporation and electrical conductivity of coated porous samples.

Current literature reports difficulties in incorporating PAni without affecting dimensional precision and feedstock stability. In situ, oxidative polymerization of Ani could overcome these limitations. However, its use as a functional post-processing of extrusion-based printed parts is a novelty.

This study aims to improve detection efficiency of fluorescence biosensor or a graphene field-effect transistor biosensor. Graphene field-effect transistor biosensing and fluorescent biosensing were integrated and combined with magnetic nanoparticles to construct a multi-sensor integrated microfluidic biochip for detecting single-stranded DNA. Multi-sensor integrated biochip demonstrated higher detection reliability for a single target and could simultaneously detect different targets.

In this study, the authors integrated graphene field-effect transistor biosensing and fluorescent biosensing, combined with magnetic nanoparticles, to fabricate a multi-sensor integrated microfluidic biochip for the detection of single-stranded deoxyribonucleic acid (DNA). Graphene films synthesized through chemical vapor deposition were transferred onto a glass substrate featuring two indium tin oxide electrodes, thus establishing conductive channels for the graphene field-effect transistor. Using π-π stacking, 1-pyrenebutanoic acid succinimidyl ester was immobilized onto the graphene film to serve as a medium for anchoring the probe aptamer. The fluorophore-labeled target DNA subsequently underwent hybridization with the probe aptamer, thereby forming a fluorescence detection channel.

This paper presents a novel approach using three channels of light, electricity and magnetism for the detection of single-stranded DNA, accompanied by the design of a microfluidic detection platform integrating biosensor chips. Remarkably, the detection limit achieved is 10 pm, with an impressively low relative standard deviation of 1.007%.

By detecting target DNA, the photo-electro-magnetic multi-sensor graphene field-effect transistor biosensor not only enhances the reliability and efficiency of detection but also exhibits additional advantages such as compact size, affordability, portability and straightforward automation. Real-time display of detection outcomes on the host facilitates a deeper comprehension of biochemical reaction dynamics. Moreover, besides detecting the same target, the sensor can also identify diverse targets, primarily leveraging the penetrative and noninvasive nature of light.

The study aims to ascertain the influence of solder conductive particle types and substrate widths on the current carrying capability of flex-on-board (FOB) assemblies. By comparing Sn58Bi and SAC305 particles and varying substrate widths, the research sought to provide insights into the stability and performance of solder joints under different scenarios, particularly in high-power applications.

The study used a comprehensive design/methodology, encompassing the investigation of solder conductive particle types (Sn58Bi and SAC305) and substrate widths on the current carrying capability of FOB assembly. Stable solder joints were obtained by manipulating the curing speed of anisotropic conductive films for both particle types. Various tests were conducted, including current carrying capability assessments under differing conditions.

The study revealed that larger substrate widths yielded higher current carrying capability due to increased contact area and reduced contact resistance. Notably, solder joints remained stable beyond the solder melting temperature due to encapsulation by cured epoxy resin. SAC305 solder joints exhibited superior current carrying capability over Sn58Bi in continuous high-voltage conditions. The results emphasized the stability of SAC305 solder joints and their suitability for robust interconnections in high-power FOB assemblies.

This study contributes by offering a comprehensive assessment of the impact of solder particle types and substrate widths on solder joint performance in FOB assemblies. The finding that SAC305 joints outperform Sn58Bi under continuous high-voltage conditions adds significant value. Moreover, the observation of stable solder joints beyond solder melting temperature due to resin encapsulation introduces a novel aspect to solder joint reliability. These insights provide valuable guidance for designing robust and high-performance interconnections in demanding applications.

This paper aims to present the simulation, fabrication and testing of a novel ultra-wide band (UWB) band-pass filters (BPFs) with better transmission and rejection characteristics on a low-loss Taconic substrate and analyze using the coupled theory of resonators for UWB range covering L, S, C and X bands for radars, global positioning system (GPS) and satellite communication applications.

The filter is designed with a bent coupled transmission line on the top copper layer. Defected ground structures (DGSs) like complementary split ring resonators (CSRRs), V-shaped resonators, rectangular slots and quad circle slots (positioned inwards and outwards) are etched in the ground layer of the filter. The circular orientation of V-shaped resonators adds compactness when linearly placed. By arranging the quad circle slots outwards and inwards at the corner and core of the ground plane, respectively, two filters (Filters I and II) are designed, fabricated and measured. These two filters feature a quasi-elliptic response with transmission zeros (TZs) on either side of the bandpass response, making it highly selective and reflection poles (RPs), resulting in a low-loss filter response. The transmission line model and coupled line theory are implemented to analyze the proposed filters.

Two filters by placing the quad circle slots outwards (Filter I) and inwards (Filter II) were designed, fabricated and tested. The fabricated model (Filter I) provides transmission with a maximum insertion loss of 2.65 dB from 1.5 GHz to 9.2 GHz. Four TZs and five RPs are observed in the frequency response. The lower and upper stopband band width (BW) of the measured Filter I are 1.2 GHz and 5.5 GHz of upper stopband BW with rejection level greater than 10 dB, respectively. Filter II (inward quad circle slots) operates from 1.4 GHz to 9.05 GHz with 1.65 dB maximum insertion loss inside the passband with four TZs and four RPs, which, in turn, enhances the filter characteristics in terms of selectivity, flatness and stopband. Moreover, 1 GHz BW of lower and upper stopbands are observed. Thus, the fabricated filters (Filters I and II) are therefore evaluated, and the outcomes show good agreement with the electromagnetic simulation response.

The limitation of this work is the back radiation caused by DGS, which can be eradicated by placing the filter in the cavity and retaining its performance.

The proposed UWB BPFs with novel resonators find their role in the UWB range covering L, S, C and X bands for radars, GPS and satellite communication applications.

To the best of the authors’ knowledge, for the first time, the authors develop a compact UWB BPFs (Filters I and II) with BW greater than 7.5 GHz by combining reformed coupled lines and DGS resonators (CSRRs, V-shaped resonators [modified hairpin resonators], rectangular slots and quad circle slots [inwards and outwards]) for radars, GPS and satellite communication applications.

Based on the micro-electro-mechanical system (MEMS) technology, acoustic emission sensors have gained popularity owing to their small size, consistency, affordability and easy integration. This study aims to provide direction for the advancement of MEMS acoustic emission sensors and predict their future potential for structural health detection of microprecision instruments.

This paper summarizes the recent research progress of three MEMS acoustic emission sensors, compares their individual strengths and weaknesses, analyzes their research focus and predicts their development trend in the future.

Piezoresistive, piezoelectric and capacitive MEMS acoustic emission sensors are the three main streams of MEMS acoustic emission sensors, which have their own advantages and disadvantages. The existing research has not been applied in practice, and MEMS acoustic emission sensor still needs further research in the aspects of wide frequency/high sensitivity, good robustness and integration with complementary metal oxide semiconductor. MEMS acoustic emission sensor has great development potential.

In this paper, the existing research achievements of MEMS acoustic emission sensors are described systematically, and the further development direction of MEMS acoustic emission sensors in the future research field is pointed out. It provides an important reference value for the actual weak acoustic emission signal detection in narrow structures.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

Field-effect transistor (FET) has excellent electronic properties and inherent signal amplification, and with the development of nanomaterials technology, FET biosensors with nanomaterials as channels play an important role in the field of heavy metal ion detection. This paper aims to review the research progress of silicon nanowire, graphene and carbon nanotube field-effect tube biosensors for heavy metal ion detection, so as to provide technical support and practical experience for the application and promotion of FET.

The article introduces the structure and principle of three kinds of FET with three kinds of nanomaterials, namely, silicon nanowires, graphene and carbon nanotubes, as the channels, and lists examples of the detection of common heavy metal ions by the three kinds of FET sensors in recent years. The article focuses on the advantages and disadvantages of the three sensors, puts forward measures to improve the performance of the FET and looks forward to its future development direction.

Compared with conventional instrumental analytical methods, FETs prepared using nanomaterials as channels have the advantages of fast response speed, high sensitivity and good selectivity, among which the diversified processing methods of graphene, the multi-heavy metal ions detection of silicon nanowires and the very low detection limit and wider detection range of carbon nanotubes have made them one of the most promising detection tools in the field of heavy metal ions detection. Of course, through in-depth analysis, this type of sensor has certain limitations, such as high cost and strict process requirements, which are yet to be solved.

This paper elaborates on the detection principle and classification of field-effect tube, investigates and researches the application status of three kinds of FET biosensors in the detection of common heavy metal ions. By comparing the advantages and disadvantages of each of the three sensors in practical applications, the paper focuses on the feasibility of improvement measures, looks forward to the development trend in the field of heavy metal detection and ultimately promotes the application of field-effect tube development technology to continue to progress, so that its performance continues to improve and the application field is constantly expanding.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.