Search results

1 – 10 of 40
Article
Publication date: 18 March 2024

Min Zeng, Jianxing Xie, Zhitao Li, Qincheng Wei and Hui Yang

This study aims to introduce a novel technique for nonlinear sensor time constant estimation and sensor dynamic compensation in hot-bar soldering using an extended Kalman filter…

Abstract

Purpose

This study aims to introduce a novel technique for nonlinear sensor time constant estimation and sensor dynamic compensation in hot-bar soldering using an extended Kalman filter (EKF) to estimate the temperature of the thermocouple.

Design/methodology/approach

Temperature optimal control is combined with a closed-loop proportional integral differential (PID) control method based on an EKF. Different control methods for measuring the temperature of the thermode in terms of temperature control, error and antidisturbance are studied. A soldering process in a semi-industrial environment is performed. The proposed control method was applied to the soldering of flexible printed circuits and circuit boards. An infrared camera was used to measure the top-surface temperature.

Findings

The proposed method can not only estimate the soldering temperature but also eliminate the noise of the system. The performance of this methodology was exemplary, characterized by rapid convergence and negligible error margins. Compared with the conventional control, the temperature variability of the proposed control is significantly attenuated.

Originality/value

An EKF was designed to estimate the temperature of the thermocouple during hot-bar soldering. Using the EKF and PID controller, the nonlinear properties of the system could be effectively overcome and the effects of disturbances and system noise could be decreased. The proposed method significantly enhanced the temperature control performance of hot-bar soldering, effectively suppressing overshoot and shortening the adjustment time, thereby achieving precise temperature control of the controlled object.

Details

Soldering & Surface Mount Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 16 April 2024

Jinwei Zhao, Shuolei Feng, Xiaodong Cao and Haopei Zheng

This paper aims to concentrate on recent innovations in flexible wearable sensor technology tailored for monitoring vital signals within the contexts of wearable sensors and…

Abstract

Purpose

This paper aims to concentrate on recent innovations in flexible wearable sensor technology tailored for monitoring vital signals within the contexts of wearable sensors and systems developed specifically for monitoring health and fitness metrics.

Design/methodology/approach

In recent decades, wearable sensors for monitoring vital signals in sports and health have advanced greatly. Vital signals include electrocardiogram, electroencephalogram, electromyography, inertial data, body motions, cardiac rate and bodily fluids like blood and sweating, making them a good choice for sensing devices.

Findings

This report reviewed reputable journal articles on wearable sensors for vital signal monitoring, focusing on multimode and integrated multi-dimensional capabilities like structure, accuracy and nature of the devices, which may offer a more versatile and comprehensive solution.

Originality/value

The paper provides essential information on the present obstacles and challenges in this domain and provide a glimpse into the future directions of wearable sensors for the detection of these crucial signals. Importantly, it is evident that the integration of modern fabricating techniques, stretchable electronic devices, the Internet of Things and the application of artificial intelligence algorithms has significantly improved the capacity to efficiently monitor and leverage these signals for human health monitoring, including disease prediction.

Details

Sensor Review, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0260-2288

Keywords

Article
Publication date: 14 February 2024

Lu Luo, Kang Qi and Hualiang Huang

The purpose of this paper is to investigate the effects of chloride ion concentration and applied bias voltage on the electrochemical migration (ECM) behavior between Cu and Ag…

Abstract

Purpose

The purpose of this paper is to investigate the effects of chloride ion concentration and applied bias voltage on the electrochemical migration (ECM) behavior between Cu and Ag under an NaCl thin electrolyte layer (TEL).

Design/methodology/approach

A self-made experimental setup for the ECM behavior between Cu and Ag was designed. An HD video measurement microscopy was used to observe the typical dendrite/corrosion morphology and pH distribution. Short-circuit time (SCT), short-circuit current density and the influence of the galvanic effect between Cu and Ag on their ECM behavior were studied by electrochemical tests. The surface morphology and composition of dendrite were characterized by FESEM/EDS.

Findings

The SCT increased with increasing NaCl concentration but decreased with increasing applied bias voltage, and the SCT between Cu and Ag was less than that between Cu and Cu because their galvanic effect accelerated the dissolution and migration of Cu. When NaCl concentration was less than or equal to 6 mmol/L, cedar-like dendrite was formed, whereas no dendrite formed and only precipitation occurred at high chloride ion concentration (100 mmol/L). The composition of the dendrite between Cu and Ag was copper.

Research limitations/implications

The significance of this study is to clarify the ECM failure mechanism of printed circuit board (PCB) with an immersion silver surface finish (PCB-ImAg).

Practical implications

This study provides a basic theoretical basis for the selection of protective measures and metal coatings for PCB.

Social implications

The social implication of this study is to predict the service life of PCB.

Originality/value

The ECM behavior of dissimilar metals under a TEL was investigated, the influence of the galvanic effect between them on their ECM was discussed, and the SCT increased with increasing NaCl concentration.

Details

Anti-Corrosion Methods and Materials, vol. 71 no. 2
Type: Research Article
ISSN: 0003-5599

Keywords

Article
Publication date: 18 March 2024

Li Liu, Chunhua Zhang, Ping Hu, Sheng Liu and Zhiwen Chen

This paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with…

Abstract

Purpose

This paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with different structure parameters under increasingly harsh environment.

Design/methodology/approach

A finite element model for a system-in-package module was built with moisture-thermal-mechanical-coupled effects to study the subsequences of hygrothermal conditions.

Findings

It was found in this paper that the moisture diffusion path was mainly dominated by hygrothermal conditions, though structure parameters can affect the moisture distribution. At lower temperatures (30°C~85°C), the direction of moisture diffusion was from the periphery to the center of the module, which was commonly found in simulations and literatures. However, at relatively higher temperatures (125°C~220°C), the diffusion was from printed circuit board (PCB) to EMC due to the concentration gradient from PCB to EMC across the EMC/PCB interface. It was also found that there exists a critical thickness for EMC and PCB during the moisture diffusion. When the thickness of EMC or PCB increased to a certain value, the diffusion of moisture reached a stable state, and the concentration on the die surface in the packaging module hardly changed. A quantified correlation between the moisture diffusion coefficient and the critical thickness was then proposed for structure parameter optimization in the design of system-in-package module.

Originality/value

The different moisture diffusion behaviors at low and high temperatures have seldom been reported before. This work can facilitate the understanding of moisture diffusion within a package and offer some methods about minimizing its effect by design optimization.

Details

Soldering & Surface Mount Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 17 April 2024

Bingyi Li, Songtao Qu and Gong Zhang

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide…

Abstract

Purpose

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

Design/methodology/approach

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Findings

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

Originality/value

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

Details

Soldering & Surface Mount Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 8 August 2023

Larissa Statsenko, Ruchini Senarath Jayasinghe and Claudine Soosay

This study aims to investigate supply network (SN) resilience capabilities across the organizational, supply chain (SC) and industry levels by drawing on the complex adaptive…

Abstract

Purpose

This study aims to investigate supply network (SN) resilience capabilities across the organizational, supply chain (SC) and industry levels by drawing on the complex adaptive systems (CASs) theory and the social–ecological perspective of resilience. An empirically grounded framework operationalizes the concept of social–ecological resilience by expounding resilience capabilities across phases of the CAS adaptive cycle.

Design/methodology/approach

This research uses a qualitative multiple case study approach. It draws on the case of the Australian Defence Manufacturing SN (ADM SN) during COVID-19 disruptions. A total of 28 interviews with senior decision makers from 17 companies, complemented by 5 interviews with the Australian Defence SC organizations and secondary data analysis, support the findings.

Findings

Individual organizations’ SC visibility and flexibility enabled by effective risk management and collaboration enhance the ability of the SN to anticipate and prepare for disruption. At the same time, the strength of SC relationships reduces resilience. SN disruption response velocity is enabled by inventory redundancy, process flexibility at the organizational level and visibility and collaboration at the SC level. Institutional support at the national industry level, development of value-adding capabilities and manufacturing process flexibility at the organizational level enhances the SN’s ability to re-organize. The transition from hierarchical to decentralized collaborative governance enhances SN resilience.

Practical implications

From a practitioner’s perspective, the findings highlight the need to embrace a broader view of SC beyond immediate tiers. Decision-makers in multinational companies must recognize the long-term impact of their procurement decisions on the supplier ecosystem. Developing local supplier capabilities rather than relying on established global SCs will pay off with future resilience. It, however, demands substantial investment and radical changes across all SC tiers. The lesson for smaller firms is not to over-rely on the existing relationships with supply partners. Although trust-based relationships and collaboration are essential, over-commitment can be counterproductive during global disruptions. With a lack of visibility and control over the SC, operational flexibility is critical for small firms to adapt to shifts in supply and demand.

Originality/value

To the best of the authors’ knowledge, this empirical research is one of the first attempts to operationalize the social–ecological perspective of SN resilience. Evidence-based theoretical propositions contribute to the emerging conversation about the CAS nature of resilience by demonstrating the multi-level effects of resilience capabilities.

Details

Supply Chain Management: An International Journal, vol. 29 no. 1
Type: Research Article
ISSN: 1359-8546

Keywords

Article
Publication date: 9 January 2024

Jian Kang, Libei Zhong, Bin Hao, Yuelong Su, Yitao Zhao, Xianfeng Yan and Shuanghui Hao

Most of the linear encoders are based on optics. The accuracy and reliability of these encoders are greatly reduced in polluted and noisy environments. Moreover, these encoders…

Abstract

Purpose

Most of the linear encoders are based on optics. The accuracy and reliability of these encoders are greatly reduced in polluted and noisy environments. Moreover, these encoders have a complex structure and large sensor volume and are thus not suited to small application scenarios and do not have universality. This paper aims to present a new absolute magnetic linear encoder, which has a simple structure, small size and wide application range.

Design/methodology/approach

The effect of swing error is analyzed for the sensor structural arrangement. A double-threshold interval algorithm is then proposed to synthesize multiple interval electrical angles into absolute angles and convert them into actual displacement distances.

Findings

The final linear encoder measurement range is 15.57 mm, and the resolution reaches ± 2 µm. The effectiveness of the algorithm is demonstrated experimentally.

Originality/value

The linear encoder has good robustness, and high measurement accuracy, which is suitable for industrial production. The linear encoder has been mass-produced and used in an electric power-assisted braking system.

Details

Sensor Review, vol. 44 no. 1
Type: Research Article
ISSN: 0260-2288

Keywords

Article
Publication date: 25 March 2024

Boyang Hu, Ling Weng, Kaile Liu, Yang Liu, Zhuolin Li and Yuxin Chen

Gesture recognition plays an important role in many fields such as human–computer interaction, medical rehabilitation, virtual and augmented reality. Gesture recognition using…

Abstract

Purpose

Gesture recognition plays an important role in many fields such as human–computer interaction, medical rehabilitation, virtual and augmented reality. Gesture recognition using wearable devices is a common and effective recognition method. This study aims to combine the inverse magnetostrictive effect and tunneling magnetoresistance effect and proposes a novel wearable sensing glove applied in the field of gesture recognition.

Design/methodology/approach

A magnetostrictive sensing glove with function of gesture recognition is proposed based on Fe-Ni alloy, tunneling magnetoresistive elements, Agilus30 base and square permanent magnets. The sensing glove consists of five sensing units to measure the bending angle of each finger joint. The optimal structure of the sensing units is determined through experimentation and simulation. The output voltage model of the sensing units is established, and the output characteristics of the sensing units are tested by the experimental platform. Fifteen gestures are selected for recognition, and the corresponding output voltages are collected to construct the data set and the data is processed using Back Propagation Neural Network.

Findings

The sensing units can detect the change in the bending angle of finger joints from 0 to 105 degrees and a maximum error of 4.69% between the experimental and theoretical values. The average recognition accuracy of Back Propagation Neural Network is 97.53% for 15 gestures.

Research limitations/implications

The sensing glove can only recognize static gestures at present, and further research is still needed to recognize dynamic gestures.

Practical implications

A new approach to gesture recognition using wearable devices.

Social implications

This study has a broad application prospect in the field of human–computer interaction.

Originality/value

The sensing glove can collect voltage signals under different gestures to realize the recognition of different gestures with good repeatability, which has a broad application prospect in the field of human–computer interaction.

Details

Sensor Review, vol. 44 no. 2
Type: Research Article
ISSN: 0260-2288

Keywords

Article
Publication date: 8 May 2023

Ying Ye, Kwok Hung Lau and Leon Teo

This study aims to explore how green supply chain management (GSCM) strategies can be effectively implemented for business supply chain operations, relationship management and…

Abstract

Purpose

This study aims to explore how green supply chain management (GSCM) strategies can be effectively implemented for business supply chain operations, relationship management and product design to gain green competitive advantages.

Design/methodology/approach

An exploratory in-depth case study was conducted with one of the largest Chinese electronics manufacturers that is considered a leading GSCM adopter in the industry, to understand how the company adopts green supply chain practices across its multiple product lines.

Findings

The findings show that businesses can build different green focuses across GSCM elements of green operation, green relationship management and green product design to form diverse hybrid strategic solutions. They include green control, lean, leagile, agile and clean innovation while taking consideration of supply chain type and product lifespan. A taxonomy of four key GSCM strategic combinations is proposed based on the findings. The strategies align with green demand and supply chain characteristics balancing a series of business competitive objectives in terms of reducing pollution and waste, improving green cost efficiency, enhancing green demand innovation and building green service effectiveness.

Research limitations/implications

This study lends insight into the strategic alignment relationships between product supply chain types and approaches to GSCM.

Practical implications

The findings of this study can support industry practitioners in formulating aligned GSCM strategies based on product types to achieve optimal results.

Social implications

Optimised green supply chain design, operations and relationship management incorporating product attributes can help further minimise negative impacts of business activities on the environment.

Originality/value

This research provides a systematic understanding of how product supply chain types can influence GSCM strategy formulation. It gives a holistic picture of how hybrid choices of strategies with green supply chain operations, relationship management and product design can be formulated based on product and supply chain characteristics.

Details

The International Journal of Logistics Management, vol. 34 no. 6
Type: Research Article
ISSN: 0957-4093

Keywords

Article
Publication date: 15 December 2023

Tejendra Singh Gaur, Vinod Yadav, Sameer Mittal and Milind Kumar Sharma

Waste generated from electrical and electronic equipment, collectively known as E-waste, remains a persistent environmental, economic and social problem. Sustainable E-waste…

Abstract

Purpose

Waste generated from electrical and electronic equipment, collectively known as E-waste, remains a persistent environmental, economic and social problem. Sustainable E-waste management (EWM) has numerous benefits, such as preventing electronic waste from entering landfills, reducing the need for virgin materials by recovering valuable materials from recycling and lowering greenhouse gas emissions. Circular economy (CE) practices are considered the initial steps toward sustainable EWM, but some hurdles have been reported in the adoption of these practices. Therefore, the current study aims to identify the common CE practices, sustainability of the EWM process and the challenges in EWM, and to develop a conceptual framework for effective EWM.

Design/methodology/approach

Very few studies have proposed frameworks that acknowledge the challenges and CE practices of EWM. To fill this gap, a systematic literature review (SLR) was performed, and 169 research articles were explored.

Findings

A total of seven challenges in the adoption of effective EWM were identified: rules and policy, infrastructure, consumer behaviour, informal sectors, community culture, technology and economy. Eight common CE practices were also found for effective EWM: reuse, recycle, remanufacturing, refurbishment, repair, reduce, recover and repurpose.

Originality/value

A conceptual framework guiding sustainable EWM was proposed, which includes solutions for the identified challenges, and CE practices with sustainable benefits.

Details

Management of Environmental Quality: An International Journal, vol. 35 no. 4
Type: Research Article
ISSN: 1477-7835

Keywords

1 – 10 of 40