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A laser ablation technique has been used to fabricate conductor patterns on a 96% alumina substrate to evolve passive fine‐line components and structures. This paper reports the method of fabricating better fine‐line passive components for hybrid microelectronics application. The effect of a laser beam on the conductor and 96% alumina (Al₂O₃) substrate was studied in detail. Three predominant structures — namely debris, ablation border and irradiated bottom layer — were seen on the patterns. A detailed study of the dendritic growth caused by electrochemical migration on conductor lines fabricated by conventional screen printing and by laser ablation techniques is also reported.

The purpose of this paper is to investigate the effects of chloride ion concentration and applied bias voltage on the electrochemical migration (ECM) behavior between Cu and Ag under an NaCl thin electrolyte layer (TEL).

A self-made experimental setup for the ECM behavior between Cu and Ag was designed. An HD video measurement microscopy was used to observe the typical dendrite/corrosion morphology and pH distribution. Short-circuit time (SCT), short-circuit current density and the influence of the galvanic effect between Cu and Ag on their ECM behavior were studied by electrochemical tests. The surface morphology and composition of dendrite were characterized by FESEM/EDS.

The SCT increased with increasing NaCl concentration but decreased with increasing applied bias voltage, and the SCT between Cu and Ag was less than that between Cu and Cu because their galvanic effect accelerated the dissolution and migration of Cu. When NaCl concentration was less than or equal to 6 mmol/L, cedar-like dendrite was formed, whereas no dendrite formed and only precipitation occurred at high chloride ion concentration (100 mmol/L). The composition of the dendrite between Cu and Ag was copper.

The significance of this study is to clarify the ECM failure mechanism of printed circuit board (PCB) with an immersion silver surface finish (PCB-ImAg).

This study provides a basic theoretical basis for the selection of protective measures and metal coatings for PCB.

The social implication of this study is to predict the service life of PCB.

The ECM behavior of dissimilar metals under a TEL was investigated, the influence of the galvanic effect between them on their ECM was discussed, and the SCT increased with increasing NaCl concentration.

Laminated substrates are used widely in the manufacture of multichip modules (MCM‐L) by the electronic packaging industry. Of late, the thrust has been towards higher density circuitry to achieve improved performance and reduced size. This has led to the use of finer lines and spacings, smaller drilled holes and buried vias in organic laminates leading to reliability issues such as electrochemical migration. One of the forms of electrochemical migration is known as conductive filament formation. Conductive filament formation is an electrochemical process. In accelerated environments of temperature and humidity, organic laminates can develop a loss of insulation resistance between conductors, eventually resulting in loss of electrical function of the circuit. The paper aims at discussing electrochemical migration in general, and conductive filament formation in particular, and its impact on the reliability of MCM‐L.

The environmental reliability of Series Q, a system of materials designed for advanced ‘HIC’ circuits, has been studied using three different migration‐resistance tests. —LMRT: a test which is used to assess the resistance to electrochemical migration of horizontally adjacent, closely spaced conductor tracks in a high‐temperature, high‐humidity environment with a voltage bias present (60°C, 90%RH, 48 VDC). —HHBT: a test which monitors the ability of a dielectric to resist electrochemical migration when vertically adjacent crossover conductor tracks are oppositely biased (85°C, 85%RH, 5 VDC). —HBT: a test which measures how well a dielectric can sustain its resistance to voltage breakdown over extended periods of time during continuous exposure to conditions of high temperature and voltage (150°C, 200 VDC). The results show that the QSil™ and QPIus™ systems, the two materials systems that comprise Series Q, demonstrate excellent performance in all three areas. Predictions of how well circuits made from these materials will survive in their operating ambient over the long term, e.g., twenty years, have been made.

In this paper we present recent studies on the electrochemical migration processes in Ag thin film parallel microstrip lines in MCM(D) structures. The basic concept is applying accelerated local drop‐test of water solutions onto the surface of two adjacent lines, under a given voltage potential. These operational conditions are often met in the interconnection line buses, placed in the top assembly level of multilayered hybrid structures. The subject of investigations are MCM(D) developed on Al‐sheet carrier with internal conducting and isolating layers, produced through unique selective electrochemical anodization of Al and Ta. This technology process also enables the creation of embedded R and C passive components on the base of TaO_xN_1‐x and Ta₂O₅ (or Al₂O₃) respectively. We propose an electrochemical deposition of Ag/Sb alloys on the surface of Al interconnection lines and contact pads to ease the bondability and solderability in chip mounting procedures. The artificially created silver migrated defects and partial shorts are investigated through the high frequency method of coupled transmission lines in order to eliminate the errors and insufficient validity of DC direct measurements.

Silver and other metals can exhibit dendritic short‐circuit growth caused by electrochemical migration in conductor‐insulator structures. Detailed analysis of migration‐free thick film systems using migration‐free conductors has demonstrated that not only metallic components, but also dielectric constituent materials can contribute to the formation of migrated shorts after a chemical reduction process.

Modern electronics is characterised by the increasing level of integration in printed circuit board (PCB) technology and the reduced insulation spacing between adjacent conductors. Surface insulation resistance (SIR) measurement has often been used alone to determine the cleanliness of PCB assembly; however, when proper SIR measurement is used in conjunction with surface leakage current (SLC) measurement, the result can reveal the dynamic nature of surface electrochemical migration (SECM) processes at the microscopic level, and the effect of such processes on product quality and reliability. This paper presents a newly developed measurement methodology, which measures SLC per square unit area at a sampling rate that is orders of magnitude higher than that of conventional SIR measurement methods. It is aimed to capture the transient surge of SLC which is detrimental to the functionality of product.

The paper describes two well‐known and occasionally confused mechanisms for degradation of electronic circuitry. Intended as a tutorial for individuals working in electronic packaging who have limited background in materials and little experience with these mechanisms, the paper defines and describes the two latent shorting phenomena. Major papers and conferences dealing with the phenomena are cited. Electrolytic or electrochemical shorting is an electrical field‐induced mechanism that can destroy the integrity of modern, densely packed circuits operated in the presence of moisture and ionic contaminants. Examples of copper migration to form electroplated shorts in both thick film hybrid multilayer and printed circuit multilayer boards are discussed, and common features to both systems are outlined. Related mechanisms that may occur with the simple electrochemical (metal plating) mechanisms to produce a broad array of electrical isolation breakdowns are also described. The closing of this part of the paper is a brief review of the Sarnoff‐developed RCA/GE multilayer copper materials system. By design this system solves the problems raised regarding thick film copper multilayer latent failure mechanisms. The discussion of whisker growth is limited to proper whiskers, including those that grow without the application of external stress, squeeze whiskers, and whiskers that result from classic electromigration. All of these grow from solid sources in contact with the whisker. The whisker growth direction is not electrical field related. Identification is made of Sn, Cd, Sb and Zn as the materials classically found to grow whiskers at room temperature. Avoiding the use of electroplated films of Cd, Sb and Zn in close proximity to electronic circuitry is encouraged, and the modern requirements that Sn films be used only after melting, or be alloyed with lead, and not on brass substrates are discussed. In more recent literature indium alloys have been identified as room temperature whisker growth systems. Finally, mechanical design to eliminate squeeze whisker shorting that can result from fasteners in contact with the above and other metals is briefly treated.

This study seeks to investigate the electrochemical migration (ECM) behaviour of printed circuit boards (PCBs) with Sn‐37Pb and Sn‐3.0Ag‐0.5Cu (wt.%) solders under various factors such as the distance between the electrodes and bias voltage.

This study investigated the ECM phenomena with different surface finishes of Sn‐37Pb and Sn‐3.0Ag‐0.5Cu solders using water drop (WD) and temperature and humidity bias (THB) tests. After the WD and THB tests, the dendrite phase was identified using scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS).

The ECM resistance of the conventional Sn‐37Pb alloy was lower than that of the Pb‐free Sn‐3.0Ag‐0.5Cu alloy. The dendrites grew at the cathode electrodes on the PCB and expanded to the anode electrode. The main elements in the dendrites on the Sn‐37Pb and Sn‐3.0Ag‐0.5Cu finished PCBs were tin and lead, respectively.

This study evaluates the ECM phenomena of representative solder alloys on PCBs.

Surface insulation, electrochemical migration and various other insulation resistances are terms which are often glibly used, sometimes even incorrectly. This paper categorises different types of insulation resistance and catalogues about twenty practical applications of insulation resistance measurement, each with its ideal general conditions of measurement (test voltage, bias voltage, bias polarity, test voltage period, test frequency, test duration, temperature, humidity, test pattern type, test pattern dimensions, voltage gradients, tolerances, etc.) This description is independent of any of the nearly forty known, often contradictory, standards, most of which no longer correspond to the practical printed circuit or assembly of today. Also discussed are the different technologies of insulation resistance measurement, starting with the original non‐electronic ‘Megger®’ types through to modern laboratory electrometers and, finally, instrumentation specific to the practical measurement of printed circuit insulation resistances, including static and dynamic types. The importance of automatic statistical analyses is emphasised, especially with production testing as well as qualification procedures. This paper is aimed not only at those wishing to learn what modern insulation resistance testing is all about, but also at experienced persons wanting to marshall their thoughts about the fundamental meanings of insulation testing for different applications and specifications.