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This study aims to investigate the behavior of the green biomass-derived copper (lignin/silica/fatty acids) complex, copper lignin/silica/fatty acids (Cu-LSF) complex, when incorporated into the nonpolar ethylene propylene diene (EPDFM) rubber matrix, focusing on its reinforcing and antioxidant effect on the resulting EPDM composites.

The structure of the prepared EPDM composites was confirmed by Fourier-transform infrared spectroscopy, and the dispersion of the additive fillers and antioxidants in the EPDM matrix was investigated using scanning electron microscopy. Also, the rheometric characteristics, mechanical properties, swelling behavior and thermal gravimetric analysis of all the prepared EPDM composites were explored as well.

Results revealed that the Cu-LSF complex dispersed well in the nonpolar EPDM rubber matrix, in thepresence of coupling system, with enhanced Cu-LSF-rubber interactions and increased cross-linking density, which reflected on the improved rheological and mechanical properties of the resulting EPDM composites. From the various investigations performed in the current study, the authors can suggest 7–11 phr is the optimal effective concentration of Cu-LSF complex loading. Interestingly, EPDM composites containing Cu-LSF complex showed better antiaging performance, thermal stability and fluid resistance, when compared with those containing the commercial antioxidants (2,2,4-trimethyl-1,2-dihydroquinoline and N-isopropyl-N’-phenyl-p-phenylenediamine). These findings are in good agreement with our previous study on polar nitrile butadiene rubber.

The current study suggests the green biomass-derived Cu-LSF complex to be a promising low-cost and environmentally safe alternative filler and antioxidant to the hazardous commercial ones.

This study aims to investigate the potential of the decorated boron nitride nanocage (BNNc) with transition metals for capturing carbon monoxide (CO) as a toxic gas in the air.

BNNc was modeled in the presence of doping atoms of titanium (Ti), vanadium (V), chromium (Cr), cobalt (Co), copper (Cu) and zinc (Zn) which can increase the gas sensing ability of BNNc. In this research, the calculations have been accomplished by CAM–B3LYP–D3/EPR–3, LANL2DZ level of theory. The trapping of CO molecules by (Ti, V, Cr, Co, Cu, Zn)–BNNc has been successfully incorporated because of binding formation consisting of C → Ti, C → V, C → Cr, C → Co, C → Cu, C → Zn.

Nuclear quadrupole resonance data has indicated that Cu-doped or Co-doped on pristine BNNc has high fluctuations between Bader charge versus electric potential, which can be appropriate options with the highest tendency for electron accepting in the gas adsorption process. Furthermore, nuclear magnetic resonance spectroscopy has explored that the yield of electron accepting for doping atoms on the (Ti, V, Cr, Co, Cu, Zn)–BNNc in CO molecules adsorption can be ordered as follows: Cu > Co >> Cr > Zn ˜ V> Ti that exhibits the strength of the covalent bond between Ti, V, Cr, Co, Cu, Zn and CO. In fact, the adsorption of CO gas molecules can introduce spin polarization on the (Ti, V, Cr, Co, Cu, Zn)–BNNc which specifies that these surfaces may be used as magnetic-scavenging surface as a gas detector. Gibbs free energy based on IR spectroscopy for adsorption of CO molecules adsorption on the (Ti, V, Cr, Co, Cu, Zn)–BNNc have exhibited that for a given number of carbon donor sites in CO, the stabilities of complexes owing to doping atoms of Ti, V, Cr, Co, Cu, Zn can be considered as: CO →Cu–BNNc >> CO → Co–BNNc > CO → Cr–BNNc > CO → V–BNNc > CO → Zn–BNNc > CO → Ti–BNNc.

This study by using materials modeling approaches and decorating of nanomaterials with transition metals is supposed to introduce new efficient nanosensors in applications for selective sensing of carbon monoxide.

The purpose of this paper is to investigate the effects of chloride ion concentration and applied bias voltage on the electrochemical migration (ECM) behavior between Cu and Ag under an NaCl thin electrolyte layer (TEL).

A self-made experimental setup for the ECM behavior between Cu and Ag was designed. An HD video measurement microscopy was used to observe the typical dendrite/corrosion morphology and pH distribution. Short-circuit time (SCT), short-circuit current density and the influence of the galvanic effect between Cu and Ag on their ECM behavior were studied by electrochemical tests. The surface morphology and composition of dendrite were characterized by FESEM/EDS.

The SCT increased with increasing NaCl concentration but decreased with increasing applied bias voltage, and the SCT between Cu and Ag was less than that between Cu and Cu because their galvanic effect accelerated the dissolution and migration of Cu. When NaCl concentration was less than or equal to 6 mmol/L, cedar-like dendrite was formed, whereas no dendrite formed and only precipitation occurred at high chloride ion concentration (100 mmol/L). The composition of the dendrite between Cu and Ag was copper.

The significance of this study is to clarify the ECM failure mechanism of printed circuit board (PCB) with an immersion silver surface finish (PCB-ImAg).

This study provides a basic theoretical basis for the selection of protective measures and metal coatings for PCB.

The social implication of this study is to predict the service life of PCB.

The ECM behavior of dissimilar metals under a TEL was investigated, the influence of the galvanic effect between them on their ECM was discussed, and the SCT increased with increasing NaCl concentration.

The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP), which contains Cu-3.28 wt.% Ti, on its interfacial reaction with Sn-9.0 wt.% Zn (SnZn) solder, using the liquid/solid reaction couple technique.

The SnZn/C1990 HP couples were subjected to a reaction temperature of 240–270°C for a duration of 0.5–5 h. The resulting reaction couple was characterized using a scanning electron microscope, energy dispersive spectrometer, electron probe microanalyzer and X-ray diffractometer.

It was observed that the scallop-shaped CuZn5 and planar Cu5Zn8 phases were formed in almost all SnZn/C1990 HP couples. With increased reaction duration and temperature, the Cu-rich intermetallic compound (IMC)-Cu5Zn8 phase became a dominant IMC formed at the interface. The total thickness of the IMCs was increased with the increase in the reaction duration and temperature. The IMC growth obeyed the parabolic law, and the IMC growth mechanism was diffusion controlled. The activation energy of the SnZn/C1990 HP couple was 64.71 kJ/mol.

This article presents an analysis of the IMC thickness in each sample using ImageJ software, followed by kinetic analysis using Origin software at various reaction temperatures of SnZn/C1990 HP in liquid/solid couples. The study also includes detailed reports on the morphology, interface composition and X-ray diffraction analysis, as well as the activation energy. The findings can serve as a valuable reference for electronic packaging companies that utilize C1990 HP substrates.

This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints by transient liquid phase bonding (TLPB).

TLPB is promising to assemble die-attaching packaging for power devices. In this study, porous Cu (P-Cu) foil with a distinctive porous structure and Sn-58Bi solder (SB) serve as the bonding materials for TLPB under a formic acid atmosphere (FA). The high surface area of P-Cu enables efficient diffusion of the liquid phase of SB, stimulating the wetting, spreading and formation of intermetallic compounds (IMCs).

The higher bonding temperature decreased strength due to the coarsening of IMCs. The longer bonding time reduced the bonding strength owing to the coarsened Bi and thickened IMC. Applying optimal bonding pressure improved bonding strength, whereas excessive pressure caused damage. The presence of a Pt catalyst enhanced bonding efficiency and strength by facilitating reduction–oxidation reactions and oxide film removal.

Overall, this study demonstrates the feasibility of low-temperature TLPB for Cu/SB/P-Cu/SB/Cu joints and provides insights into optimizing bonding strength for the interconnecting materials in the applications of power devices.

The purpose of this study is to investigate the effect of the sintering temperature on the microstructural, mechanical and physical properties of Cu-SiC composites.

The powder metallurgy route was used to fabricate the samples. Cold compaction of powders was conducted at 250 MPa which was followed by sintering at 850°C–950°C at the interval of 50 °C in the open atmospheric furnace. SiC was used as a reinforcement and the volumetric fraction of the SiC was varied as 10%, 15% and 20%. The processed samples were metallurgically characterized by the scanning electron microscope (SEM). Mechanical characterization was done using tensile and Vickers’ micro-hardness testing to check the hardness and strength of the samples. Archimedes principle and Four-point collinear probe method were used to measure the density and electrical resistivity of the samples.

SEM micrograph reveals the uniform dispersion of the SiC particles in the Cu matrix element. The results revealed that the Hardness and tensile strength were improved due to the addition of SiC and were maximum for the samples sintered at 950 °C. The addition of SiC has also increased the electrical resistivity of the Cu-SiC composite and was lowest for Cu 100% while the relative density has shown the reverse trend. Further, it was found that the maximum hardness of 91.67 Hv and ultimate tensile strength of 312.93 MPa were found for Cu-20% SiC composite and the lowest electrical resistivity of 2.017 µ- Ω-cm was found for pure Cu sample sintered at 950 °C, and this temperature was concluded as the optimum sintering temperature.

The powder metallurgy route for the fabrication of the composites is a challenging task as the trapping of oxygen cannot be controlled during the compaction process as well as during the sintering process. So, a more intensive study is required to overcome these kinds of limitations.

As of the author’s best knowledge, no work has been reported on the effect of sintering temperature on the properties of the Cu-SiC composites which has huge potential in the industries.

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and practical implementation of innovative lead-free solder materials in the electronic packaging industry.

This study investigates the effect of adding Si₃N₄ NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated.

The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting point was caused, while it does not impact its functionality. An appropriate Si₃N₄ NWs content (0.2∼0.4 Wt.%) significantly improves its wettability, and modifies the microstructure and interfacial IMC layer. The shear strength increases by up to 10.74% when adding 0.4 Wt.% Si₃N₄ NWs, and the failure mode observed is brittle fracture mainly. However, excessive Si₃N₄ will cause aggregation at the junction between the solder matrix and IMC layer, this will be detrimental to the joint.

The Si₃N₄ NWs were first used for the modification of lead-free solder materials. The relative properties of composite solder and joints were evaluated from different aspects, and the optimal ratio was obtained.

In many of today’s manufacturing industries, such as automobile, aerospace, defence, die and mould making, medical and electrical discharge machining (EDM) has emerged as an effective material removal process. In this process, a series of discontinuous electric discharges is used for removing material from the workpiece in the form of craters generating a replica of the tool into the workpiece in a dielectric environment. Appropriate selection of the tool electrode material and combination of input parameters is an important requirement for performance enhancement of an EDM process. This paper aims to optimize an EDM process using single-valued neutrosophic grey relational analysis using Cu-multi-walled carbon nanotube (Cu-MWCNT) composite tool electrode.

This paper proposes the application of grey relational analysis (GRA) in a single-valued neutrosophic fuzzy environment to identify the optimal parametric intermix of an EDM process while considering Cu-MWCNT composite as the tool electrode material. Based on Taguchi’s L9 orthogonal array, nine experiments are conducted at varying combinations of four EDM parameters, i.e. pulse-on time, duty factor, discharge current and gap voltage, with subsequent measurement of two responses, i.e. material removal rate (MRR) and tool wear rate (TWR). The electrodeposition process is used to fabricate the Cu-MWCNT composite tool.

It is noticed that both the responses would be simultaneously optimized at higher levels of pulse-on time (38 µs) and duty factor (8), moderate level of discharge current (5 A) and lower level of gap voltage (30 V). During bi-objective optimization (maximization of MRR and minimization of TWR) of the said EDM process, the achieved values of MRR and TWR are 243.74 mm³/min and 0.001034 g/min, respectively.

Keeping in mind the type of response under consideration, their measured values for each of the EDM experiments are expressed in terms of linguistic variables which are subsequently converted into single-valued neutrosophic numbers. Integration of GRA with single-valued neutrosophic sets would help in optimizing the said EDM process with the Cu-MWCNT composite tool while simultaneously considering truth-membership, indeterminacy membership and falsity-membership degrees in a human-centric uncertain decision-making environment.

This paper aims to study the synergistic lubrication effects of Sn–Ag–Cu and MXene–Ti₃C₂ to improve the tribological properties of M50 bearing steel with microporous channels.

M50 matrix self-lubricating composites (MMSC) were designed and prepared by filling Sn–Ag–Cu and MXene–Ti₃C₂ in the microporous channels of M50 bearing steel. The tribology performance testing of as-prepared samples was executed with a multifunction tribometer. The optimum hole size and lubricant content, as well as self-lubricating mechanism of MMSC, were studied.

The tribological properties of MMSC are strongly dependent on the synergistic lubrication effect of MXene–Ti₃C₂ and Sn–Ag–Cu. When the hole size of microchannel is 1 mm and the content of MXene–Ti₃C₂ in mixed lubricant is 4 wt.%, MMSC shows the lowest friction coefficient and wear rate. The Sn–Ag–Cu and MXene–Ti₃C₂ are extruded from the microporous channels and spread to the friction interface, and a relatively complete lubricating film is formed at the friction interface. Meanwhile, the synergistic lubrication of Sn–Ag–Cu and MXene–Ti₃C₂ can improve the stability of the lubricating film, thus the excellent tribological property of MMSC is obtained.

The results help in deep understanding of the synergistic lubrication effects of Sn–Ag–Cu and MXene–Ti₃C₂ on the tribological properties of M50 bearing steel. This work also provides a useful reference for the tribological design of mechanical components by combining surface texture with solid lubrication.

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-12-2023-0381/