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A study was undertaken to evaluate the thermosonic gold‐wire bonding capability to Ti‐Pd‐Cu‐Ni‐Au thin film metallisation on newly developed polymer hybrid integrated circuits (POLYHICs). (The POLYHIC technology incorporates alternating layers of polymer and metal added to conventional Hybrid Integrated Circuits which provide for increased interconnection density.) Destructive wire‐pull strengths were measured as a function of varying wire‐bonding machine operating parameters of wedge bond force, wedge bond time, temperature, and ultrasonic energy. All data were evaluated and compared with wire bonding under similar conditions to thin film circuits on Al2O3 ceramic. The results for wedge‐bond associated failures indicated that machine operating parameters of wedge bond force, time and ultrasonic energy similarly affected the average wire‐pull strength for both the ceramic and POLYHIC circuits. Pull strengths for equivalent metallisation schemes and bonding parameters were generally slightly higher and more tightly distributed for bonds made to metal films on ceramic. A strong correlation was found to exist between wire‐pull strengths and surface topography (as measured by a profilometer technique) of the thin film metallisation for the POLYHICs which had both smooth and rough metallisation surfaces for metal films on top of the polymer. The results indicated that rough metallisation bonded more easily and yielded much higher wire‐pull strengths. Also, rougher films were shown to effectively increase the parameter‐operating windows for producing reliable wire bonds. A semi‐quantitative analysis was developed to help explain this correlation. Surface topography effects were also found to be a key factor when evaluating wire bondability as a function of substrate bonding temperature. Wedge‐bond strength was essentially independent of temperature for bonds made to rougher metallisation while a strong temperature dependency was found when wire bonds were made to smoother films.

The purpose of this study is to propose the use of a pre-deposition heating system for fused filament fabrication (FFF) as a means to enhance interlayer bonding by elevating the substrate temperature. The effects of the heating on thermal profile at the bonding interface and the mechanical properties of three-dimensional printed parts are investigated.

A 12-W laser head is integrated to a commercial printer as the pre-deposition heating system. The laser beam heats up substate before the deposition of a fresh filament. Effects of laser powers are investigated and the thermal profile is measured with thermocouple, infrared camera and finite element model. The correlation between the temperature at the bonding interface and the bonding quality is investigated by conducting tensile testing and neck width measurement with microscope.

The pre-deposition heating system is proven to be effective in enhancing the inter-layer strength in FFF parts. Tensile testing of specimens along build direction (Z) shows an increase of around 50% in ultimate strength. A linear relationship is observed between the pre-deposition temperature at bond interface and bonding strength. It is evident that elevating the pre-deposition temperature promotes interlayer polymer diffusion as shown by the increased neck width between layers.

Thermocouples that are sandwiched between layers are used to achieve accurate measurement of the interfacial temperature. The temperature profiles under pre-deposition heating are analyzed and correlated to the interlayer bonding strengths.

The purpose of this paper is to study the effects of these major parameters, including layer thickness, deposition velocity and infill rate, on product’s mechanical properties and explore the quantitative relationship between these key parameters and tensile strength of the part.

A VHX-1000 super-high magnification lens zoom three-dimensional (3D) microscope is utilized to observe the bonding degree between filaments. A temperature sensor is embedded into the platform to collect the temperature of the specimen under different parameters and the bilinear elastic-softening cohesive zone model is used to analyze the maximum stress that the part can withstand under different interface bonding states.

The tensile strength is closely related to interface bonding state, which is determined by heat transition. The experimental results indicate that layer thickness plays the predominant role in affecting bonding strength, followed by deposition velocity and the effect of infill rate is the weakest. The numerical analysis results of the tensile strength predict models show a good coincidence with experimental data under the elastic and elastic-softened interface states, which demonstrates that the tensile strength model can predict the tensile strength exactly and also reveals the work mechanism of these parameters on tensile strength quantitatively.

The paper establishes the quantitative relationship between main parameters including layer thickness, infill rate and deposition velocity and tensile strength for the first time. The numerically analyzed results of the tensile strength predict model show a good agreement with the experimental result, which demonstrates the effectiveness of this predict model. It also reveals the work mechanism of the parameters on tensile strength quantitatively for the first time.

This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints by transient liquid phase bonding (TLPB).

TLPB is promising to assemble die-attaching packaging for power devices. In this study, porous Cu (P-Cu) foil with a distinctive porous structure and Sn-58Bi solder (SB) serve as the bonding materials for TLPB under a formic acid atmosphere (FA). The high surface area of P-Cu enables efficient diffusion of the liquid phase of SB, stimulating the wetting, spreading and formation of intermetallic compounds (IMCs).

The higher bonding temperature decreased strength due to the coarsening of IMCs. The longer bonding time reduced the bonding strength owing to the coarsened Bi and thickened IMC. Applying optimal bonding pressure improved bonding strength, whereas excessive pressure caused damage. The presence of a Pt catalyst enhanced bonding efficiency and strength by facilitating reduction–oxidation reactions and oxide film removal.

Overall, this study demonstrates the feasibility of low-temperature TLPB for Cu/SB/P-Cu/SB/Cu joints and provides insights into optimizing bonding strength for the interconnecting materials in the applications of power devices.

It is well known that stress singularity may exist at the edges of a bonded bi‐material interface due to the discontinuity of material properties. This stress singularity causes difficulty in accurately determining the bi‐material interface bonding strength. This paper aims to present a new design of specimen geometry to eliminate the stress singularity and present an experimental procedure to more accurately determine the bonding strength of the bi‐material interface.

The design is based on an asymptotic analysis of the stress field near the free edge of bi‐material interface. The critical bonding angle, which delineates the singular and non‐singular stress field near the free edge, is determined.

With the new designed specimen and a special iterative calculation algorithm, the interface bonding strength envelope of an epoxy‐aluminum interface was experimentally determined.

This new design of specimen, experimental procedure and iterative algorithm may be applied to obtain more reasonable and accurate bonding strength data for a wide range of bi‐material interfaces.

GaAs electronic devices are becoming increasingly used in the microelectronics industry especially in solid state microwave, ultra high speed digital processing and optoelectronic applications. However, in the manufacture of the GaAs devices, problems due to the inherent brittleness of the GaAs and batch to batch variability of the bond pad metallisation have commonly been experienced. This has resulted in some difficulties in wire bonding to GaAs devices with ultrasonic and thermocompression wire bonding techniques. This paper describes a programme undertaken to investigate Au wire bonding techniques to GaAs devices. Specifically, bonding trials have been performed on a range of GaAs substrates using pulse tip and continuously heated thermocompression bonding and ultrasonic bonding. The results of this work have shown that thermocompression and ultrasonic wire bonding techniques are cabable of producing acceptable bonds to GaAs devices, although some of the advantages and limitations of each technique have been demonstrated. Thermocompression bonding with a continuously heated capillary gave the most tolerant envelope of bonding conditions and highest bond strengths. Pulse tip thermocompression bonding gave a less tolerant envelope of acceptable bonding conditions, required a longer bonding time and the wire was weakened above the ball bond. Ultrasonic bonding did not require any substrate heating to give acceptable bonds. However, the choice of equipment can be critical if damage to the device is to be avoided.

The purpose of this paper is to study the bonding properties of Larch with water‐based polymer isocynate (WPI) adhesive to provide theoretical instruction for practical production of Larch glued laminated timber with WPI adhesive.

This study adopted Japanese JIS K6806 standard to test bonding properties of Larch with WPI adhesive. Scanning electron microscope was used to observe morphography of Larch surface. Micro photos were adopted to show the penetration of WPI adhesive on the radial and tangential surfaces of Larch.

There was significant difference in bonding strength between Larch radial and tangential glue‐blocks glued with WPI adhesive. Dry compressing shear strength of Larch radial glue‐block bonded with WPI adhesive was 1.41 times that of Larch tangential glue‐block bonded with WPI adhesive in normal conditions. Wood failure showed that the difference between Larch radial and tangential glue‐block was caused by wood structure of Larch itself.

The research conclusion that the dry compressing shear strength of Larch radial glue‐block bonded with WPI adhesive was bigger than that of Larch tangential glue‐block bonded in normal conditions. These would be changed if other adhesives were adopted to glue Larch wood.

The conclusion developed in this study provided a practical production instruction for Larch glued laminated timber with WPI adhesive. In order to obtain better bonding properties during the production of Larch glued laminated wood, Larch wood should be sawn into radial boards rather than tangential boards in order to obtain maximum bonding strength of Larch wood.

The paper shows that there was significant difference in bonding strength between Larch radial and tangential glue‐bonded blocks with WPI adhesive. Dry compressing shear strength of Larch radial glue‐block bonded with WPI adhesive was 1.41 times that of Larch tangential glue‐block bonded with WPI adhesive in normal conditions.

The purpose of this paper is to investigate a new approach for making a bio‐based adhesive from a new resource, rice bran (RB) adhesive.

RB solution was prepared and its pHs were adjusted to either 8.5‐9.0 or 10.0‐10.5. The solid content of slurry was controlled at ≈18 per cent and then gelatinised in a water bath shaker at 60°C for 2 h or at 100°C for 1 h. The bonding strength of RB adhesive was determined by testing the strength of three‐layer plywood. A differential scanning calorimeter (DSC) was used for detecting the reaction energy and curing temperature. According to the DSC analysis, hot pressing at three temperatures was performed to select the best bonding conditions. Then, a two level split‐plot design was used to determine the effects of gelatinisation and pH on the bonding strength of RB adhesive. Thus, the formulation of RB adhesive was optimised. In order to improve the water resistance of RB adhesive, toluene diisocyanate (TDI) was used as a cross linking agent.

In the study reported here, a RB adhesive was developed by alkaline modification. Very high pH was not necessary, when RB adhesive with pH 10.0‐10.5 was gelatinised at 100°C for 1 h, its bonding strength was significantly lower than pH 8.5‐9.0 gelatinised at 60°C for 2 h. Water resistance of RB adhesive improved significantly when TDI was added as a cross linking agent. Compared to pure RB adhesive, the RB‐TDI mixed adhesive started curing at a higher temperature. For RB adhesive curing, 130°C was a suitable hot pressing temperature.

Though the RB adhesive developed had a good bonding strength, its water resistance and dark colour was not satisfactory, which risks discolour of light colour wood. Further study is needed to solve this problem.

The approach provided a bio‐adhesive with good bonding strength, reasonable working life, and without formaldehyde emission. Based on further study, RB adhesive could be considered a promising alternate adhesive in many applications such as paper board bonding and plywood.

It provided a potential way to utilise by‐product of agriculture, RB as industrial raw material. This will do farmers a great favour. Meanwhile, the modified RB adhesive is promising to partly or completely replace urea formaldehyde resin that mainly used in wood industry, avoiding formaldehyde emission and reducing the dependence on petroleum products.

The strength of annealed ZrO2/Pd diffusion bonds was found to be weakened after annealing in both air and vacuum. Annealing in air reduces the strength much faster and more severely than in vacuum. Fracture surfaces of as‐bonded joints and those annealed in air and vacuum were studied to characterise the different effects of air and vacuum on the bonded interfaces. Various sizes of precipitates and voids were observed and their distribution on the fractured surfaces was examined by light microscopy. Large precipitates and voids were found close to the edges of the specimen. It is believed that the loss of strength after annealing is an effect of these defects at the highly stressed specimen edges. Transmission and analytical electron microscopy of as‐bonded joints show that an interface layer of very fine grains about 1 micron thick was formed during the bonding process. This layer has a different crystalline structure and composition from both Pd and ZrO2. Characterisation of this layer by electron microscopy is presented in this report. The formation of such a thick interface layer is probably not a pure diffusion process, rather a diffusion and melting process. From the Pd‐Zr phase diagram, there is a range of compositions near a eutectic point where a liquid phase is possible at the bonding temperatures used (1100°C). Taking the Pd‐Zr system as a qualitatively comparable system to Pd‐ZrO2, it is deduced that, at the very beginning of the bonding, Zr and Pd diffuse into each other until the melting composition is reached. The formation of the liquid phase will promote the contact and bonding processes dramatically. This explains why strong bonding cannot be achieved at lower bonding temperatures as was reported in an earlier paper. Similar experiments on Ni/ZrO2 diffusion bonds have also been studied to identify the mechanism of bonding and to compare it with Pd/ZrO2. No reaction was observed at the interface in Ni/ZrO2. Thus the wetting mechanism is absent which explains the formation of a large amount of interface voids and the much weaker bonding strength found in Ni/ZrO2 bonds.

This paper aims to evaluate the bonding properties of textile reinforced concrete (TRC)-confined concrete and corroded plain round bars.

The bonding performance of three types of specimens (not reinforced, reinforced after corrosion and reinforced before corrosion) was studied by a central pull out test.

The ultimate bond strength between the corroded steel bars and the concrete is improved when the corrosion ratio is small. After cracking, the degree of corrosion continues to grow and the ultimate bond strength decreases. TRC reinforcement has no detectable effect on the interfacial bonding properties between concrete and plain round bars when the corrosion of steel bars is small; however, when the concrete cracks under the action of rust corrosion, the TRC constraints can effectively improve the bonding performance of the two components.

TRC layer significantly delayed the chloride penetration rate, which can effectively limit the development of corrosion cracking.