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This paper aims to study the deformation mechanism of polytetrafluoroethylene (PTFE) oil seal under a wide temperature range cycle.

This study categorizes the oil seal operation into three states: assembly, heating-up and cooling. The deformation equation for the oil seal is developed for each state, considering the continuity between them. The investigation of the oil seal’s deformation trends and mechanisms is performed using the ANSYS Workbench.

The assembling process results in a radial shrinkage of the skeleton, causing the centroid to move toward the axis. During heating-up, the outer diameter of the skeleton slightly expands, whereas the inner diameter sharply contracts toward the axis, leading to a further reduction in the centroid’s distance from the axis. Upon cooling, both the inner and outer diameters continue to contract toward the axis, causing the centroid to persist in its movement toward the axis. Consequently, after undergoing a heating-up and cooling cycle ranging from 20°C to 180°C, the outer diameter of the PTFE oil seal reduces by 0.92 mm from its original deformation, ensuring minimal contact between the skeleton and housing. As a result of the reduced static friction torque at the skeleton, the oil seal rotates along the shaft.

The deformation mechanism of PTFE oil seals under a wide temperature range cycle was investigated, aiming to address the concerns related to the rotation along the shaft and leakage.

The peer review history for this article is available at: https://publons.com/publon/10.1108/ILT-05-2023-0142/

In Part 1, background information on mechanical properties and metallurgy of solder alloys and soldered joints has been presented. In Part 2, mechanisms of damage and degradation of components and soldered joints during soldering, transport and field life have been discussed, the most important mechanism being low cycle fatigue of the solder metal. In this third part, the determination of the fatigue life expectancy of soldered joints is discussed. Accelerated testing of fatigue is needed, as the possibilities of calculations are strongly limited. A temperature cycle test under specified conditions is proposed as a standard. A model is worked out for the determination of the acceleration factor of this test. A compilation of a number of solder fatigue test results, generated in the author's company, is presented.

An effective chemical conditioning technique was successfully tested and investigated to control and minimize the chemistry-related damages within mixed metallurgy steam and water cycle of Heller dry cooled combined cycle power plants (CCPPs), in which cooling water and condensate are completely mixed in direct contact condenser. This study aims to perform a comprehensive experimental research in four mixed metallurgy steam and water cycle.

A comprehensive experimental study was carried out in four mixed metallurgy steam and water cycle fabricated with ferrous- and aluminum-based alloys which have various corrosion resistance capabilities in contact with water. Chemical conditioning was conducted using both volatile and non-volatile alkalizing agents, and, to perform chemical conditioning effectively, quality parameters (pH, conductivity, dissolved oxygen, sodium, silica, iron, aluminum and phosphate) were monitored by analyzing grab and online samples taken at eight key sampling points.

Results indicated that pH was the most critical parameter which was not mainly within the recommended ranges of widely used standards and guidelines at all key sampling points that generally increases the occurrence of chemistry-related damages. The other quality parameters were mostly satisfactory.

In this research, the development of a suitable chemical conditioning technique in mixed metallurgy steam and water cycle, fabricated with ferrous and aluminum-based alloys, was studied. The obtained results in this thorough research work was evaluated by comparison with the chemistry limits of the widely used standards and guidelines, and combined use of volatile and solid alkalizing agents was considered as a promising chemical conditioning technique for utilization in mixed metallurgy units of Heller dry cooled CCPPs.

The purpose of this work is to undertake a comparison of accelerated test regimes for assessing the reliability of solder joints, in particular those made using lead‐free solders.

Identical samples of 1206, 0805 and 0603 resistors were subjected to six different cycling regimes to investigate the effect of thermal excursions, ramp rates and temperature dwells.

The most damage to joints was found to be caused by thermal cycling between −55 and 125°C, with a 10°C/min ramp rate and 5 min dwells. Large thermal excursions were shown to give faster results without compromising the failure mode.

Similar degrees of damage in the lead‐free solder joints were experienced from thermal shock regimes with ramp rates in excess of 50°C/min. However, these regimes, although faster to undertake, appeared to cause different crack propagation modes than observed with the thermal cycling regimes. However, these differences may be small and thermal shock testing may still be used to differentiate between, or enable ranking of, the effects of changes to materials or processes on the reliability of the solder joints. Hence, it is envisaged that if a wide range of conditions are to be tested a first sift can be completed using thermal shock, with the final work using typical thermal cycling conditions.

The difference between the SAC (95.5Sn3.8Ag0.7Cu) and SnAg (96.5Sn3.5Ag) solder alloy results across all types of cycles showed very little difference in the rates of joint degradation.

This paper compares relative reliability (remaining shear strength) of three chip components soldered with two lead‐free alloys based on various thermal cycling conditions.

Solder joint failure history has generally been assumed to follow a straight line when plotted as a lognormal or 2‐parameter Weibull distribution. Test results presented here show that a deviation from straight‐line behaviour occurs at low percentage failure probabilities. This indicates that solder joint failure history is more correctly characterised as a 3‐parameter Weibull distribution with a failure‐free period of life for true wearout failures. The solder joint failure distribution characteristic is also affected by applied strain. Lower strain, in addition to increasing median life, also improves the distribution such that the number of cycles‐to‐first‐failure is increased compared with the median cycles‐to‐failure. The ratio of cycles‐to‐first‐failure/median cycles‐to‐failure and apparent Weibull slope increases as strain decreases in a predictable manner. The effects of part elevation, part size, solder joint volume and shape, conformal coating, temperature differential, and alternative board materials are also presented with test data showing the effect of variation of these parameters.

This paper aims to investigate the effect of printing temperature on the thermal and the mechanical behaviour of polylactic acid (PLA)-polyhydroxyalkanoate (PHA) blend printed using fused deposition modelling (FDM).

Because of the use of an infra-red camera, thermal cycling during the laying down is quantified. In addition, X-ray micro-tomography is considered to reveal the microstructural arrangement within the three-dimensional printed material. Tensile loading conditions are used to derive Young’s modulus, tensile strength and fracture toughness, and relate these to the printing temperature. Finite element computation based on three-dimensional microstructure information is used to predict the role of defects on the tensile performance.

The results show a remarkable cohesive structure of PLA-PHA, particularly at 240°C. This cohesive structure is explained by the ability to ensure heat accumulation during laying down as evidenced by the nature of thermal cycling. The printing temperature is found to be a key factor for tuning the ductility of the printed PLA-PHA allowing full restoration of tensile strength at high printing temperature.

This study reports new results related to the thermo-mechanical behaviour of PLA-PHA that did not receive much attention in three-dimensional printing despite its potential as a candidate for pharmacological and medical applications. This study concludes by a wide range of possible printing temperatures for PLA-PHA and a remarkable low porosity generated by FDM.

TO say that the Twenty‐fourth S.B.A.C. Show was an unqualified success is perhaps to gild the lily. True there were disappointments— the delay which kept the TSR‐2 on the ground until well after the Show being one—but on the whole the British industry was well pleased with Farnborough week and if future sales could be related to the number of visitors then the order books would be full for many years to come. The total attendance at the Show was well over 400,000—this figure including just under 300,000 members of the public who paid to enter on the last three days of the Show. Those who argued in favour of allowing a two‐year interval between the 1962 Show and this one seem to be fully vindicated, for these attendance figures are an all‐time record. This augurs well for the future for it would appear that potential customers from overseas are still anxious to attend the Farnborough Show, while the public attendance figures indicate that Britain is still air‐minded to a very healthy degree. It is difficult to pick out any one feature or even one aircraft as being really outstanding at Farnborough, but certainly the range of rear‐engined civil jets (HS. 125, BAC One‐Eleven, Trident and VCIQ) served as a re‐minder that British aeronautical engineering prowess is without parallel, while the number of rotorcraft to be seen in the flying display empha‐sized the growing importance of the helicopter in both civil and military operations. As far as the value of Farnborough is concerned, it is certainly a most useful shop window for British aerospace products, and if few new orders are actually received at Farnborough, a very large number are announced— as our ’Orders and Contracts' column on page 332 bears witness. It is not possible to cover every exhibit displayed at the Farnborough Show but the following report describes a wide cross‐section beginning with the exhibits of the major airframe and engine companies.

The first part of this section deals in general with considerations of engine design, and the latter part with the effects of engine operating conditions.

One concern that has slowed the progress of surface mounted technology, in particular leadless chip carriers, has been the question of the reliability of the surface mount attachment technology. This concern follows from the realisation that the functional reliability of surface mount technology is a very complex issue involving many not very well understood components. What is needed is a relatively simple, useful, predictive model. The model reported here sidesteps the numerous complex underlying issues, which, if considered separately, make a predictive reliability model all but impossible, by taking a purely phenomenological approach and relegating second‐order effects to a lumped empirical figure of merit.