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This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue.

The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated.

Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length.

This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints.

The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. The parametric variation of the crack length on stress and fatigue characteristics of solder joints, which has never been conducted, is also studied.

Pb-free solders have been developed to replace the standard Sn–Pb eutectic solder since the prohibition on Pb used in solders. The Sn–Ag–Cu series of lead-free solders is the most extensively used in the electronics industry. The Ag₃Sn, which forms during isothermal ageing, can significantly degrade solder joint reliability. Sn–Ag–Cu solder’s high price further hindered its use in the electronics industry. This paper aims to investigate different copper percentages into Sn–xCu solder alloy to improve its microstructure and strength performance.

The solder alloys used in this work were Sn–xCu, where x = 0.0, 0.3, 0.5, 0.7, 1.0 Wt.%, which was soldered onto electroless nickel immersion gold (ENIG) substrate using carbon dioxide (CO₂) gas laser. Then these samples were subjected to isothermal aging for 0, 200, 500, 1,000 and 2,000 h. The Sn–xCu solder alloy was fabricated through a powder metallurgy process.

Microstructure characterization showed that Cu addition resulted in fine and rounded shape of Cu–Sn–Ni particles. Shear strength of Sn–xCu solder joints was increased with increasing Cu content, but at aging duration of 1,000 h, it dropped slightly. It is believed that the strength improved due to the increment of diffusion rate during isothermal aging.

In a Cu–Sn solder, the recommended amount is 1.0 Wt.% of Cu. In extensive aging procedures, it was discovered that Sn1.0Cu solder improved the reliability of solder joints. The findings indicated that the innovative solder alloys might satisfy the needs of high-reliability applications.

The study shows that the right amount of Cu enhances the solidification of Sn–Cu solder, increasing the shear force of the Cu–Sn solder joint. The Sn1.0Cu exhibits a ductile fracture on the top microstructure, improving the joint’s average shear strength.

The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and practical implementation of innovative lead-free solder materials in the electronic packaging industry.

This study investigates the effect of adding Si₃N₄ NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated.

The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting point was caused, while it does not impact its functionality. An appropriate Si₃N₄ NWs content (0.2∼0.4 Wt.%) significantly improves its wettability, and modifies the microstructure and interfacial IMC layer. The shear strength increases by up to 10.74% when adding 0.4 Wt.% Si₃N₄ NWs, and the failure mode observed is brittle fracture mainly. However, excessive Si₃N₄ will cause aggregation at the junction between the solder matrix and IMC layer, this will be detrimental to the joint.

The Si₃N₄ NWs were first used for the modification of lead-free solder materials. The relative properties of composite solder and joints were evaluated from different aspects, and the optimal ratio was obtained.

The performance of oil-filled pressure cores is very much affected by the corrugated diaphragm and the oil filling volume. The purpose of this paper is to show the effects of different corrugated diaphragms, different oil filling volumes and different treatments of the corrugated diaphragms on the performance of pressure sensors.

Pressure-sensitive cores with different diaphragm diameters, different diaphragm ripple numbers and different oil filling volumes are produced, and thermal cycling is introduced to improve the diaphragm performance, and finally the performance of each pressure-sensitive core is tested and the test data are analyzed and compared.

The experimental results show that the larger the diameter of the corrugated diaphragm used for encapsulation, the better the performance. For pressure-sensitive cores using smaller diameter corrugated diaphragms, the performance of one corrugation is better than that of two corrugations. When the number of corrugations and the diameter are the same size, the performance of the outer ring of the diaphragm with concave corrugations is better than that with convex corrugations. At the same time, the diaphragm after thermal cycling treatment and appropriate reduction of encapsulated oil filling can improve the performance of the pressure-sensitive core.

By exploring the effects of corrugated diaphragm and oil filling volume on the performance of oil-filled pressure cores, the design of oil-filled pressure sensors can be guided to improve sensor performance.

There are several lead-free solder alloys available in the industry. Over the years, the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly used and accepted for joining the electronic components. It is strongly believed that the silver (Ag) content has a significant impact on the solder mechanical behavior and thus solder thermal reliability performance. This paper aims to assess the mechanical response, i.e. creep response, of the SAC solder alloys with various Ag contents.

A three-dimensional nonlinear finite element simulation is used to investigate the thermal cyclic behavior of several SAC solder alloys with various silver percentages, including 1%, 2%, 3% and 4%. The mechanical properties of the unleaded interconnects with various Ag amounts are collected from reliable literature resources and used in the analysis accordingly. Furthermore, the solder creep behavior is examined using the two famous creep laws, namely, Garofalo’s and Anand’s models.

The nonlinear computational analysis results showed that the silver content has a great influence on the solder behavior as well as on thermal fatigue life expectancy. Specifically, solders with relatively high Ag content are expected to have lower plastic deformations and strains and thus better fatigue performance due to their higher strengths and failure resistance characteristics. However, such solders would have contrary fatigue performance in drop and shock environments and the low-Ag content solders are presumed to perform significantly better because of their higher ductility.

Generally, this research recommends the use of SAC solder interconnects of high silver contents, e.g. 3% and 4%, for designing electronic assemblies continuously exposed to thermal loadings and solders with relatively low Ag-content, i.e. 1% and 2%, for electronic packages under impact and shock loadings.

Polymethyl methacrylate (PMMA) is a remarkable biocompatible material for bone cement and regeneration. It is also considered 3D printable but requires in-depth process–structure–properties studies. This study aims to elucidate the mechanistic effects of processing parameters and sterilization on PMMA-based implants.

The approach comprised manufacturing samples with different raster angle orientations to capitalize on the influence of the filament alignment with the loading direction. One sample set was sterilized using an autoclave, while another was kept as a reference. The samples underwent a comprehensive characterization regimen of mechanical tension, compression and flexural testing. Thermal and microscale mechanical properties were also analyzed to explore the extent of the appreciated modifications as a function of processing conditions.

Thermal and microscale mechanical properties remained almost unaltered, whereas the mesoscale mechanical behavior varied from the as-printed to the after-autoclaving specimens. Although the mechanical behavior reported a pronounced dependence on the printing orientation, sterilization had minimal effects on the properties of 3D printed PMMA structures. Nonetheless, notable changes in appearance were attributed, and heat reversed as a response to thermally driven conformational rearrangements of the molecules.

This research further deepens the viability of 3D printed PMMA for biomedical applications, contributing to the overall comprehension of the polymer and the thermal processes associated with its implementation in biomedical applications, including personalized implants.

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

The purpose of this study is to prepare thermal transfer ribbons with good alcohol resistance.

A variety of alcohol-resistant thermal transfer inks were prepared using different polyester resins. The printing temperature, printing effect, adhesion and alcohol resistance of the inks on the label were studied to determine the feasibility of using the ink for manufacturing thermal transfer ribbons. The ink formulations were prepared by a simple and stable grinding technology, and then use mature coating technology to make the ink into a thermal transfer ribbon.

The results show that the thermal transfer ink has good scratch resistance, good alcohol resistance and low printing temperature when the three resins coexist. Notably, the performance of the ribbon produced by 500 mesh anilox roller was better than that of other meshes. Specifically, the ink on the matte silver polyethylene terephthalate (PET) label surface was wiped with a cotton cloth soaked in isopropyl alcohol under 500 g of pressure. After 50 wiping cycles, the ink remained intact.

The proposed method not only ensures good alcohol resistance but also has lower printing temperature and wider label applicability. Therefore, it can effectively reduce the loss of printhead and reduce production costs, because of the low printing temperature.

The purpose of this study is to demonstrate and characterise a soft-tooled micro-injection moulding process through in-line measurements and surface metrology using a data-intensive approach.

A soft tool for a demonstrator product that mimics the main features of miniature components in medical devices and microsystem components has been designed and fabricated using material jetting technique. The soft tool was then integrated into a mould assembly on the micro-injection moulding machine, and mouldings were made. Sensor and data acquisition devices including thermal imaging and injection pressure sensing have been set up to collect data for each of the prototypes. Off-line dimensional characterisation of the parts and the soft tool have also been carried out to quantify the prototype quality and dimensional changes on the soft tool after the manufacturing cycles.

The data collection and analysis methods presented here enable the evaluation of the quality of the moulded parts in real-time from in-line measurements. Importantly, it is demonstrated that soft-tool surface temperature difference values can be used as reliable indicators for moulding quality. Reduction in the total volume of the soft-tool moulding cavity was detected and quantified up to 100 cycles. Data collected from in-line monitoring was also used for filling assessment of the soft-tool moulding cavity, providing about 90% accuracy in filling prediction with relatively modest sensors and monitoring technologies.

This work presents a data-intensive approach for the characterisation of soft-tooled micro-injection moulding processes for the first time. The overall results of this study show that the product-focussed data-rich approach presented here proved to be an essential and useful way of exploiting additive manufacturing technologies for soft-tooled rapid prototyping and new product introduction.