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The purpose of this paper is to create a usable life forecast model for consumable parts using neural network approach. It focuses on a consumable probe card used in the semiconductor wafer testing operation. Referring to the relevant resources and the semiconductor testing operation, a fundamental concept is built to develop a probe card management system.

A neural network analysis software package, Q‐net2000, is applied in this study. In this case, there is one hidden layer and the neural network learning rates and momentum are set to 0.1 and 0.7. Forecast the usable life by inputting the initial values of the neural network variables into a back‐propagation neural network.

In this system, the first thing is to collect the production, maintenance and repair data, and then analyze those data by using a neural network methodology to effectively forecast a probe card's usable life. Those data are integrated to derive an optimum timing of placing a probe card order using an inventory control technique. Finally, the actual production data of a company are used to verify the feasibility of this research.

The results presented are based on a representative expendable probe card manufacturing process in the Taiwan industry, a range of alternative scenarios and changes to the process design can be investigated using the simulation model.

For the semiconductor industry, the research supports the introduction on lifecycle forecast technology for expendable probe card manufacturing process.

The paper proposes a neural network forecast analysis to solve the case company's current management problem of determining the life cycle of probe cards in an earlier time.

The purpose of this paper is to develop a model‐based methodology for the repetitive testing of multiple products with limited capacity, when the testing process is imperfect.

In a repetitive testing process, items that are classified as non‐conforming may be conforming, resulting in excessive scrapping of good items. Failed items are commonly retested to reduce scrapping costs. This paper develops a stochastic optimization formulation and its solution to determine the numbers of repetitive tests for multiple products that minimize the sum of the expected scrapping costs and variable testing costs, subject to a testing equipment capacity constraint. It also develops a procedure to estimate the parameter values that are used in the optimization formulation.

Computational experiments are conducted to evaluate the estimation and solution procedure and to understand the effect of testing machine capacity on the optimal total cost. These results demonstrate the viability of the proposed approach and the criticality of accurate parameter estimation.

This research shows the usefulness of the proposed optimization/statistical estimation approach to a real‐life complex inspection problem. However, the proposed model has to be modified when the characteristics of the testing equipment are changed.

The authors capture the idiosyncrasies in semiconductor manufacturing such as the high outgoing quality level, the repetitive testing environment, the high coefficient of variation in the number of failure products, and the testing capacity constraint. Conducting extensive computational experiments, the authors demonstrate that the proposed approach is viable.

The paper describes a complex, real‐life inspection management situation, develops a rigorous model‐based solution approach, and carefully demonstrates its viability.

The purpose of this paper is to evaluate the performance of the semiconductor industry in Taiwan, which is the main economic life‐line in Taiwan. Operational performance is normally deemed as a key factor in industry. The importance of this issue can be measured through performance indices to observe the operational performance of Taiwan's semiconductor industry.

A combination of the data envelopment analysis (DEA) and the balanced scorecard (BSC) was employed

This study finds that the efficiency of every domestic semiconductor manufacturer is generally good, and concerning the four perspectives of the balanced scorecard, the most important for the domestic firm is the financial perspective, second is the internal process perspective, third the learning and innovation perspective, and most unimportantly customer perspective.

Owing to the difficulties in data collection and the widespread ranges of the four major aspects, the application of the indices is limited in this paper. Therefore, the main suggestion of this study regarding future research directions is to expand the indices of the four aspects, in the hope of measuring the operating efficiency of enterprises in each aspect using more and improved indices.

This application can be extended by the usage of the ratio analysis and the BSC method to enhance the validity of the DEA.

When implementing DEA, traditional financial indices cannot obtain an in‐depth understanding of an enterprise, hence this study considers the four major constructs of the balanced scorecard in index selection, and employed these four major contracts to expand the indices that can be available for selection and gain a deeper understanding not only of the financial aspects, but also of customers, the internal process, learning, and innovation. It should be noted that the balanced scorecard can develop the performance goal from the perspective of job fulfillment, and uses this view to assess management performance. These indicators can reflect different focuses regarding job fulfillment, and produce pluralism in the performance indices.

This article describes reliability analysis and failure cause determination in encapsulated semiconductor devices. Such devices were subjected to a destructive life test using temperature as an accelerating stress. Once the devices had failed, the failure data were statistically analysed with the aid of a digital computer. The failed devices were then decapsulated and failure causes were determined using different types of microscopy. The article gives detailed information about the tests and analysis mentioned above.

The purpose of this paper is to address the gap between definition and practical aspects of production efficiency in mass customization (MC). The paper summarizes all major issues impacting efficiency in MC. Also, the paper reviews metrics, relationship between various parameters and provides a best practices benchmark toolkit to achieve higher machine efficiencies.

The paper identified and categorized multiple challenges impacting machine efficiency in MC through a literature review spanning over three decades, and also ranked the identified issue-based parameters. Top issues were found varying across different types of industries identified through the review. Metrics pertaining to efficiency and degree of MC are reviewed in the paper. A chronological review of issues is presented, and a chain diagram is built in the paper. Toolkit of best practices created with solution strategies and tools are summarized through the review.

The paper found that MC reasonably impacts machine efficiency which needs to be addressed. Major issues through literature review-based ranking are uncovered, and worldwide research trend and comparison are presented. Active research in this area is observed to be at its peak since 2010. The extensive use of strategies and benchmark toolkit for improving efficiency are summarized.

Ranking of issues has been done through a literature review; hence, there can be skewness depending on the frequency of issues researched by various authors in various areas of industries.

This paper is useful for manufacturing managers and companies willing to increase the size of their product portfolio and choices within their available resources without compromising machine efficiencies and, thereby, the cost. The identified issues help in providing a comprehensive issue list to the academia.

This paper describes what is believed to be the first study that explicitly examines the issues faced in achieving machine efficiency while manufacturing in an MC environment.

Alan Hobby has recently been appointed Applications Engineer at DEK Printing Machines Ltd, Weymouth. In 1968 he joined Ferranti at Bracknell and became one of the small team setting up the thick film production unit. Four years later he joined EMI at Hayes as the Production Engineer, where he gained experience in the manufacture of high volume but relatively simple hybrids. In 1975 Alan moved to Marconi Electronic Devices Ltd at Portsmouth, where he was one of the engineers responsible for the company's programme of qualification as a hybrid manufacturer for the European Space Agency and for their BS 9450 approval programme. Since then he has been concerned with the development of printing and firing techniques both at Portsmouth and at Marconi's high volume production unit at Swindon.

In a complex semiconductor manufacturing system (SMS) environment, the implementation of dynamic production scheduling and dispatching strategies is critical for SMS distributed collaborative manufacturing events to make quick and correct decisions. The purpose of this paper is to assist manufacturers in achieving the real time dispatching and obtaining integrated optimization for shop floor production scheduling.

In this paper, an integrated model is designed under assemble to order environment and a framework of a real time dispatching (IRTD) system for production scheduling control is presented accordingly. Both of the scheduling and ordering performances are integrated into the days of inventory based dispatching algorithm, which can deal with the multiple indicators of dynamic scheduling and ordering in this system to generate the “optimal” dispatching policies. Subsequently, the platform of IRTD system is realized with four modules function embedded.

The proposed IRTD system is designed to compare the previous constant work in process method in the experiment, which shows the better performance achievement of the IRTD system for shop floor production dynamic scheduling and order control. The presented framework and algorithm can facilitate real time dispatching information integration to obtain performance metrics in terms of reliability, availability, and maintainability.

The presented system can be further developed to generic factory manufacturing with the presented logic and architecture proliferation.

The IRTD system can integrate the real time customer demand and work in process information, based on which manufacturers can make correct and timely decisions in solving dispatching strategies and ordering selection within an integrated information system.

After many very successful years as a researcher and manager at British Telecommunications Research Laboratories, Nihal Sinnadurai has moved over to consultancy with BPA (Technology & Management) Ltd.

Jeff Hotchkiss, President of the Assembly Test Division of Teradyne, Inc., the largest electronics testing company in the world, returned to the corporation where he had built his career after a three-year hiatus as CEO of a VOIP start-up. Teradyne's operation was struggling through the effects of a bad economy coupled with significant downturns in the electronics industry, and Hotchkiss encountered numerous problems specifically in the China operation, including customer dissatisfaction with service, price, and time required to implement changes. He assembled a strategic team to address these issues and to recommend and implement an accelerated turnaround in China. Students are challenged to design the turnaround plan.

The laborious process of producing half pressings and welding these has long been the process by which tight radius bends have been achieved on thin wall tube from exotic materials.