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To provide practitioners of management a sense of the importance of strategically leveraging the current and historic development of radio frequency identification (RFID) in order to find inexpensive applications of radio frequency‐based (RF) technologies in many areas.

A review of the applied literature on RFID, as well as from practical experience, resulted in a basic model of viewpoint to understand the nature of the emergent RF‐based industry.

Wal‐Mart and other cost sensitive and value chain progressive companies' usage of RFID‐based technology should revolutionize the method that companies' track inventory. However, some of the disadvantages include costs, training, product label and supplies, and privacy infringement. One asset to companies like Wal‐Mart is pallet tracking because it improves on‐time inventory delivery. This helps Wal‐Mart since they rely on just‐in‐time ordering.

RFID is currently used in many industries such as transportation and distribution, manufacturing and processing, and security and law enforcement. The advantages RFID gives to companies are the following: enhanced record management, customer behavior patterns, and accurate inventory tracking.

This paper describes RFID and its implementation process in an academic manner, some disadvantages of RFID, and examples of how the technology can improve customer relationship management (CRM) are discussed. Originality/value – This form of identification can be used in large stores like Wal‐Mart to receive real time information. By implementing RFID, companies will create a fully integrated supply chain system. Traditionally, many supply chain management (SCM) research has simply viewed RF‐based technology as a technological innovation, not a transformational event as this paper presents.

The new technology of RF‐ID, intelligent tagging, has become widespread in some industries such as distribution and baggage handling, and is set to dominate retail security in the near future. Library security and automation are tailor‐made applications for it which are ready to roll. What is it and what does it mean for Librarians?

The purpose of this paper is to present a new class of printed circuit board (PCB)‐based, radio frequency micro‐electro‐mechanical systems (RF‐MEMS) switches and to describe the packaging method and evaluate performance.

Traditional PCB materials and processes were combined with photolithographic high‐density interconnect (HDI) and MEMS to form 3D high‐performance RF switches.

A new type of MEMS RF switch has been developed on a PCB platform. Using processes analogous to those used for silicon MEMS, PCB, and HDI technologies were utilized to fabricate these 3D structures. The PCB‐based microstructures are “mil‐scale” rather than the “micro‐scale” of silicon MEMs. A co‐fabrication packaging method for the MEMS RF switch was also developed. The PCB‐based MEMS switches have demonstrated excellent RF performance and “hot‐switching” RF power‐handling capability. PCB‐based MEMS RF switches have the advantages of low cost and amenability to scale‐up for a high degree of integration.

Further development on photo imageable dielectric materials will enable this technology to improve yield and processability.

The paper describes the development of PCB‐based MEMS RF switches. These elements will enable new applications and enhance the functionality of PCBs. They are also more amenable to system integration compared with silicon MEMS.

At present the energy generation and distribution landscape is changing rapidly. The energy grid is becoming increasingly smart, relying on an information network for the purposes of monitoring and optimization. However, because of the particularly stringent regulatory and technical constraints posed by smart grids, it is not possible to use ordinary communication protocols. The purpose of this paper is to revisit such constraints, reviewing the various options available today to realize smart‐metering networks.

After describing the regulatory, technological and stakeholders' constraints, the authors provide a taxonomy of network technologies, discussing their suitability and weaknesses in the context of smart‐metering systems. The authors also give a snapshot of the current standardization panorama, identifying key differences among various geographical regions.

It is found that the field of smart‐metering networks still consists of a fragmented set of standards and solutions, leaving open a number of issues relating to the design and deployment of suitable systems.

This paper addresses the need to better understand state‐of‐the‐art and open issues in the fast‐evolving area of smart energy grids, with particular attention to the challenges faced by communication engineers.

The purpose of this paper is to study the effect of diode power detector modelling on six-port communication receiver performance.

Based on proposed and conventional squared diode model, six-port receiver’s demodulation and its error vector magnitude (EVM) performance due to hardware impairments are studied. Through considering both the models, the accuracy of proposed power detector model is compared to the squared model, and then both results are validated with envelope simulation (ENV) in advanced design system (ADS).

Comparing the numerical results with envelope simulation results proved that the proposed model is much more accurate than the conventional squared model for a wide range of input power levels.

Studying the receiver’s performance numerically, by considering the new proposed analytical approach for diode power detectors which is more accurate than the conventional squared model.

High Q on‐chip inductors and low loss on‐chip interconnects and transmission lines are an important roadblock for the further development of Si‐based technologies at RF and microwave frequencies. In this paper, inductors are realized on standard Si wafers (20 Ω.cm) using MCM‐D processing. This consists of realizing two low K dielectric layers (BCB) and a thick Cu interconnect layer. Inductors with 5 μm lines and spaces are demonstrated for a 5 μm thick Cu layer, hereby leading to a very compact and high performance inductors: Q‐factors in the range of 25 to 30 have been obtained for inductances in the range of 1 to 5 nH. It is also shown how the Q‐factor and resonance frequency vary as a function of the inductor layout parameters and the thickness of the BCB and Cu layers. The realized 50 Ω CPW lines (lateral dimension of 40 μm) have a measured loss of only 0.2 dB/mm at 25 GHz.

The development of a sensor microsystems containing all the components of data acquisition system, such as sensors, signal‐conditioning circuits, analog‐digital converter, interface circuits and embedded microcontroller (MCU), has become the focus of attention in many biomedical applications. A review of the microsystems technology is presented in this paper, along with a discussion of the recent trends and challenges associated with its developments. A basic description of each sub‐system is also given. This includes the different front end, mixed analog‐digital, power management, and radio transmitter‐receiver circuits. These sub‐system designs are presented and discussed in a comparative study and final remarks are made. The performance of each sub‐system is assessed regarding many aspects related to the overall system performance.

Millets are ancient grains, following wheat, that have been a fundamental source of human sustenance. These are nutrient-rich small-seeded grains that have gained prominence and admiration globally due to their super resilience in diverse climates and significant nutritional benefits. As millets are renowned for their nutritional richness, the demand for millet-based products increases. Hence, this paper aims in identifying the growing need for innovative processing techniques that not only preserve their nutritional content but also extend their shelf life.

In traditional times, heat was the only means of cooking and processing of the foods, but the amount of damage they used to cause to the sensorial and nutritional properties was huge. Millets’ sensitivity toward heat poses a challenge, as their composition is susceptible to disruption during various heat treatments and manufacturing processes. To cater to this drawback while ensuring the prolonged shelf life and nutrient preservation, various innovative approaches such as cold plasma, infrared technology and high hydrostatic pressure (HPP) processing are being widely used. These new methodologies aim on inactivating the microorganisms that have been developed within the food, providing the unprocessed, raw and natural form of nutrients in food products.

Among these approaches, nonthermal technology has emerged as a key player that prioritizes brief treatment periods and avoids the use of high temperatures. Nonthermal techniques (cold plasma, infrared radiation, HPP processing, ultra-sonication and pulsed electric field) facilitate the conservation of millet’s nutritional integrity by minimizing the degradation of heat-sensitive nutrients like vitamins and antioxidants. Acknowledging the potential applications and processing efficiency of nonthermal techniques, the food industry has embarked on substantial investments in this technology. The present study provides an in-depth exploration of the array of nonthermal technologies used in the food industry and their effects on the physical and chemical composition of diverse millet varieties.

Nonthermal techniques, compared to conventional thermal methods, are environmentally sound processes that contribute to energy conservation. However, these conveniences are accompanied by challenges, and this review not only elucidates these challenges but also focuses on the future implications of nonthermal techniques.

Research done to date has produced a wide range of perspectives that center on the junction between the specific function and responsibility of the entrepreneur when applying ethical dimensions to the field of entrepreneurship. By combining a bibliometric analysis with the literature review, the purpose of this paper is to provide an overview of entrepreneurship ethics and its contribution to sustainable development goals, along with future research directions on the topic of entrepreneurship and ethics.

The research looked for literature based on entrepreneurship ethics from the Dimension database. The authors accumulated 2,279 articles for the period of 2002–2022 for analysis. The authors used bibliometric analysis for analyzing the topic with the use of VosViewer and Excel.

By combining a bibliometric analysis with a literature review, this study aimed to provide an overview of the ethics and entrepreneurship and contribution to sustainable development goals. The most influential author and journal are Vanessa Ratten and the Journal of Business Ethics, respectively. The top sustainable development goals (SDGs) being contributed by entrepreneurship ethics are SDG4, SDG8, SDG16, SDG11 and SDG3. By contrasting these two interpretations, the authors have demonstrated that the entrepreneurship environment involves various ethical issues connected to personal, organizational and societal sectors.

The current study may serve as a general guideline for future investigation into this topic.

Regarding the practical ramifications, the findings can help entrepreneurs who are preparing to launch a business or are already doing so. The findings provide a comprehensive framework of success variables that must be considered to improve the venture’s performance.

This study’s originality is from presenting a structured and in-depth literature review that describes the current state of entrepreneurship ethics and its contribution to sustainable development goals. A complete analysis of the data gathered on entrepreneurship ethics is offered to establish that it is sustainable.