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An experimental investigation for developing structure-property correlations of hot-rolled E410 steels with different carbon contents, i.e. 0.04wt.%C and 0.17wt.%C metal active gas (MAG) and cold metal transfer (CMT)-MAG weldments was undertaken.

Mechanical properties and microstructure of MAG and CMT-MAG weldments of two E410 steels with varying content of carbon were compared using standardized mechanical testing procedures, and conventional microscopy.

0.04wt.%C steel had strained ferritic and cementite sub-structures in blocky shape and large dislocation density, while 0.17wt.%C steel consisted of pearlite and polygonal ductile ferrite. This effected yield strength (YS), and microhardness being larger in 0.04wt.%C steel, %elongation being larger in 0.17wt.%C steel. Weldments of both E410 steels obtained with CMT-MAG performed better than MAG in terms of YS, ultimate tensile strength (UTS), %elongation, and toughness. It was due to low heat input of CMT-MAG that resulted in refinement of weld metal, and subzones of heat affected zone (HAZ).

A substantial improvement in YS (∼9%), %elongation (∼38%), and room temperature impact toughness (∼29%) of 0.04wt.%C E410 steel is achieved with CMT-MAG over MAG welding. Almost ∼10, ∼12.5, and ∼16% increment in YS, %elongation, and toughness of 0.17wt.%C E410 steel is observed with CMT-MAG. Relatively low heat input of CMT-MAG leads to development of fine Widmanstätten and acicular ferrite in weld metal and microstructural refinement in HAZ subzones with nearly similar characteristics of base metal.

The metallic alloys and their components fabricated via laser powder bed fusion (LPBF) suffer from the microvoids formed inevitably due to the extreme solidification rate during fabrication, which are impossible to be removed by heat treatment. This paper aims to remove those microvoids in as-built AlSi10Mg alloys by hot forging and enhance their mechanical properties.

AlSi10Mg samples were built using prealloyed powder with a set of optimized LPBF parameters, viz. 350 W of laser power, 1,170 mm/s of scan speed, 50 µm of layer thickness and 0.24 mm of hatch spacing. As-built samples were preheated to 430°C followed by immediate pressing with two different thickness reductions of 10% and 35%. The effect of hot forging on the microstructure was analyzed by means of X-ray diffraction, scanning electron microscopy, electron backscattered diffraction and transmission electron microscopy. Tensile tests were performed to reveal the effect of hot forging on the mechanical properties.

By using hot forging, the large number of microvoids in both as-built and post heat-treated samples were mostly healed. Moreover, the Si particles were finer in forged condition (∼150 nm) compared with those in heat-treated condition (∼300 nm). Tensile tests showed that compared with heat treatment, the hot forging process could noticeably increase tensile strength at no expense of ductility. Consequently, the toughness (integration of tensile stress and strain) of forged alloy increased by ∼86% and ∼24% compared with as-built and heat-treated alloys, respectively.

Hot forging can effectively remove the inevitable microvoids in metals fabricated via LPBF, which is beneficial to the mechanical properties. These findings are inspiring for the evolution of the LPBF technique to eliminate the microvoids and boost the mechanical properties of metals fabricated via LPBF.

This study aims to characterize the mechanical properties of sintered nano-silver under various sintering processes by nano-indentation tests.

Through microstructure observations and characterization, the influences of sintering process on the microstructure evolutions of sintered nano-silver were presented. And, the indentation load, indentation displacement curves of sintered silver under various sintering processes were measured by using nano-indentation test. Based on the nano-indentation test, a reverse analysis of the finite element calculation was used to determine the yielding stress and hardening exponent.

The porosity decreases with the increase of the sintering temperature, while the average particle size of sintered nano-silver increases with the increase of sintering temperature and sintering time. In addition, the porosity reduced from 34.88%, 30.52%, to 25.04% if the ramp rate was decreased from 25°C/min, 15°C/min, to 5°C/min, respectively. The particle size appears more frequently within 1 µm and 2 µm under the lower ramp rate. With reverse analysis, the strain hardening exponent gradually heightened with the increase of temperature, while the yielding stress value decreased significantly with the increase of temperature. When the sintering time increased, the strain hardening exponent increased slightly.

The mechanical properties of sintered nano-silver under different sintering processes are clearly understood.

This paper could provide a novel perspective on understanding the sintering process effects on the mechanical properties of sintered nano-silver.

The purpose of this study is to design and process the optimal V-shaped microstructure for 7075 aluminum alloy and reveal its wear resistance mechanism and performance.

The hydrodynamic pressure lubrication models of the nontextured, V-shaped, circular and square microtextures are established. The corresponding oil film pressure distributions are explored. The friction and wear experiments are conducted on a rotating device. The effects of the microstructure shapes and sizes on the wear mechanisms are investigated via the friction coefficients and surface morphologies.

In comparison, the V-shaped microtexture has the largest oil film carrying capacity and the lowest friction coefficient. The wear mechanism of the V-shaped microtexture is dominated by abrasive and adhesive wear. The V-shaped microtexture has excellent wear resistance under a side length of 300 µm, an interval of 300 µm and a depth of 20 µm.

This study is conductive to the design of wear-resistant surfaces for friction components.

The purpose of this paper is to investigate the effects of electric current stressing on damping properties of Sn5Sb solder.

Uniformly shaped Sn5Sb solders were prepared as samples. The length, width and thickness of the samples were 60.0, 5.0 and 0.5 mm, respectively. The damping properties of the samples were tested by dynamic mechanical analyzer with a cooling system to control the test temperature in the range of −100 to 100°C. Simultaneously, electric current was imposed to the tested samples using a direct current supply. After tests, the samples were characterized using scanning electron microscope, electron backscatter diffraction and transmission electron microscope, which was aimed to figure out the damping mechanism in terms of electric current stressing induced microstructure evolution.

It is confirmed experimentally that the increase in damping properties is due to Joule heating and athermal effects of current stressing, in which Joule heating should make a higher contribution. G–L theory can be used to explain the damping properties of strain amplitude under current stressing by quantitative description of geometrically necessary dislocation density. While the critical strain amplitude and high temperature activation energy decrease with increasing electric current.

These results provide a new method for vibration reliability evaluation of high-temperature lead-free solders in serving electronics. Notably, this method should be also inspiring for the mechanical performance evaluation and reliability assessment of conductive materials and structures serving under electric current stressing.

The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects of 0.5%Sb and 0.07%Ce doping on microstructure, thermal properties and mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder were investigated.

According to the mass ratio, the solder alloys were prepared from tin ingot, antimony ingot, silver ingot and copper ingot with purity of 99.99% at 400°C. X-ray diffractometer was adopted for phase analysis of the alloys. Optical microscopy, scanning electron microscopy and energy dispersive spectrometer were used to study the effect of the Sb and Ce doping on the microstructure of the solder. Then, the thermal characteristics of alloys were characterized by a differential scanning calorimeter (DSC). Finally, the ultimate tensile strength (UTS), elongation (EL.%) and yield strength (YS) of solder alloys were measured by tensile testing machine.

With the addition of Sb and Ce, the ß-Sn and intermetallic compounds of solders were refined and distributed more evenly. With the addition of Sb, the UTS, EL.% and YS of Sn-1.0Ag-0.5Cu increased by 15.3%, 46.8% and 16.5%, respectively. The EL.% of Sn-1.0Ag-0.5Cu increased by 56.5% due to Ce doping. When both Sb and Ce elements are added, the EL.% of Sn-1.0Ag-0.5Cu increased by 93.3%.

The addition of 0.5% Sb and 0.07% Ce can obtain better comprehensive performance, which provides a helpful reference for the development of Sn-Ag-Cu lead-free solder.

The purpose of this paper is to determine the ultra-high cycle fatigue behavior and ultra-slow crack propagation behavior of selective laser melting (SLM) AlSi7Mg alloy under as-built conditions.

Constant amplitude and two-step variable amplitude fatigue tests were carried out using ultrasonic fatigue equipment. The fracture surface of the failure specimen was quantitatively analyzed by scanning electron microscope (SEM).

The results show that the competition of surface and interior crack initiation modes leads to a duplex S–N curve. Both manufacturing defects (such as the lack of fusion) and inclusions can act as initially fatal fatigue microcracks, and the fatigue sensitivity level decreases with the location, size and type of the maximum defects.

The research results play a certain role in understanding the ultra-high cycle fatigue behavior of additive manufacturing aluminum alloys. It can provide reference for improving the process parameters of SLM technology.

Wire-arc-based additive manufacturing (WAAM) is a promising technology for the efficient and economical fabrication of medium-large components. However, the anisotropic behavior of the multilayered WAAM-fabricated components remains a challenging problem.

The purpose of this paper is to conduct a comprehensive study of the grain morphology, crystallographic orientation and texture in three regions of the WAAM printed component. Furthermore, the interdependence of the grain morphology in different regions of the fabricated component with their mechanical and tribological properties was established.

The electron back-scattered diffraction analysis of the top and bottom regions revealed fine recrystallized grains, whereas the middle regions acquired columnar grains with an average size of approximately 8.980 µm. The analysis revealed a higher misorientation angle and an intense crystallographic texture in the upper and lower regions. The investigations found a higher microhardness value of 168.93 ± 1.71 HV with superior wear resistance in the bottom region. The quantitative evaluation of the residual stress detected higher compressive stress in the upper regions. Evidence for comparable ultimate tensile strength and greater elongation (%) compared to its wrought counterpart has been observed.

The study found a good correlation between the grain morphology in different regions of the WAAM-fabricated component and their mechanical and wear properties. The Hall–Petch relationship also established good agreement between the grain morphology and tensile test results. Improved ductility compared to its wrought counterpart was observed. The anisotropy exists with improved mechanical properties along the longitudinal direction. Moreover, cylindrical components have superior tribological properties compared with cuboidal components.

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

The consolidation process and morphology evolution in ceramics-based additive manufacturing (AM) are still not well-understood. As a way to better understand the ceramic selective laser sintering (SLS), a dynamic three-dimensional computational model was developed to forecast thermal behavior of hydroxyapatite (HA) bioceramic.

AM has revolutionized automotive, biomedical and aerospace industries, among many others. AM provides design and geometric freedom, rapid product customization and manufacturing flexibility through its layer-by-layer technique. However, a very limited number of materials are printable because of rapid melting and solidification hysteresis. Melting-solidification dynamics in powder bed fusion are usually correlated with welding, often ignoring the intrinsic properties of the laser irradiation; unsurprisingly, the printable materials are mostly the well-known weldable materials.

The consolidation mechanism of HA was identified during its processing in a ceramic SLS device, then the effect of the laser energy density was studied to see how it affects the processing window. Premature sintering and sintering regimes were revealed and elaborated in detail. The full consolidation beyond sintering was also revealed along with its interaction to baseplate.

These findings provide important insight into the consolidation mechanism of HA ceramics, which will be the cornerstone for extending the range of materials in laser powder bed fusion of ceramics.