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Health service organizations and professionals are under increasing pressure to work together to deliver integrated patient care. A common understanding of integration strategies may facilitate the delivery of integrated care across inter‐organizational and inter‐professional boundaries. This paper aims to build a framework for exploring and potentially aligning multiple stakeholder perspectives of systems integration.

The authors draw from the literature on shared mental models, strategic management and change, framing, stakeholder management, and systems theory to develop a new construct, Mental Models of Integrated Care (MMIC), which consists of three types of mental models, i.e. integration‐task, system‐role, and integration‐belief.

The MMIC construct encompasses many of the known barriers and enablers to integrating care while also providing a comprehensive, theory‐based framework of psychological factors that may influence inter‐organizational and inter‐professional relations. While the existing literature on integration focuses on optimizing structures and processes, the MMIC construct emphasizes the convergence and divergence of stakeholders' knowledge and beliefs, and how these underlying cognitions influence interactions (or lack thereof) across the continuum of care.

MMIC may help to: explain what differentiates effective from ineffective integration initiatives; determine system readiness to integrate; diagnose integration problems; and develop interventions for enhancing integrative processes and ultimately the delivery of integrated care.

Global interest and ongoing challenges in integrating care underline the need for research on the mental models that characterize the behaviors of actors within health systems; the proposed framework offers a starting point for applying a cognitive perspective to health systems integration.

The design and implementation of a broadband quasi-monolithic microwave integrated circuit (q-MMIC) power amplifier (PA) is presented for 0.2 to 2.2 GHz applications.

To obtain an efficient, high-gain and high-power performance with in a compact and low-cost size, the prototype is based on Gallium nitride (GaN) on SiC 0.25-µm transistors, whereas the passive matching networks are realized on an AlN substrate as thin film circuit.

Measured results of the q-MMIC PA across the 0.2 to 2.2 GHz band show at least 32 ± 3 dB small-signal gains, an output power of 7 to 12 W and an average power add efficiency greater than 54%. The q-MMIC occupies an area of 12.8 × 14.5 mm².

To the best of the authors’ knowledge, this work reports the first full integrated PA which covers the frequency range of 0.2 to 2.2 GHz and achieves the combination of highest gain, about 10 W output power, together with the smallest component size among all published GaN PAs to date.

A novel Ka-band compact parallel-coupled microstrip bandpass filter with harmonic suppression performance has been designed, implemented and tested on GaAs MMIC.

This proposed filter consists of modified coupled-line units with T-shaped open-stubs.

The proposed filter with T-shaped open-stubs is valuable in performance with low loss at fundamental frequency, suppression at harmonic frequencies and small size. The simulation is based on full-wave electromagnetic analysis and the measurement is based on chip test. It shows an insertion loss below 1.2 dB, return loss better than 20 dB in the pass band and high than 28 dB suppression at harmonic frequencies.

This Ka-band MMIC filter with harmonic suppression is attractive for the millimeter-wave system.

The purpose of this paper is to introduce a novel research area involved in fast compute‐online and electronic design automation (EDA) realization, so‐called COMPOL project or COMPOL software tool online (www.compute‐online.com) that is applied to designs of radio frequency integrated circuits/monolithic microwave integrated circuits (RFIC/MMIC) passive components.

This research work will present an interactive software package that has been fitted and verified by the results based on full‐wave full domain Lagrange differential (FDLD) method and experimental approach to realize EDA of RFIC RFIC/MMIC passive components. The developed web platform is based on browser/server pattern, by use of VisualStudio.NET and ASP.NET technologies.

Its functionality may include analysis, synthesis, optimization, interpolation, and modeling of spiral inductors and coplanar waveguide (CPW) with any shape on any material substrate for microwave and wireless applications. Through the complete online processing of the inductors and CPW designs, it is approvable to expand to design applications of other passive components such as resistor (R), capacitor (C), transmission line and connector, etc.

This compute‐online algorithm is first developed by the use of the originally established numerical method – FDLD makes one case design possible to be done online in the time range of seconds.

The purpose of this paper is to present a K-band modified hairpin bandpass filter on a planar circuit with harmonic suppression and compact size.

The inter-connect transmission lines of conventional hairpin filter are replayed by T-shaped open stub to achieve transmission zero for second harmonic. This filter is simulated and optimized by using electromagnetic simulation software and tested on-chip.

This proposed filter shows the return loss of better than −10dB, the insertion loss of better than 2 dB in pass-band and suppression of more than 40 dB at second harmonic.

The proposed filter can be designed on monolithic microwave integrated circuit, PCB or LTCC and it is useable for microwave and microwave and millimeter-wave systems.

The purpose of this paper is to design and measure an H‐plane substrate integrated waveguide (SIW) 72 GHz backfired horn antenna chip. The SIW horn was fabricated on a standard 0.5‐μm GaAs process with substrate thickness of 100 μm.

Planar SIW horn design method with standard GaAs circuit design rule was adopted. The input reflection coefficient and output antenna gain was simulated at the FEM‐based 3D full‐wave EM solver, Ansoft HFSS and measured at the Agilent E8361C Network Analyzer and Cascade 110 GHz probe station.

The measured input −6 dB bandwidth is about 0.9 GHz at a center frequency of 72.39 GHz. The maximum antenna power gain extracted from the path loss at 72.39 GHz is about −3.64 dBi.

Thin substrate exhibits larger capacitance and energy stores rather than radiates. Flat cutting restricts the arc lens design and results in the radiation plane mismatches to the air. Simple taper transition design makes the input bandwidth much narrower. The problems can be further improved by selecting thicker substrate and the multi‐section input CPW GSG pads to microstrip transition.

Unlike the traditional anechoic chamber, the antenna measurement station is exposed to the open space and chip antenna was supported by the FR4 substrate and the metal probing station plate. A fully characterization of the antenna open space environment before the measurement is needed.

An H‐plane SIW 72 GHz horn antenna was designed and studied. The antenna was using the GaAs 0.5‐μm MMICs process design rule includes the SIW designed cylindrical metal bars all being restricted in standard rectangular shape. Compare to traditional bulky waveguide horn antenna, the antenna chip size is only 1.8×1.7 mm². The on‐wafer measurement is conducted to measure the input return loss and the maximum antenna power gain of the on‐chip antenna. The designed on‐chip SIW horn antenna is useful for the integrated design of the E band GaAs MMICs single‐chip RF transceiver.

The purpose of this paper is to design an on-chip inductor with high inductance, high-quality factor and high self-resonance frequency for the equivalent on-chip area using fractal curves.

A novel hybrid series stacked differential fractal inductor using Hilbert and Sierpinski fractal curves is proposed with two different layers connected in series using vias. The inductor is implemented in Sonnet EM simulator using 180 nm CMOS standard process technology.

The proposed inductor reduces the parasitic capacitance and negative mutual inductance between the adjacent layers with significant improvement in overall inductance, quality factor and self-resonance frequency when compared with conventional series stacked fractal inductors.

The fractal inductor is used to create high inductance in the single-layer process, but access to multilayers is restricted owing to unusual and expensive fabrication processes.

The proposed inductor can be used in implementation of low noise amplifier, voltage controlled oscillators and power amplifiers.

This paper introduces a combination of two fractal curves to implement a hybrid fractal inductor that enhances the performance of the inductor.