Search results

The purpose of this paper is to review possibilities of implementing ceramic additive manufacturing (AM) into electronic device production, which can enable great new possibilities.

A short introduction into additive techniques is included, as well as primary characterization of structuring capabilities, dielectric performance and applicability in the electronic manufacturing process.

Ceramic stereolithography (SLA) is suitable for microchannel manufacturing, even using a relatively inexpensive system. This method is suitable for implementation into the electronic manufacturing process; however, a search for better materials is desired, especially for improved dielectric parameters, lowered sintering temperature and decreased porosity.

Relatively inexpensive ceramic SLA, which is now available, could make ceramic electronics, currently restricted to specific applications, more available.

Ceramic AM is in the beginning phase of implementation in electronic technology, and only a few reports are currently available, the most significant of which is mentioned in this paper.

The purpose of this work was to characterize NiMn₂O₄ spinel-based thermistor powder, to use it in screen printing technology to fabricate temperature sensors, to study their performance for different sintering temperatures of thermistor layer, with and without insulative cover, as well as to investigate stability of the fabricated thermistors and their applicability in water quality monitoring.

After the characterization of starting NiMn₂O₄ spinel-based thermistor powder, it was converted to thick film paste which was screen printed on alumina substrate. Thermistor layers were sintered at four different sintering temperatures: 980°C, 1050°C, 1150°C and 1290°C. An interdigitated pattern of Ag-Pd conductive layer was used to reduce the resistance. Temperature-resistance characteristics were investigated in air and water, with and without insulative cover atop the thermistor layer. Stability of the fabricated thermistors after aging at 120°C for 300 h was also examined.

Thick film NiMn₂O₄ spinel thermistors, prepared by screen printing and sintering in the temperature range 980°C–1290°C, exhibited good negative temperature coefficient (NTC) characteristics in the temperature range −30°C to 145°C, including high temperature coefficient of resistance, good stability and applicability in water.

This study explores the range of sintering temperature that can be applied for NiMn₂O₄ thermistor thick films without compromising on the temperature sensing performance in air and water, as well as stability of the thermistors after aging at elevated temperatures.

The purpose of this paper is to present a study on miniaturized instruments for analytical chemistry with a microplasma as the excitation source.

The atmospheric pressure glow microdischarge could be ignited inside a ceramic structure between a solid anode and a liquid cathode. As a result of the cathode sputtering of the solution, it was possible to determine its chemical composition by analyzing the emission spectra of the discharge. Cathodes with microfluidic channels and two types of anodes were constructed. Both types were tested through experimentation. Impact of the electrodes geometry on the discharge was established. A cathode aperture of various sizes and anodes made from different materials were used.

The spectroscopic properties of the discharge and its usefulness in the analysis depended on the ceramic structure. The surface area of the cathode aperture and the flow rate of the solution influence on the detection limits (DLs) of Zn and Cd.

Constructed ceramic structures were able to excite elements and their laboratory-size systems. During the experiments, Zn and Cd were detected with DLs 0.024 and 0.053 mg/L, respectively.

The main purpose of this study is to test the performance of the ink-jet printed microwave resonant circuits on Low temperature co-fired ceramics (LTCC) substrates combined with microfluidic channels for sensor applications. Normally, conductive patterns are deposited on an LTCC substrate by means of the screen-printing technique, but in this paper applicability of ink-jet printing in connection with LTCC materials is demonstrated.

A simple microfluidic LTCC sensor based on the microstrip ring resonator was designed. It was assumed the micro-channel, located under the ring, was filled with a mixture of DI water and ethanol, and the operating frequency of the resonator was tuned to 2.4 GHz. The substrate was fabricated by standard LTCC process, and the pattern of the microstrip ring resonator was deposited over the substrate by means of an ink-jet printer. Performance of the sensor was assessed with the use of various volumetric concentrations of DI water and ethanol. Actual changes in concentration were detected by means of microwave measurements.

It can be concluded that ink-jet printing is a feasible technique for fast fabrication of micro-strip circuits on LTCC substrates, including microfluidic components. Further research needs to be conducted to improve the reliability, accuracy and performance of this technique.

The literature shows the use of ink-jet printing for producing various conductive patterns in different applications. However, the idea to replace the screen-printing with the ink-jet printing on LTCC substrates in connection with microwave-microfluidic applications is not widely studied. Some questions concerning accuracy and reliability of this technique are still open.