Advanced Technology Workshop on Passive Integration

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2002



(2002), "Advanced Technology Workshop on Passive Integration", Microelectronics International, Vol. 19 No. 1.



Emerald Group Publishing Limited

Copyright © 2002, MCB UP Limited

Advanced Technology Workshop on Passive Integration

Venue: The Cliff House on Bald Cliff overlooking the Atlantic OceanOgunquit, Maine, USADate: June 19-21, 2002Deadline for abstracts: January 7, 2002General Chair: Dr. Robert Heistand, AVXCorporationP: 843-444-2886; F: 843-448-2106Email:

Passive integration has been a continuing theme of this society since the early developments of resistor and dielectric pastes for thick film hybrid circuits. Today there are several platforms and technologies that address the need for continuing development of passive integration to increase performance, increase functionality and miniaturization, and reduce cost. From a platform perspective there are systems on a chip (SOC), systems in a package (SIP), and functional passive components, which is a lower level of focused integration. From the technology offering, great strides are being made in embedded passive organic laminates, low temperature cofired ceramic and thin film on chip or substrate. Distributed, geometric integration in SMT components is also evolving rapidly.

This ATW focuses on recent advancements in these technologies that are directly related to passive integration and the issues and roadblocks constraining implementation.

Papers are invited on the following Passive Integration Topics:

  • Design

  • Simulation and Libraries

  • Material Systems: Science & Properties

  • Fabrication of Passive Elements in Component Platforms:

    • Capacitors       ConnectorsDiodes       Flex CircuitsFerrites       LTCCInductors       On IC'sResistors       Organic LaminateThermistors       SMT chipsVaristors       Thin Film on Silicon,

    Glass or Ceramic

  • Test and Modeling

  • Applications and Partitioning Strategies

  • Infrastructure (EIA Registration, Standards etc.)

To submit an abstract:

Please send your 200 words abstract electronically by January 7, 2002, using the on-line submittal form at:

For alternative submission methods, please email Jackki Morris-Joyner jmorris@imaps.orgor call 305-382-8433.

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