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Gives a bibliographical review of the finite element methods (FEMs) applied for the linear and nonlinear, static and dynamic analyses of basic structural elements from the theoretical as well as practical points of view. The range of applications of FEMs in this area is wide and cannot be presented in a single paper; therefore aims to give the reader an encyclopaedic view on the subject. The bibliography at the end of the paper contains 2,025 references to papers, conference proceedings and theses/dissertations dealing with the analysis of beams, columns, rods, bars, cables, discs, blades, shafts, membranes, plates and shells that were published in 1992‐1995.

Sheet metal forming is a process of shaping thin sheets of metal by applying pressure through male or female dies or both. In most of used sheet‐formating processes the metal is subjected to primarily tensile or compressive stresses or both. During the last three decades considerable advances have been made in the applications of numerical techniques, especially the finite element methods, to analyze physical phenomena in the field of structural, solid and fluid mechanics as well as to simulate various processes in engineering. These methods are useful because one can use them to find out facts or study the processes in a way that no other tool can accomplish. Finite element methods applied to sheet metal forming are the subjects of this paper. The reason for writing this bibliography is to save time for readers looking for information dealing with sheet metal forming, not having an access to large databases or willingness to spend own time with uncertain information retrieval. This paper is organized into two parts. In the first one, each topic is handled and current trends in the application of finite element techniques are briefly mentioned. The second part, an Appendix, lists papers published in the open literature. More than 900 references to papers, conference proceedings and theses/dissertations dealing with subjects that were published in 1995‐2003 are listed.

Ceramic materials and glasses have become important in modern industry as well as in the consumer environment. Heat resistant ceramics are used in the metal forming processes or as welding and brazing fixtures, etc. Ceramic materials are frequently used in industries where a wear and chemical resistance are required criteria (seals, liners, grinding wheels, machining tools, etc.). Electrical, magnetic and optical properties of ceramic materials are important in electrical and electronic industries where these materials are used as sensors and actuators, integrated circuits, piezoelectric transducers, ultrasonic devices, microwave devices, magnetic tapes, and in other applications. A significant amount of literature is available on the finite element modelling (FEM) of ceramics and glass. This paper gives a listing of these published papers and is a continuation of the author's bibliography entitled “Finite element modelling of ceramics and glass” and published in Engineering Computations, Vol. 16, 1999, pp. 510‐71 for the period 1977‐1998.

The form of the paper is a bibliography. Listed references have been retrieved from the author's database, MAKEBASE. Also Compendex has been checked. The period is 1998‐2004.

Provides a listing of 1,432 references. The following topics are included: ceramics – material and mechanical properties in general, ceramic coatings and joining problems, ceramic composites, piezoceramics, ceramic tools and machining, material processing simulations, fracture mechanics and damage, applications of ceramic/composites in engineering; glass – material and mechanical properties in general, glass fiber composites, material processing simulations, fracture mechanics and damage, and applications of glasses in engineering.

This paper makes it easy for professionals working with the numerical methods with applications to ceramics and glasses to be up‐to‐date in an effective way.

A bibliographical review of the finite element methods (FEMs) applied for the linear and nonlinear, static and dynamic analyses of basic structural elements from the theoretical as well as practical points of view is given. The bibliography at the end of the paper contains 1,726 references to papers, conference proceedings and theses/dissertations dealing with the analysis of beams, columns, rods, bars, cables, discs, blades, shafts, membranes, plates and shells that were published in 1996‐1999.

This paper gives a review of the finite element techniques (FE) applied in the analysis and design of machine elements; bolts and screws, belts and chains, springs and dampers, brakes, gears, bearings, gaskets and seals are handled. The range of applications of finite elements on these subjects is extremely wide and cannot be presented in a single paper; therefore the aim of this paper is to give FE researchers/users only an encyclopaedic view of the different possibilities that exist today in the various fields mentioned above. An Appendix included at the end of the paper presents a bibliography on finite element applications in the analysis/design of machine elements for 1977‐1997.

The National Agency for Finite Element Methods and Standards (NAFEMS), which is sponsored by the Department of Trade and Industry, UK, is rapidly establishing itself as a major centre for quality control in the finite element community. NAFEMS is creating standards and benchmark tests against which systems performance can be assessed. There now follows a list of recent NAFEMS publications, each with a brief summary. Also indicated is the availability of the reports—some are generally available (i.e. to non‐NAFEMS members) whereas others are only available to NAFEMS members.

This paper seeks to review recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging.

Of the 91 journal papers, 59 were published in 2005‐2007 and topics related to wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging are reviewed.

Research on advanced wire bonding is continuously performed for advanced and complex applications such as stacked‐dies wire bonding, wire bonding of low‐k ultra‐fine‐pitch devices, and copper wire bonding. Owing to its many advantages, flip chip using adhesive has gained more popularity. Research on the reliability of lead‐free solder joints is being conducted world‐wide. The new challenges, solutions and new developments are discussed in this paper.

Because of page limitation of this review paper and the large number of the journal papers available, only a brief review is conducted. Further reading is needed for more details.

This review paper attempts to provide introduction to recent developments and the trends in terms of the topics for advanced microelectronics packaging. With the references provided, readers may explore more deeply, focusing on a particular issue.

This paper develops C++ and Fortran-90 solvers to establish parallel solution procedures in a finite element or meshless analysis program using shared memory computers. The paper aims to discuss these issues.

The stiffness matrix can be symmetrical or unsymmetrical, and the solution schemes include sky-line Cholesky and parallel preconditioned conjugate gradient-like methods.

By using the features of C++ or Fortran-90, the stiffness matrix and its auxiliary arrays can be encapsulated into a class or module as private arrays. This class or module will handle how to allocate, renumber, assemble, parallelize and solve these complicated arrays automatically.

The source codes can be obtained online at http//myweb.ncku.edu.tw/∼juju. The major advantage of the scheme is that it is simple and systematic, so an efficient parallel finite element or meshless program can be established easily.

With the minimum requirement of computer memory, an object-oriented C++ class and a Fortran-90 module were established to allocate, renumber, assemble, parallel, and solve the global stiffness matrix, so that the programmer does not need to handle them directly.

This study aims to develop an efficient algorithm for generation of conforming mesh for seepage analysis through 3D discrete fracture networks (DFN).

The algorithm is developed based on a refined conforming Delaunay triangulation scheme, which is then validated using analytical solutions. The algorithm is well able to meet the challenge of meshing complex geometry of DFNs.

A series of sensitivity analysis have been performed to evaluate the effect of meshing parameters on steady state solution of Darcy flow using a finite element scheme. The results show that an optimized minimum internal angle of meshing elements should be predetermined to guarantee termination of the algorithm.

The developed algorithm is computationally efficient, fast and is of low cost. Furthermore, it never changes the geometrical structure and connectivity pattern of the DFN.