Ceramic materials and glasses have become important in modern industry as well as in the consumer environment. Heat resistant ceramics are used in the metal forming processes or as welding and brazing fixtures, etc. Ceramic materials are frequently used in industries where a wear and chemical resistance are required criteria (seals, liners, grinding wheels, machining tools, etc.). Electrical, magnetic and optical properties of ceramic materials are important in electrical and electronic industries where these materials are used as sensors and actuators, integrated circuits, piezoelectric transducers, ultrasonic devices, microwave devices, magnetic tapes, and in other applications. A significant amount of literature is available on the finite element modelling (FEM) of ceramics and glass. This paper gives a listing of these published papers and is a continuation of the author's bibliography entitled “Finite element modelling of ceramics and glass” and published in Engineering Computations, Vol. 16, 1999, pp. 510‐71 for the period 1977‐1998.
The form of the paper is a bibliography. Listed references have been retrieved from the author's database, MAKEBASE. Also Compendex has been checked. The period is 1998‐2004.
Provides a listing of 1,432 references. The following topics are included: ceramics – material and mechanical properties in general, ceramic coatings and joining problems, ceramic composites, piezoceramics, ceramic tools and machining, material processing simulations, fracture mechanics and damage, applications of ceramic/composites in engineering; glass – material and mechanical properties in general, glass fiber composites, material processing simulations, fracture mechanics and damage, and applications of glasses in engineering.
This paper makes it easy for professionals working with the numerical methods with applications to ceramics and glasses to be up‐to‐date in an effective way.
Mackerle, J. (2005), "Finite element modelling of ceramics and glass, an addendum – a bibliography (1998‐2004)", Engineering Computations, Vol. 22 No. 3, pp. 297-373. https://doi.org/10.1108/02644400510588102
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