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The reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to investigate the growth behavior of the interfacial IMC layer during isothermal aging at 125°C for Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) solder joints with different In contents and commercial Sn-3Ag-0.5Cu/Cu solder joints.

In this paper, Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) and commercial Sn-3Ag-0.5Cu/Cu solder were prepared for bonding Cu substrate. Then these samples were subjected to isothermal aging for 0, 2, 8, 14, 25 and 45 days. Scanning electron microscopy and transmission electron microscopy were used to analyze the soldering interface reaction and the difference in IMC growth behavior during the isothermal aging process.

When the concentration of In in the Sn-3Ag-3Sb-xIn/Cu solder joints exceeded 2 Wt.%, a substantial amount of InSb particles were produced. These particles acted as a diffusion barrier, impeding the growth of the IMC layer at the interface. The growth of the Cu₃Sn layer during the aging process was strongly correlated with the presence of In. The growth rate of the Cu₃Sn layer was significantly reduced when the In concentration exceeded 3 Wt.%.

The addition of In promotes the formation of InSb particles in Sn-3Ag-3Sb-xIn/Cu solder joints. These particles limit the growth of the total IMC layer, while a higher In content also slows the growth of the Cu₃Sn layer. This study is significant for designing alloy compositions for new high-reliability solders.

Aligning corporate communications through different information sources is a great challenge for marketers, especially those operating in the tourism sector, which has been harshly affected by the recent COVID-19 pandemic. This paper provides a deep analysis of the implementation of seven basic principles of the integrated marketing communications (IMC) paradigm in a crisis situation.

In-depth interviews with tourism and hospitality service providers were conducted in the fourth quarter of 2021 in Croatia, a destination that showed remarkable results in terms of the number of international tourist arrivals during the pandemic.

Most firms successfully transitioned from tactical to strategic IMC implementation. Some problems were reported in the coordination of communication tools and channels. Whereas the use of digital technology was enhanced, database management did not receive sufficient attention. Message clarity represented the greatest challenge, while consumer-centric communication was the most neglected principle. Relationship building was pursued mainly through B2B rather than B2C communication, whereas brand equity development pursued through communication mix mostly focused on increases in awareness, perceived quality and attitudinal loyalty.

This research is qualitative in nature and provides opinions on IMC adoption from the managerial perspective only.

This paper provides guidelines for the successful integration of marketing communications (marcom) in an extremely ambiguous and uncertain environment.

The contribution of this work lies in the proposal of a new refined and expanded theoretical framework of IMC principles and numerous marcom strategies for operating during the COVID-19 pandemic, thus providing relevant implications for academia and industry.

Integrated marketing communications (IMC) is possibly “the richest and most accessible service-learning experience” in the marketing curriculum (Petkus, 2000, p. 68). Yet, despite this recognition, scholars and practitioners continue to lament the pronounced theory-practice gap between how IMC is taught and the practice of it in industry (Schultz and Patti, 2009; Kerr and Kelly, 2017). This research embeds IMC practice within a classroom setting and subsequently explores student marketers' perceptions of their skill development through experiential client-based learning.

An in-depth qualitative study demonstrates the value of integrating experiential learning within an IMC course, captured through students' reflective practice.

Evidence suggests that experiential, client-based projects are suitable for fostering key practice-based skills in the classroom through students “experiencing” IMC at work. However, this is not always easy. In fact, building key skills such as leadership, motivation, communications, organisation and teamwork presents various challenges for students, whilst students appear unaware of other pertinent skills (e.g. persuasion, critical thinking) gained through exposure to “real-world” IMC tasks.

Instructors adopting experiential learning in the marketing classroom have an opportunity to actively design tasks to embed key workplace skills to bridge the theory-practice gap. Client-based projects offer fertile ground for students to experience marketing in action whilst ultimately bolstering their confidence in their workplace skills.

This research contributes to the marketing education literature and acknowledges the importance of embedding key workplace skills into the contemporary marketing curriculum. An overview of challenges and solutions for instructors seeking to adopt experiential learning via client-based projects in the IMC classroom is presented within this research.

The purpose of this study was to examine the influence of adding a small amount of Ti to a Cu-based alloy, specifically the commercial Hyper Titanium Copper alloy (C1990 HP), which contains Cu-3.28 wt.% Ti, on its interfacial reaction with Sn-9.0 wt.% Zn (SnZn) solder, using the liquid/solid reaction couple technique.

The SnZn/C1990 HP couples were subjected to a reaction temperature of 240–270°C for a duration of 0.5–5 h. The resulting reaction couple was characterized using a scanning electron microscope, energy dispersive spectrometer, electron probe microanalyzer and X-ray diffractometer.

It was observed that the scallop-shaped CuZn5 and planar Cu5Zn8 phases were formed in almost all SnZn/C1990 HP couples. With increased reaction duration and temperature, the Cu-rich intermetallic compound (IMC)-Cu5Zn8 phase became a dominant IMC formed at the interface. The total thickness of the IMCs was increased with the increase in the reaction duration and temperature. The IMC growth obeyed the parabolic law, and the IMC growth mechanism was diffusion controlled. The activation energy of the SnZn/C1990 HP couple was 64.71 kJ/mol.

This article presents an analysis of the IMC thickness in each sample using ImageJ software, followed by kinetic analysis using Origin software at various reaction temperatures of SnZn/C1990 HP in liquid/solid couples. The study also includes detailed reports on the morphology, interface composition and X-ray diffraction analysis, as well as the activation energy. The findings can serve as a valuable reference for electronic packaging companies that utilize C1990 HP substrates.

Solder bumps for chip interconnections are downsizing from current approximately 100 µm to the expected 1 µm in future. As a result, the Cu-Ni cross-interaction in Cu/Solder/Ni solder joints will be more complicated and then strongly influence the growth of the intermetallic compounds (IMCs). Thus, it is critical to understand the fundamental aspects of interfacial reaction in micro solder joints. This paper aims to reveal the effect mechanism of reflow temperature and solder size on the interfacial reaction in Cu/Solder/Ni solder joints.

The Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints with 50 and 100 µm solder sizes at 250°C and 300°C were observed, respectively. The line-type interconnects were soaked in silicone oil, and the temperature of the line-type interconnects was 250 ± 3°C and 300 ± 3°C, which were monitored by a fine K-type thermocouple, and followed by an isothermal aging process at various times. After aging, the specimens were removed from the silicone oil and cooled in the air to room temperature.

The major interfacial reaction product on both interfaces was (Cu,Ni)₆Sn₅, and the asymmetric growth of (Cu,Ni)₆Sn₅, evidenced by the thickness of (Cu,Ni)₆Sn₅ IMCs at the Sn/Ni interface was always larger than that at the Sn/Cu interface, resulted from the directional migration of Cu atoms toward the Sn/Ni interface under Cu concentration gradient. The morphology of (Cu,Ni)₆Sn₅ IMC at Sn/Cu interface was columnlike at 250°C, and which changed from columnlike to scallop with large aspect ratio at 300°C, while that at Sn/Ni interface gradually evolved from needlelike to the mixture of needlelike and layered at 250°C, and which evolved from needlelike to scallop with large aspect ratio at 300°C. The evolution of morphology of (Cu,Ni)₆Sn₅ is attributed to the content of Ni. Furthermore, the results indicate that the Cu-Ni cross-interaction was stronger with small solder size and relatively low temperature in the Cu/Sn/Ni micro solder joints.

The asymmetric growth of (Cu,Ni)₆Sn₅ in the Cu/Sn/Ni micro solder joints, evidenced by the thickness of (Cu,Ni)₆Sn₅ IMCs at the Sn/Ni interface, was always larger than that at the Sn/Cu interface. The morphology evolution of (Cu,Ni)₆Sn₅ IMC at both interfaces was attributed to the content of Ni. The Cu-Ni cross-interaction was stronger with small solder size and relatively low temperature in the Cu/Sn/Ni micro solder joints.

In this paper, the authors aim to introduce international dynamic marketing capabilities (IDMCs) theoretically derived from marketing capabilities (MCs), dynamic marketing capabilities (DMCs) and international marketing capabilities (IMCs) and provide a novel conceptualization of the concept by applying a holistic view of the international enterprise.

This is a literature review that maps the current research on MCs, DMCs and IMCs and serves as a basis for the theoretical conceptualization of a novel IDMCs concept as well as for the identification of research gaps and the development of future research directions on this phenomenon.

Existing typologies of MCs, DMCs and IMCs are classified into four categories: strategic, operational, analytical and value creation capabilities. A new typology of IDMCs is proposed, consisting of digital MC and dynamic internationalization capability as strategic capabilities, agile IMC, IM excellence and absorptive capability in IM as operational capabilities, IM resilience capability, IM knowledge management capability, AI-enabled IDMC and Industry 4.0-enabled IDMC as analytical capabilities, and ambidextrous IM innovation capability as value creation capability. Finally, the authors identify research gaps and develop research questions that open future research avenues for the coming years.

This paper offers a novel view of MCs, DMCs and IMCs and argues that, in contrast to the majority of previous research, a comprehensive understanding of these is only possible if all levels are considered simultaneously: the strategic, the operational, the analytical and the value creation level. A new conceptualization and typology of IDMCs follows this logic.

The purpose of this study is to delve into the mechanism of Si3N4 nanowires (NWs) in Sn-based solder, thereby furnishing a theoretical foundation for the expeditious design and practical implementation of innovative lead-free solder materials in the electronic packaging industry.

This study investigates the effect of adding Si₃N₄ NWs to Sn58Bi solder in various mass fractions (0, 0.1, 0.2, 0.4, 0.6 and 0.8 Wt.%) for modifying the solder and joining the Cu substrate. Meanwhile, the melting characteristics and wettability of solder, as well as the microstructure, interfacial intermetallic compound (IMC) and mechanical properties of joint were evaluated.

The crystal plane spacing and lattice constant of Sn and Bi phase increase slightly. A minor variation in the Sn58Bi solder melting point was caused, while it does not impact its functionality. An appropriate Si₃N₄ NWs content (0.2∼0.4 Wt.%) significantly improves its wettability, and modifies the microstructure and interfacial IMC layer. The shear strength increases by up to 10.74% when adding 0.4 Wt.% Si₃N₄ NWs, and the failure mode observed is brittle fracture mainly. However, excessive Si₃N₄ will cause aggregation at the junction between the solder matrix and IMC layer, this will be detrimental to the joint.

The Si₃N₄ NWs were first used for the modification of lead-free solder materials. The relative properties of composite solder and joints were evaluated from different aspects, and the optimal ratio was obtained.

This paper aims to review in-memory computing (IMC) for machine learning (ML) applications from history, architectures and options aspects. In this review, the authors investigate different architectural aspects and collect and provide our comparative evaluations.

Collecting over 40 IMC papers related to hardware design and optimization techniques of recent years, then classify them into three optimization option categories: optimization through graphic processing unit (GPU), optimization through reduced precision and optimization through hardware accelerator. Then, the authors brief those techniques in aspects such as what kind of data set it applied, how it is designed and what is the contribution of this design.

ML algorithms are potent tools accommodated on IMC architecture. Although general-purpose hardware (central processing units and GPUs) can supply explicit solutions, their energy efficiencies have limitations because of their excessive flexibility support. On the other hand, hardware accelerators (field programmable gate arrays and application-specific integrated circuits) win on the energy efficiency aspect, but individual accelerator often adapts exclusively to ax single ML approach (family). From a long hardware evolution perspective, hardware/software collaboration heterogeneity design from hybrid platforms is an option for the researcher.

IMC’s optimization enables high-speed processing, increases performance and analyzes massive volumes of data in real-time. This work reviews IMC and its evolution. Then, the authors categorize three optimization paths for the IMC architecture to improve performance metrics.

The purpose of this study is the formation and growth of nanoscale intermetallic compounds (IMCs) when laser is used as a heat source to form solder joints.

This study investigates the Sn/Cu and Sn-0.1AlN/Cu structure using laser soldering under different laser power: (200, 225 and 250 W) and heating time: (2, 3 and 4 s).

The results show clearly that the formation of nano-Cu₆Sn₅ films is feasible in the laser heating (200 W and 2 s) with Sn/Cu and Sn-0.1AlN/Cu system. The nano-Cu₆Sn₅ films with thickness of 500 nm and grains with 700 nm are generally parallel to the Cu surface with Sn-0.1AlN. Both IMC films thickness of Sn/Cu and Sn-0.1AlN/Cu solder joints gradually increased from 524.2 to 2025.8 nm as the laser heating time and the laser power extended. Nevertheless, doping AlN nanoparticles can slow down the growth rate of Cu₆Sn₅ films in Sn solder joints due to its adsorption.

The formation of nano-Cu₆Sn₅ films using laser heating can provide a new method for nanofilm development to realize the metallurgical interconnection in electronic packaging.

Laser soldering has attracted attention as an alternative soldering process for microsoldering due to its localized and noncontact heating, a rapid rise and fall in temperature, fluxless and easy automation compared to reflow soldering.

In this study, the metallurgical and mechanical properties of the Sn3.0Ag0.5Cu/Ni-P joints after laser and reflow soldering and isothermal aging were compared and analyzed.

In the as-soldered Sn3.0Ag0.5Cu/Ni-P joints, a small granular and loose (Cu,Ni)6Sn5 intermetallic compound (IMC) structure was formed by laser soldering regardless of the laser energy, and a long and needlelike (Cu,Ni)6Sn5 IMC structure was generated by reflow soldering. During aging at 150°C, the growth rate of the IMC layer was faster by laser soldering than by reflow soldering. The shear strength of as-soldered joints for reflow soldering was similar to that of laser soldering with 7.5 mJ, which sharply decreased from 0 to 100 h for both cases and then was maintained at a similar level with increasing aging time.

Laser soldering with certain energy is effective for reducing the thickness of IMCs, and ensuring the mechanical property of the joints was similar to reflow soldering.