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This paper aims to characterize the surface film formed on Alloys 800 and 690 in chloride and thiosulfate-containing solution at 300°C.

Alloy 800 and 690 were immersed in chloride and thiosulfate-containing solution at 300°C up to five days, and then the surface film was analyzed by scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), transmission electron microscopy (TEM) and energy dispersive X-ray spectrometers (EDX).

Through static immersion experiments in a high-temperature and high-pressure water environment, the alloy samples covered by surface film after five days of immersion were obtained. The morphology of the surface film was characterized at both horizontal and cross-sectional scales using SEM and focused ion beam-TEM techniques. It was observed that due to the influence of the quartz lining, the surface film primarily exhibited a bilayered structure. The first layer contained a significant amount of SiO₂, with a higher content of metal hydroxides compared to metal oxides. The second layer was predominantly composed of Fe, Ni and Cr, with a higher content of metal oxides compared to metal hydroxides.

The results showed that the materials of the lining of the autoclave could significantly influence the film composition of the tested material, which should be paid attention when analyzing the corrosion mechanism at high temperature.

The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology.

The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test.

To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated.

The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

The purpose of this paper is to present an optimisation of four-point star-shaped structures produced through additive manufacturing (AM) polylactic acid (PLA). The study also aims to investigate the compression failure mechanism of the structure.

A Taguchi L₉ orthogonal array design of the experiment is adopted in which the input parameters are resolution (0.06, 0.15 and 0.30 mm), print speed (60, 70 and 80 mm/s) and bed temperature (55°C, 60°C, 65°C). The response parameters considered were printing time, material usage, compression yield strength, compression modulus and dimensional stability. Empirical observations during compression tests were used to evaluate the load–response mechanism of the structures.

The printing resolution is the most significant input parameter. Material length is not influenced by the printing speed and bed temperature. The compression stress–strain curve exhibits elastic, plateau and densification regions. All the samples exhibit negative Poisson’s ratio values within the elastic and plateau regions. At the beginning of densification, the Poisson’s ratios change to positive values. The metamaterial printed at a resolution of 0.3 mm, 80 mm/s and 60°C exhibits the best mechanical properties (yield strength and modulus of 2.02 and 58.87 MPa, respectively). The failure of the structure occurs through bending and torsion of the unit cells.

The optimisation study is significant for decision-making during the 3D printing and the empirical failure model shall complement the existing techniques for the mechanical analysis of the metamaterials.

To the best of the authors’ knowledge, for the first time, a new empirical model, based on the uniaxial load response and “static truss concept”, for failure mechanisms of the unit cell is presented.

This research aims to examine the impact of friction stir processing (FSP) treatment on an aluminum alloy, especially the AD31T alloy derived from the Al-Fe-Mg-Si system. The aim is to assess the influence of different processing techniques on the microstructure and physical and mechanical characteristics of the material, with a specific focus on structural and bulk imperfections inside the stir zone (SZ).

The study demonstrates that augmenting the linear velocity of the tool within the 25–100 mm/min range results in significant enhancements. The enhancements include a decrease in the heat-affected zone (HAZ), a reduction in the extent of volume defects inside the SZ and a more uniform deformation. The microstructural analysis results are corroborated by data acquired from microhardness and electrical conductivity studies, confirming the beneficial influence of modifying the tool’s linear velocity on the material parameters.

This study provides significant observations on the changes in microstructure and the generation of flaws throughout the process of FSP of AD31T alloy. These results have practical implications for improving the characteristics of the alloy and optimizing the production conditions.

All samples exhibit a distinct reduction in electrical conductivity within the initial third of the sample, aligning with the transitional region between the base metal (BM) and the HAZ. This underscores the importance of understanding the transitional zones during FSP.

The purpose of this paper is to assess the hydrogen embrittlement sensitivity of carbon gradient heterostructure materials and to verify the reliability of the scratch method.

The surface-modified layer of 18CrNiMo7-6 alloy steel was delaminated to study its hydrogen embrittlement characteristics via hydrogen permeation, electrochemical hydrogen charging and scratch experiments.

The results showed that the diffusion coefficients of hydrogen in the surface and matrix layers are 3.28 × 10⁻⁷ and 16.67 × 10⁻⁷ cm²/s, respectively. The diffusible-hydrogen concentration of the material increases with increasing hydrogen-charging current density. For a given hydrogen-charging current density, the diffusible-hydrogen concentration gradually decreases with increasing depth in the surface-modified layer. Fracture toughness decreases with increasing diffusible-hydrogen concentration, so the susceptibility to hydrogen embrittlement decreases with increasing depth in the surface-modified layer.

The reliability of the scratch method in evaluating the fracture toughness of the surface-modified layer material is verified. An empirical formula is given for fracture toughness as a function of diffused-hydrogen concentration.

This study aims to investigate the effect of speckle pattern on displacement measurements using different speckle diameters and coverage ratios.

In order to compare the coverage ratio and speckle diameter during the evaluation of the correlation of digital images (DIC) study, template speckle plates were produced on a computer numerical control (CNC) punch press with 600 punches per minute. After the speckle plates were manufactured, the speckled pattern was randomly painted on a plain white side through the manufactured template plates, and then tensile tests were performed under the same loading conditions for each sample to observe displacement variation via correlation parameters.

During the manufacturing of templates with thin plates, a punch diameter of less than 1.7 mm will cause tool failure; therefore, uniform speckle size can be assessed before operation. A higher coverage ratio resulted in more accurate and reliable results in displacement data. With smaller coverage, the facet size should be increased to achieve favorable results.

If thick template plates are selected, speckle painting cannot be done properly; therefore, template thickness shall also be assessed before operation.

For randomly distributed DIC templates, increasing coverage beyond 50% does not make sense due to difficulties in the production process in the punch press.

Evaluating DIC results via templates manufactured in a punch press with different speckle diameters and coverage ratios is a new topic in literature.

The metallic alloys and their components fabricated via laser powder bed fusion (LPBF) suffer from the microvoids formed inevitably due to the extreme solidification rate during fabrication, which are impossible to be removed by heat treatment. This paper aims to remove those microvoids in as-built AlSi10Mg alloys by hot forging and enhance their mechanical properties.

AlSi10Mg samples were built using prealloyed powder with a set of optimized LPBF parameters, viz. 350 W of laser power, 1,170 mm/s of scan speed, 50 µm of layer thickness and 0.24 mm of hatch spacing. As-built samples were preheated to 430°C followed by immediate pressing with two different thickness reductions of 10% and 35%. The effect of hot forging on the microstructure was analyzed by means of X-ray diffraction, scanning electron microscopy, electron backscattered diffraction and transmission electron microscopy. Tensile tests were performed to reveal the effect of hot forging on the mechanical properties.

By using hot forging, the large number of microvoids in both as-built and post heat-treated samples were mostly healed. Moreover, the Si particles were finer in forged condition (∼150 nm) compared with those in heat-treated condition (∼300 nm). Tensile tests showed that compared with heat treatment, the hot forging process could noticeably increase tensile strength at no expense of ductility. Consequently, the toughness (integration of tensile stress and strain) of forged alloy increased by ∼86% and ∼24% compared with as-built and heat-treated alloys, respectively.

Hot forging can effectively remove the inevitable microvoids in metals fabricated via LPBF, which is beneficial to the mechanical properties. These findings are inspiring for the evolution of the LPBF technique to eliminate the microvoids and boost the mechanical properties of metals fabricated via LPBF.

This paper aims to assess the efficiency of emulsified essential oils in glycerol as eco-friendly antimicrobial and plasticized agents added to the biopolymer of gelatin for lining historical oil paintings on canvases.

Cedar oil, cinnamon oil and their mixtures were emulsified in glycerol and incorporated into gelatin adhesive as green biocides and plasticizers. Physical, biological, chemical and mechanical tests were conducted on experimental mock-ups to assess the gelatin-based adhesive formulations for the reinforcement of canvas supports. Scanning electron microscope, colorimetric measurements, antimicrobial activity test, attenuated total reflection-Fourier transform infrared spectroscopy, tensile strength and elongation tests were carried out on the mock-ups before and after the artificial aging.

The formulations of gelatin-based adhesive with cinnamon and cinnamon-cedar mixture emulsified in glycerol proved their efficiency on the antimicrobial activity test, chemically delaying the decomposition of gelatin and accordingly providing compatible mechanical properties. Gelatin-based adhesive with emulsified cinnamon oil showed a slight yellowing that was quite improved with the mixture of the cinnamon-cedar-based adhesive formulation.

This study promotes a green approach to lining historical oil paintings by developing green formulations from bio-based origins that minimize the shrinkage and microbial infection of gelatin for lining paintings.

The reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to investigate the growth behavior of the interfacial IMC layer during isothermal aging at 125°C for Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) solder joints with different In contents and commercial Sn-3Ag-0.5Cu/Cu solder joints.

In this paper, Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) and commercial Sn-3Ag-0.5Cu/Cu solder were prepared for bonding Cu substrate. Then these samples were subjected to isothermal aging for 0, 2, 8, 14, 25 and 45 days. Scanning electron microscopy and transmission electron microscopy were used to analyze the soldering interface reaction and the difference in IMC growth behavior during the isothermal aging process.

When the concentration of In in the Sn-3Ag-3Sb-xIn/Cu solder joints exceeded 2 Wt.%, a substantial amount of InSb particles were produced. These particles acted as a diffusion barrier, impeding the growth of the IMC layer at the interface. The growth of the Cu₃Sn layer during the aging process was strongly correlated with the presence of In. The growth rate of the Cu₃Sn layer was significantly reduced when the In concentration exceeded 3 Wt.%.

The addition of In promotes the formation of InSb particles in Sn-3Ag-3Sb-xIn/Cu solder joints. These particles limit the growth of the total IMC layer, while a higher In content also slows the growth of the Cu₃Sn layer. This study is significant for designing alloy compositions for new high-reliability solders.

The paper aims to study the effect of sintering temperature on the microstructure, shear strength and ratcheting fatigue life of nanosilver sintered lap shear joint. In addition, the Gerber model is used to predict the ratcheting fatigue lives of nanosilver sintered lap shear joints at different sintering temperatures.

In this paper, the nanosilver sintered lap shear joints were prepared at three sintering temperatures of 250 °C, 280 °C and 310 °C. The bonding quality was characterized by scanning electron microscopy, X-ray diffraction, transmission electron microscope and shear tests, and the long-term reliability was studied by conducting ratcheting fatigue tests. In addition, three modified models based on Basquin equation were used to predict the ratcheting fatigue life of nanosilver sintered lap shear joint and their accuracies were evaluated.

When the sintering temperature is 250°C, the nanosilver sintered lap shear joint shows the porosity of 22.9 ± 1.6 %, and the shear strength of 22.3 ± 2.4 MPa. Raising the sintering temperature enhances silver crystallite size, strengthens sintering necks, thus improves shear strength and ratcheting fatigue life in joints. In addition, the ratcheting fatigue lives of the joints sintered at different temperatures are effectively predicted by three equivalent force models, and the Gerber model shows the highest life prediction accuracy.

The sintered silver bondline is suffering a complex stress state. The study only takes the shear stress into consideration. The tensile stress and the combination of shear stress and tensile stress can to be considered in the future study.

The paper provides the experimental and theoretical support for robust bonding and long-term reliability of sintered silver structure.

The introduced model can predict the ratcheting fatigue lives of the joints sintered at different temperatures, which shows a potential in engineering applications.

The study revealed the relationship between the sintering temperature and the microstructure, the shear strength and the ratcheting fatigue life of the joint. In addition, the Gerber model can predict the ratcheting fatigue life accurately at different sintering temperatures.