Search results

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.

A low power flip-flop circuit is designed for energy-efficient devices. Digital sequential circuits are in huge demand because every processor has most of the parts of digital circuit. The sequential circuits consist of a basic data storing element, a latch is used to store single bit data. The flip-flop takes a sufficient portion of the total chip area and overall power consumption as well. This study aims to the low power energy-efficient applications like laptops, mobile phones and palmtops.

This paper proposes a new type of flip-flop that consists of the only 16 transistors with a single-phase clock. The flip-flop has two blocks, master and slave latch. In this design, the authors have focused on only master latch, which includes a level restoring circuit. It is used to help the master latch in data retention process. The latch circuit has two inverters in back-to-back arrangement. The proposed flip-flop is implemented on 65 nm complementary metal oxide semiconductor technology using Cadence Virtuoso environment and compared with other reported flip-flops.

The proposed flip-flop architecture outperformed the peak percentage, i.e. 79.25% as compared to transmission gate flip-flop and a minimum of 20.02% compared to 18 T true single phase clocking (TSPC) improvement in terms of power. It also improved C to Q delay and power delay product. In addition, by reducing the number of transistors the total area of the proposed flip-flop is reduced by a minimum of 13.76% with respect to 18TSPC and existing flip-flop. For reliability checking the Monte Carlo simulation is performed for thousand samples and it is compared with the recently reported 18TSPC flip-flop.

This work is tested by using a test circuit with a load capacitor of 0.2 fF. The proposed work uses a new topology to work as master-slave. Power consumption of this technique is very less and it is best suitable for low power applications. This circuit is working properly up to 2 GHz frequency.

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Specimens of the capacitor assembly were subjected to JEDEC level 1 preconditioning (85 °C/85%RH/168 h) with 5× reflow at 270°C peak temperature. Then, they were inspected using a 2 µm scanning electron microscope to investigate the evidence of defects. The reliability test was also numerically simulated and analyzed using the extended finite element method implemented in ABAQUS.

Excellent agreements were observed between the SEM inspections and the simulation results. The findings showed evidence of discontinuities along the Cu and the Cu-epoxy layers and interfacial delamination crack at the Cu/Cu-epoxy interface. The possible root causes are thermal mismatch between the Cu and Cu-epoxy layers, moisture contamination and weak Cu/Cu-epoxy interface. The maximum crack length observed in the experimentally reflowed capacitor was measured as 75 µm, a 2.59% difference compared to the numerical prediction of 77.2 µm.

This work's contribution is expected to reduce the additional manufacturing cost and lead time in investigating reliability issues in MLCCs.

Despite the significant number of works on the reliability assessment of surface mount capacitors, work on crack growth in soft-termination MLCC is limited. Also, the combined experimental and numerical investigation of reflow-induced reliability issues in soft-termination MLCC is limited. These cited gaps are the novelties of this study.

This paper aims to establish a service efficiency-oriented framework for training design and evaluation as a pivotal service procedure in the workplace to fill the gap between training and organizational performance in a service context.

A semi-structured interview was first employed to confirm the primary indicator for training programs and criteria design as the pivotal factor for operational efficiency. An observation experiment was subsequently conducted to reveal that the training program can be redesigned according to the concrete operation effects and influencing factors for operational efficiency in the workplace.

The proposed service efficiency-oriented training model is suggested to underline and guide the activities for training requirements, training methods, training criteria and training evaluation for the service sector. Training auditing, analyzing and redesigning based on service efficiency could help to integrate service efficiency so that service organizations can readjust their specific training needs and concise the training program in the human resource management practice.

This study only conducted an on-site observational experiment on one of the casinos in Macau. An observational method assessed the conceptual model in the context of table game operations. More quantitative approaches like AI-assisted systems may be employed in the future. The representativeness of the sample is somewhat limited. In addition, the service efficiency-oriented training concept model is an open system that any organization could extend by incorporating more elements in each part that can be developed to meet their human resource management needs. Finally, other service-oriented organizations like airlines and banks can learn from the theoretical model proposed in this article. It is suggested that non-profit organizations would be a better research area.

The finding can provide organizations and practitioners with insights and tools on how to provide and evaluate service efficiency and assess employee performance.

The proposed service efficiency-oriented training model provides a theoretical foundation for training and organizational performance for service organizations.

This study is the first to develop a service efficiency-oriented training framework with training needs, methods, criteria and evaluation. A service industry sample was used to verify the framework in the context of casino game pace and dealer training for table games. Suggestions for a combination of management are provided for casino operators to redesign and evaluate the dealer training program for service improvement.

The purpose of this paper is to explore teacher candidates’ response to young adult literature (prose and comics) featuring fat identified protagonists. The paper considers the textual and embodied resources readers use and reject when imagining and interpreting a character’s body. This paper explores how readers’ meaning making was influenced when reading prose versus comics. This paper adds to a corpus of scholarship about the relationships between young adult literature, comics, bodies and reader response theory.

At the time of the study, participants were enrolled in a teacher education program at a Midwestern University, meeting monthly for a voluntary book club dedicated to reading and discussing young adult literature. To examine readers’ responses to comics and prose featuring fat-identified protagonists, the author used descriptive qualitative methodologies to conduct a thematic analysis of meeting transcripts, written participant reflections and researcher memos. Analysis was grounded in theories of reader response, critical fat studies and multimodality.

Analyses indicated many readers reject textual clues indicating a character’s body size and weight were different from their own. Readers read their bodies into the stories, regarding them as self-help narratives instead of radical counternarratives. Some readers were not able to read against their assumptions of thinness (and whiteness) until prompted by the researcher and other participants.

Although many reader response scholars have demonstrated readers’ tendencies toward personal identification in the face of racial and class differences, there is less research regarding classroom practices around the entanglement of physical bodies, body image and texts. Analyzing reader’s responses to the constructions of fat bodies in prose versus comics may help English Language Arts (ELA) educators and students identify and deconstruct ideologies of thin-thinking and fatphobia. This study, which demonstrates thin readers’ tendencies to overidentify with protagonists, suggests ELA classrooms might encourage readers to engage in critical literacies that support them in reading both with and against their identities.

This paper aims to investigate technological innovations within the crypto space that have engendered novel financial crime risks and their potential utilization amidst geopolitical conflicts.

The theoretical paper uses an analysis of recent geopolitical events, with a key focus on using cryptocurrencies to undertake illicit activities.

The study found that cryptocurrencies and the innovations made within the crypto domain are used for both legitimate and illicit purposes, including money laundering, terrorism financing and sanction evasion.

This research contributes to understanding the critical role cryptocurrencies play amidst geopolitical conflicts and emphasizes the need for regulatory considerations to prevent their misuse. To the best of the authors’ knowledge, this paper is the first scholarly contribution that considers the evolving mechanisms afforded by cryptocurrencies amidst geopolitical conflicts in undertaking illicit activities.

Lean is a continuous improvement methodology that has succeeded in eliminating waste in a variety of industries. Yet, there is a need for more research on Lean implementation in several under-studied contexts, including crisis situations such as those created by the recent COVID-19 pandemic. This research investigates how Lean programs were impacted by COVID-19, while previous research has primarily explored how Lean was used to solve problems created by the pandemic.

A mixed-method research approach was used to analyze employee feedback on how COVID-19 impacted the Lean programs using data from various levels of four energy-based utilities in the United States. First, an online questionnaire collected qualitative and quantitative data from a broad sample of participants. Then, a follow-up semi-structured interview allowed the elaboration of perceptions related to the research question using a smaller sample of participants.

Out of the 194 responses from the four companies, only 41% of the respondents at least somewhat agreed that COVID-19 impacted the Lean program at their company; of the remaining 59%, 35% indicated they were neutral, while 24% disagreed. The themes from the qualitative portion indicated that, while employees believed their companies had successfully found a new way to do Lean within the constraints of not always being in person, the collaboration and engagement were more challenging to sustain, and COVID-19 also otherwise made it more difficult to implement Lean. Meanwhile, some believed there was no impact on the Lean program.

The COVID-19 and Lean peer-reviewed literature published from 2020 to September 2023 focused primarily on using Lean to address problems created by the COVID-19 pandemic vs studying the pandemic's impact on Lean programs. This research partially fills this literature gap in understanding the impact COVID-19 had on Lean initiatives.