Search results

The purpose of this study is to reveal the effect of nano-Al₂O₃ particle addition on the nucleation/growth kinetics, microhardness, wear resistance and corrosion resistance of Co–P–xAl₂O₃ nanocomposite plating.

The kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating prepared by electroplating were investigated by electrochemical measurements, scanning electron microscopy, X-ray diffraction, X-ray photoelectron spectroscopy, Vickers microhardness measurement, SRV5 friction and wear tester and atomic force microscopy.

A 12 g/L nano-Al₂O₃ addition in the plating solution can transform the nucleation/growth kinetics of the plating from the 3D progressive model to the 3D instantaneous model. The microhardness of the plating increased with the increase of nano-Al₂O₃ content in plating. The wear resistance of the plating did not adhere strictly to Archard’s law. An even and denser corrosion product film was generated due to the finer grains, with a high corrosion resistance.

The effect of different nano-Al₂O₃ addition on the nucleation/growth kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating was investigated, and an anticorrosion mechanism of Co–P–xAl₂O₃ nanocomposite plating was proposed.

The metallic alloys and their components fabricated via laser powder bed fusion (LPBF) suffer from the microvoids formed inevitably due to the extreme solidification rate during fabrication, which are impossible to be removed by heat treatment. This paper aims to remove those microvoids in as-built AlSi10Mg alloys by hot forging and enhance their mechanical properties.

AlSi10Mg samples were built using prealloyed powder with a set of optimized LPBF parameters, viz. 350 W of laser power, 1,170 mm/s of scan speed, 50 µm of layer thickness and 0.24 mm of hatch spacing. As-built samples were preheated to 430°C followed by immediate pressing with two different thickness reductions of 10% and 35%. The effect of hot forging on the microstructure was analyzed by means of X-ray diffraction, scanning electron microscopy, electron backscattered diffraction and transmission electron microscopy. Tensile tests were performed to reveal the effect of hot forging on the mechanical properties.

By using hot forging, the large number of microvoids in both as-built and post heat-treated samples were mostly healed. Moreover, the Si particles were finer in forged condition (∼150 nm) compared with those in heat-treated condition (∼300 nm). Tensile tests showed that compared with heat treatment, the hot forging process could noticeably increase tensile strength at no expense of ductility. Consequently, the toughness (integration of tensile stress and strain) of forged alloy increased by ∼86% and ∼24% compared with as-built and heat-treated alloys, respectively.

Hot forging can effectively remove the inevitable microvoids in metals fabricated via LPBF, which is beneficial to the mechanical properties. These findings are inspiring for the evolution of the LPBF technique to eliminate the microvoids and boost the mechanical properties of metals fabricated via LPBF.

The consolidation process and morphology evolution in ceramics-based additive manufacturing (AM) are still not well-understood. As a way to better understand the ceramic selective laser sintering (SLS), a dynamic three-dimensional computational model was developed to forecast thermal behavior of hydroxyapatite (HA) bioceramic.

AM has revolutionized automotive, biomedical and aerospace industries, among many others. AM provides design and geometric freedom, rapid product customization and manufacturing flexibility through its layer-by-layer technique. However, a very limited number of materials are printable because of rapid melting and solidification hysteresis. Melting-solidification dynamics in powder bed fusion are usually correlated with welding, often ignoring the intrinsic properties of the laser irradiation; unsurprisingly, the printable materials are mostly the well-known weldable materials.

The consolidation mechanism of HA was identified during its processing in a ceramic SLS device, then the effect of the laser energy density was studied to see how it affects the processing window. Premature sintering and sintering regimes were revealed and elaborated in detail. The full consolidation beyond sintering was also revealed along with its interaction to baseplate.

These findings provide important insight into the consolidation mechanism of HA ceramics, which will be the cornerstone for extending the range of materials in laser powder bed fusion of ceramics.

This paper aims to examine the static compression characteristics of cell topologies in body-centered cubic with vertical struts (BCCZ) and face-centered cubic with vertical struts (FCCZ) along with novel BCCZZ and FCCZZ lattice structures.

The newly developed structures were obtained by adding extra interior vertical struts into the BCCZ and FCCZ configurations. The samples, composed of the AlSi10Mg alloy, were fabricated using the selective laser melting (SLM) additive manufacturing technique. The specific compressive strength and failure behavior of the manufactured lattice structures were investigated, and comparative analysis among them was done.

The results revealed that the specific strength of BCCZZ and FCCZZ samples with 0.5 mm strut diameter exhibited approximately a 23% and 18% increase, respectively, compared with the BCCZ and FCCZ samples with identical strut diameters. Moreover, finite element analysis was carried out to simulate the compressive response of the lattice structures, which could be used to predict their strength and collapse mode. The findings showed that while the local buckling of lattice cells is the major failure mode, the samples subsequently collapsed along a diagonal shear band.

An original and systematic investigation was conducted to explore the compression properties of newly fabricated lattice structures using SLM. The results revealed that the novel FCCZZ and BCCZZ structures were found to possess significant potential for load-bearing applications.

This paper aims to concentrate on recent innovations in flexible wearable sensor technology tailored for monitoring vital signals within the contexts of wearable sensors and systems developed specifically for monitoring health and fitness metrics.

In recent decades, wearable sensors for monitoring vital signals in sports and health have advanced greatly. Vital signals include electrocardiogram, electroencephalogram, electromyography, inertial data, body motions, cardiac rate and bodily fluids like blood and sweating, making them a good choice for sensing devices.

This report reviewed reputable journal articles on wearable sensors for vital signal monitoring, focusing on multimode and integrated multi-dimensional capabilities like structure, accuracy and nature of the devices, which may offer a more versatile and comprehensive solution.

The paper provides essential information on the present obstacles and challenges in this domain and provide a glimpse into the future directions of wearable sensors for the detection of these crucial signals. Importantly, it is evident that the integration of modern fabricating techniques, stretchable electronic devices, the Internet of Things and the application of artificial intelligence algorithms has significantly improved the capacity to efficiently monitor and leverage these signals for human health monitoring, including disease prediction.

The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.

This examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.

The utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.