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In recent years, scholars, business practitioners and consultants frequently talk about building the networked enterprise. The purpose of this paper is to examine the connections between networked enterprises, organizational legitimacy and organizational performance.

A survey was developed that measured the following aspects of a networked enterprise: employees who network and communicate extensively via internal digital platforms across their organizations; leaders who actively use internal digital platforms to communicate with employees; leaders who actively communicate with stakeholders via external digital platforms; and an innovation culture. The survey measured the following forms of legitimacy judgments: moral; instrumental; and relational. Altogether, 501 executives and managers were surveyed (207 executives, 147 senior managers and 147 managers) in mid-to-large sized (over 500 employees) companies.

The analyses showed strong statistical significance for nearly all relationships. Internal communication on digital platforms, networked employee communication and an innovation culture all contributed to moral, instrumental and relational legitimacy. Leadership communication on external digital platforms (social media) was not a significant contributor to moral or relational legitimacy but was a significant contributor to instrumental legitimacy. Higher organization legitimacy was correlated with higher profit growth.

Leaders and communicators should prioritize a networked enterprise in several ways. They should actively communicate with employees on internal digital platforms. To be absent on internal digital platforms is a significant missed opportunity by leaders to build organizational legitimacy. Further, leaders and communicators should actively promote networked communication among employees as much as possible. Finally, leaders and communicators should communicate, model and reward an innovation culture.

There are no known scholarly studies that accomplish the following: empirically examine a model of networked enterprises comprised of vertical and horizontal communication and an innovation culture; and make connections between leadership communication on digital platforms in networked enterprises with legitimacy judgments. The large sample of contemporary executives and managers bolsters the strength of the findings.

The purpose of this paper is to establish an accurate model to quantify the effect of conductor roughness on insertion loss (IL) and provide improved measurements and suggestions for manufacturing good conductive copper lines of printed circuit board.

To practically investigates the modified model of conductor roughness, three different kinds of alternate oxidation treatments were used to provide transmission lines with different roughness. The IL results were measured by a vector net analyzer for comparisons with the modified model results.

An accurate model, with only a 1.8% deviation on average from the measured values, is established. Compared with other models, the modified model is more reliable in industrial manufacturing.

This paper introduces the influence of tiny roughness structures on IL. Besides, this paper discusses the effect of current distribution on IL.

Optimized plating conditions, included proper designs of insulating shield (IS), auxiliary cathode (AC) and different patterns, contribute to the uniformity enhancement of copper deposition.

Plating experiments were implemented in vertical continuous plating (VCP) line for manufacturing in different conditions. Multiphysics coupling simulation was brought to investigate and predict the plating uniformity improvement of copper pattern. In addition, the numerical model was based on VCP to approach the practical application.

With disproportionate current distribution, different plating pattern design formed diverse copper thickness distribution (CTD). IS and AC improved plating uniformity of copper pattern because of current redistribution. Moreover, optimized plating condition for effectively depositing more uniformed plating copper layer in varied pattern designs were derived by simulation and verified by plating experiment.

The comparison between experiment and simulation revealed that multiphysics coupling is an efficient, reliable and of course environment-friendly tool to perform research on the uniformity of pattern plating in manufacturing.

Mechanical issues related to the information and growth of small cracks are considered to play a major role in very high cycle fatigue (VHCF) for metallic materials. Further efforts on better understanding in early stage of a crack are beneficial to estimating and preventing catastrophic damage for a long period service.

Dependent on the ultrasonic loading system, a novel method of in situ photomicroscope is established to study the crack behaviors in VHCF regime.

This in situ photomicroscope method provides advantages in combination with fatigue damage monitoring at high magnification, a large number of cycles, and efficiency. Visional investigation with attached image proceeding code proves that the method has high resolution on both size and time, which permits reliable accuracy on small crack growth rate. It is observed that the crack propagation trends slower in the overall small crack stage down to the level of 10–11 m/cycle. Strain analysis relays on a real-time recording which is applied by using digital image correlation. Infrared camera recording indicates the method is also suitable for thermodynamic study while growth of damage.

Benefiting from this method, it is more convenient and efficient to study the short crack propagation in VHCF regime.

The uniformity of electrodeposition is the key to successful application of pattern plating because the quality of electrodeposited copper layer has a huge impact on the performance of printed circuit boards (PCBs). The multi-physics coupling technology was used to accurately analyze and forecast the characteristics of electrochemical system. Further, an optimized plating bath was used to achieve a uniform electrodeposition.

A multi-physics coupling numerical simulation based on the finite element method was used to optimize electrodeposition conditions in pattern plating process. The influences of geometric and electrochemical factors on uniformity of current distribution and electrodeposited layer thickness were discussed by multi-physics coupling.

The model results showed that the distance between cathode and anode and the insulating shield had a great impact on uniformity of electrodeposition. By numerical simulation, it had been proved that using an auxiliary cathode was an effective and simple way to improve uniformity of electrodeposition due to redistributing of the current. This helped to achieve more uniform surface of the copper patterns by preventing the edge effect and the roughness of the copper layer was reduced to 1 per cent in the secondary current distribution model.

The research is still in progress with the development of high-performance computers.

A multi-physics coupling platform is an excellent tool for quickly and cheaply studying the process behaviors under a variety of operating conditions.

The numerical simulation method has laid the foundation for the design and improvement of the plating bath.

By multi-physics coupling technology, we built a bridge between theoretical and experimental study for control of uniformity of pattern plating in PCB manufacturing. This method can help optimize the design of plating bath and uniformity of pattern plating in PCB manufacturing.

The purpose of this paper is to elucidate the influences of the animal fat and fatty acid type on the formation of polycyclic aromatic hydrocarbons (PAHs) and to propose a formation mechanism of PAHs in fat during electric roasting, which is a method of non-direct-contact-flame heating.

The effects of animal fats and model fat on the formation of PAHs were valued on the basis of the ultra high-performance liquid chromatography data. The corresponding products of the FAME pyrolysis were detected by TG-FTIR. The proposal formation mechanism of PAHs was based on the summary of the literature.

Contrary to the International Agency for Research on Cancer, DF had higher risk with 280.53 ng/g of concentration after being roasted than the others animal fats of red meat in terms of PAHs formation. This research also ensured the importance of fat on PAHs formation, the concentration of PAHs in pure fats was higher after being electric roasted than that in meat patties and juice which made from corresponding animal fat. What is more, during pure animal fats and meat products being processed, less PAHs formed in the fat with lower extent of unsaturation and lower content of linolenate. In the same way, methyl linolenate demonstrated the significant increasement to PAHs formation compared to the other fatty acids. And, the number of carbon atom and the extent of unsaturation in fatty acid affects the formation of PAHs during roasting. The detection of alkene and alkane allows to propose a formation mechanism of PAHs during model fat being heated. Further study is required to elucidate the confirm moleculars during the formation of PAHs.

This work studied the effect of the carbon atom number and the unsaturation extent of fats and model fats on the formation of PAHs. This work also assure the important of alkene and alkane on the pyrolysis of model fats. This study also researched the formation and distribution of PAHs in pure fats and meat products after being heated.

The purpose of this study is to investigate the synergism of convection, current density distribution and additives by numerical simulation and electrochemical experiments for good throwing power (TP) of copper electro-deposition in printed circuit board (PCB) manufacture.

The flow field of THs and current density distribution on various AR of THs are calculated and analyzed. Meanwhile, corresponding simulation is used to study the performance of plating electrolytes on TP. Two electrochemical parameters, overpotential (η) and potential difference (△η), are chosen to evaluate the electrochemical properties of different plating solutions by galvanostatic measurement and potentiodynamic cathode polarization at different rotating speeds.

By combining both the results of simulation and practical plating, these two electrochemical properties of electrolytes exhibit significant impact to the system at varied conditions. Especially, the electrolyte with higher polarizing η and △η values lead to the elevated TP for AR of more than 2:1.

The harring cell model is built as a bridge between the theoretical and experimental study for control of uniformity of plating THs in PCB manufacturing. This dual-parameter evaluation is validated to be a promising decisive method to guide the THs plating with particular AR in industry.

The purpose of this paper is to value put option contracts in hedging the risks in a supply chain consisting of a component supplier with random yield and a manufacturer facing stochastic demand for end products.

This paper adopts stochastic inventory theory, game theory, optimization theory and algorithm and MATLAB numerical simulation to investigate the manufacturer’s ordering and the supplier’s production strategies, and to study the coordination and optimization strategies in the context of random yield and demand.

The authors find that put options can not only facilitate the manufacturer’s order but also the supplier’s production, that is, the manufacturer and the supplier can effectively manage their involved risks and earn more expected profits by adopting put options. Further, the authors find that the single put option contract fails to coordinate such a supply chain. However, when combined with a protocol, it is able to coordinate the supply chain.

This paper is the first effort to study the intersection of put option contracts and random yield in the presence of a spot market. From a new perspective, the authors explore the supply chain coordination. The authors propose a mechanism to coordinate the supply chain under put option contracts.

This study aims to report the CO₂ corrosion performance of 3Cr steel and 3Cr2Al steel and reveal the role of aluminum in mitigating corrosion of low-Cr steel.

Aluminum was added to 3Cr steel to prepare a new type of 3Cr2Al steel, and the effect of aluminum on the corrosion resistance of pipeline steel was studied using morphology observation and composition analysis, weight loss tests and electrochemical test.

In the CO₂/O₂ coexistence environment, the average corrosion rate of the 3Cr2Al steel was obviously lower than that of the 3Cr steel. The addition of aluminum expanded the range of prepassivation, and the dynamic potential polarization curve of 3Cr2Al steel showed duplex prepassivation phenomena. 3Cr steel underwent severe local corrosion, and 3Cr2Al steel underwent uniform corrosion. The addition of aluminum contributed to the formation of a dense corrosion product layer and greatly reduced the localized corrosion sensitivity.

The studies on CO₂ corrosion of aluminum containing low-Cr steel are quite rare. This study clarifies the role of aluminum by comparing the corrosion behavior of 3Cr2Al and 3Cr steel. The effect of aluminum on the growth of corrosion product film was discussed, and the duplex prepassivation phenomena of Cr and Al were revealed.

This study investigates the impact of AI finance on financing constraints of non-SOE firms in an emerging market.

Using a sample of non-SOE listed companies in China from 2011 to 2018, this research employs the cash–cash flow sensitivity model to examine the effect of AI finance on financing constraints of non-SOE firms.

We find that the development of AI finance can alleviate the financing constraints of non-SOE firms. Further, we document that such effect is more pronounced for smaller firms, more innovative firms and firms in developing areas.

This study suggests that emerging market countries can ease the financing constraints of non-SOE firms by promoting AI finance development.

This study, to the best of our knowledge, is the first one to explore the relationship between AI finance development and financing constraints of non-SOE firms in emerging markets.