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Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation

Jing Xiang (School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, Chengdu, China)
Yuanming Chen (School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, Chengdu, China)
Shouxu Wang (School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, Chengdu, China)
Chong Wang (School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, Chengdu, China)
Wei He (School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, Chengdu, China)
Huaiwu Zhang (School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, Chengdu, China)
Xiaofeng Jin (National Center of Quality Supervision and Testing for Printed Circuit Board and National Center of Quality Supervision and Testing for Copper-Lead-Zinc Product, Tongling, China)
Qingguo Chen (National Center of Quality Supervision and Testing for Printed Circuit Board and National Center of Quality Supervision and Testing for Copper-Lead-Zinc Product, Tongling, China)
Xinhong Su (Research and Development Department, Zhuhai Founder Sci-Tech High-density Electronics Co., Ltd, Zhuhai, China)

Circuit World

ISSN: 0305-6120

Article publication date: 10 July 2018

Issue publication date: 16 July 2018

234

Abstract

Purpose

Optimized plating conditions, included proper designs of insulating shield (IS), auxiliary cathode (AC) and different patterns, contribute to the uniformity enhancement of copper deposition.

Design/methodology/approach

Plating experiments were implemented in vertical continuous plating (VCP) line for manufacturing in different conditions. Multiphysics coupling simulation was brought to investigate and predict the plating uniformity improvement of copper pattern. In addition, the numerical model was based on VCP to approach the practical application.

Findings

With disproportionate current distribution, different plating pattern design formed diverse copper thickness distribution (CTD). IS and AC improved plating uniformity of copper pattern because of current redistribution. Moreover, optimized plating condition for effectively depositing more uniformed plating copper layer in varied pattern designs were derived by simulation and verified by plating experiment.

Originality/value

The comparison between experiment and simulation revealed that multiphysics coupling is an efficient, reliable and of course environment-friendly tool to perform research on the uniformity of pattern plating in manufacturing.

Keywords

Acknowledgements

The authors gratefully acknowledge the support of the projects of National Natural Science Foundation of China (No.61474019 and No.61604034), and the authors also express their sincere thanks to project of science and technology planning of Guangdong Province China (No.2015B010127012).

Citation

Xiang, J., Chen, Y., Wang, S., Wang, C., He, W., Zhang, H., Jin, X., Chen, Q. and Su, X. (2018), "Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation", Circuit World, Vol. 44 No. 3, pp. 150-160. https://doi.org/10.1108/CW-12-2017-0078

Publisher

:

Emerald Publishing Limited

Copyright © 2018, Emerald Publishing Limited

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