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Numerical simulation and experiments to improve throwing power for practical PCB through-holes plating

Jing Xiang (School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, China and Chongqing Engineering Research Center of New Energy Storage Devices and Applications, Chongqing University of Arts and Sciences, Chongqing, China)
Chong Wang (School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, China)
Yuanming Chen (School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, China)
Feng Xia (National Center of Quality Supervision and Testing for Printed Circuit Board and National Center of Quality Supervision and Testing for Copper-Lead-Zinc Product, Tongling, China)
Wei He (School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, China)
Hua Miao (Shennan Circuit Co., Ltd, Shenzhen, China)
Jinqun Zhou (Shennan Circuit Co., Ltd, Shenzhen, China)
Qingguo Chen (National Center of Quality Supervision and Testing for Printed Circuit Board and National Center of Quality Supervision and Testing for Copper-Lead-Zinc Product, Tongling, China)
Xiaofeng Jin (National Center of Quality Supervision and Testing for Printed Circuit Board and National Center of Quality Supervision and Testing for Copper-Lead-Zinc Product, Tongling, China)

Circuit World

ISSN: 0305-6120

Article publication date: 16 October 2019

Issue publication date: 16 October 2019

279

Abstract

Purpose

The purpose of this study is to investigate the synergism of convection, current density distribution and additives by numerical simulation and electrochemical experiments for good throwing power (TP) of copper electro-deposition in printed circuit board (PCB) manufacture.

Design/methodology/approach

The flow field of THs and current density distribution on various AR of THs are calculated and analyzed. Meanwhile, corresponding simulation is used to study the performance of plating electrolytes on TP. Two electrochemical parameters, overpotential (η) and potential difference (△η), are chosen to evaluate the electrochemical properties of different plating solutions by galvanostatic measurement and potentiodynamic cathode polarization at different rotating speeds.

Findings

By combining both the results of simulation and practical plating, these two electrochemical properties of electrolytes exhibit significant impact to the system at varied conditions. Especially, the electrolyte with higher polarizing η and △η values lead to the elevated TP for AR of more than 2:1.

Originality/value

The harring cell model is built as a bridge between the theoretical and experimental study for control of uniformity of plating THs in PCB manufacturing. This dual-parameter evaluation is validated to be a promising decisive method to guide the THs plating with particular AR in industry.

Keywords

Acknowledgements

The authors gratefully acknowledge the support of National Natural Science Foundation of China (Nos. 61604034, 51801018 and 61974020), Chongqing University of Arts and Sciences (R2019FDQ12, R2019FDQ13) and Chongqing Board of Education (KJQN201901316).

Citation

Xiang, J., Wang, C., Chen, Y., Xia, F., He, W., Miao, H., Zhou, J., Chen, Q. and Jin, X. (2019), "Numerical simulation and experiments to improve throwing power for practical PCB through-holes plating", Circuit World, Vol. 45 No. 4, pp. 221-230. https://doi.org/10.1108/CW-05-2018-0033

Publisher

:

Emerald Publishing Limited

Copyright © 2019, Emerald Publishing Limited

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