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Multi-physics coupling aid uniformity improvement in pattern plating

Linxian Ji (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China and Department of Physics and Electronic Engineering, Yuncheng University, Yuncheng, China)
Chong Wang (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China and Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd., Shantou, China)
Shouxu Wang (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China)
Kai Zhu (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China)
Wei He (State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, China and Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd., Shantou, China)
Dingjun Xiao (Research and Development Department, Guangdong Guanghua Sci-Tech Co., Ltd., Shantou, China)

Circuit World

ISSN: 0305-6120

Article publication date: 3 May 2016

564

Abstract

Purpose

The uniformity of electrodeposition is the key to successful application of pattern plating because the quality of electrodeposited copper layer has a huge impact on the performance of printed circuit boards (PCBs). The multi-physics coupling technology was used to accurately analyze and forecast the characteristics of electrochemical system. Further, an optimized plating bath was used to achieve a uniform electrodeposition.

Design/methodology/approach

A multi-physics coupling numerical simulation based on the finite element method was used to optimize electrodeposition conditions in pattern plating process. The influences of geometric and electrochemical factors on uniformity of current distribution and electrodeposited layer thickness were discussed by multi-physics coupling.

Findings

The model results showed that the distance between cathode and anode and the insulating shield had a great impact on uniformity of electrodeposition. By numerical simulation, it had been proved that using an auxiliary cathode was an effective and simple way to improve uniformity of electrodeposition due to redistributing of the current. This helped to achieve more uniform surface of the copper patterns by preventing the edge effect and the roughness of the copper layer was reduced to 1 per cent in the secondary current distribution model.

Research limitations/implications

The research is still in progress with the development of high-performance computers.

Practical implications

A multi-physics coupling platform is an excellent tool for quickly and cheaply studying the process behaviors under a variety of operating conditions.

Social implications

The numerical simulation method has laid the foundation for the design and improvement of the plating bath.

Originality/value

By multi-physics coupling technology, we built a bridge between theoretical and experimental study for control of uniformity of pattern plating in PCB manufacturing. This method can help optimize the design of plating bath and uniformity of pattern plating in PCB manufacturing.

Keywords

Acknowledgements

The authors gratefully acknowledge the support of Guangdong Innovative Research Team Program (No. 201301C0105324342) and National Natural Science Foundation of China (No. 61474019).

Citation

Ji, L., Wang, C., Wang, S., Zhu, K., He, W. and Xiao, D. (2016), "Multi-physics coupling aid uniformity improvement in pattern plating", Circuit World, Vol. 42 No. 2, pp. 69-76. https://doi.org/10.1108/CW-05-2015-0023

Publisher

:

Emerald Group Publishing Limited

Copyright © 2016, Emerald Group Publishing Limited

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