Search results

This paper presents the results of mean unit weight of chips and their time to ignition measured on a test stand specially designed for this purpose. In addition, the temperature of chips in the cutting area and the morphology of chips produced in HSM milling (as a temperature indicator in the cutting area) are investigated. Also, different fractions of chips produced in the dry milling of Mg alloys AZ31 and AZ91HP by a PCD end mill are examined. Finally, the paper presents conclusions and recommendations with regard to safety and efficiency of dry milling processes for the aforementioned magnesium alloys.

Milling can be used as a finishing operation, particularly when using PCD end mills. The application of this mill type isparticularly important when producing different machine and device components, especially in the aircraft industry. What can occur in dry machining operations is self-ignition. It is therefore justified to investigate chip temperature in the cutting zone, to classify produced chip fractions and to determine their mass. Safe ranges of technological parameters can be additionally determined based on metallographic analysis of chip edge partial-melting.

The experimental results helped determine the effect of technological parameters of milling on chip temperature in the cutting zone, chip mass and fragmentation and chip morphology images.

The results reported in this work are innovative in both cognitive and practical aspect. The authors are convinced that this work can contribute to overcoming the mistrust of industrial practitioners toward dry milling of Mg alloys, and also with respect to the application of relatively higher cutting speeds in dry milling of these alloys than it is common practice in industry today. The study investigates the problem of safety in dry milling of Mg alloys. The study was motivated by the milling process itself and the formation of broken chip, which causes a significant change in the character of heat transfer.

The paper presents a method for multi-criteria safety assessment in dry milling operations. Safe and effective parameter ranges are defined with respect to chip temperature in the cutting zone, fraction number and chip mass.

Solderability testing, according to Military Standard 883, has evolved through four sets of different test conditions during the past ten years. These relate to the duration of artificial steam ageing and the utilisation of either mildly activated or pure rosin flux. The European Space Agency (ESA) has experienced few solderability problems with leadless ceramic chip carriers (LCCCs) supporting tin‐lead finished castellations. However, similar packages having gold on nickel plated finishes will only produce satisfactory solderability results when activated flux is applied to samples exposed to steam ageing for eight hours. A reason for poor solderability is given, based on an evaluation of test samples and metallography. It is concluded that tin‐lead finished devices should be subjected to eight hours of steam ageing followed by solderability testing with pure rosin flux. An ESA prerequisite for soldering is that all gold finishes must be removed, possibly with the aid of RA type fluxes. For this reason it is recommended that RA flux is permitted (when necessary) during the standard solderability test.

Nature and occurrence of food-borne pathogens in raw and processed food products evolved greatly in the past few years due to new modes of transmission and resistance build-up against sundry micro-/macro-environmental conditions. Assurance of food health and safety thus gained immense importance, for which bio-sensing technology proved very promising in the detection and quantification of food-borne pathogens. Considering the importance, different studies have been performed, and different biosensors have been developed. This study aims to summarize the different biosensors used for the deduction of food-borne pathogens.

The present review highlights different biosensors developed apropos to food matrices, factors governing their selection, their potential and applicability. The paper discusses some related key challenges and constraints and also focuses on the needs and future research prospects in this field.

The shift in consumers’ and industries’ perceptions directed the further approach to achieve portable, user and environmental friendly biosensing techniques. Despite of these developments, it was still observed that the comparison among the different biosensors and their categories proved tedious on a single platform; since the food matrices tested, pathogen detected or diagnosed, time of detection, etc., varied greatly and very few products have been commercially launched. Conclusively, a challenge lies in front of food scientists and researchers to maintain pace and develop techniques for efficiently catering to the needs of the food industry.

Biosensors deduction limit varied with the food matrix, type of organism, material of biosensors’ surface, etc. The food matrix itself consists of complex substances, and various types of food are available in nature. Considering the diversity of food there is a need to develop a universal biosensor that can be used for all the food matrices for a pathogen. Further research is needed to develop a pathogen-specific biosensor that can be used for all the food products that may have accuracy to eliminate the traditional method of deduction.

The present paper summarized and categorized the different types of biosensors developed for food-borne pathogens.

The subject of the meeting on 20 June was ‘Numerically Controlled Routing’. Dave Dosier, of Paul Dosier Associates, explained how important it is to maximise programming and routing equipment. Former dusty, noisy fabrication rooms are now humming with NC equipment.

The purpose of this paper is to produce and investigate the interfacial reaction between Sn‐3.0Ag‐0.5Cu (SAC305) thin films and Cu substrates by solder reflow at various temperatures and times.

SAC305 thin films were deposited on copper substrates using a thermal evaporation technique. The as‐deposited SAC305/Cu was then reflowed on a hot plate at temperatures of 230, 240, 250 and 260°C for 30 s. In addition, solder reflow was conducted at a constant temperature of 230°C for 5, 10, 15 and 20 s. The microstructure, phase and thickness of the intermetallic compounds (IMCs) formed were determined after cross‐sectional metallographic preparation.

Cu₆Sn₅ and Cu₃Sn were observed at the as‐reflowed SAC305/Cu interfacial region. The IMC thicknesses increased with the higher reflow temperature and longer reflow times.

Up to now, studies on the thin film characteristics of SAC305 lead‐free solder have been very limited. Thus, this paper presents the deposition of SAC305 thin film by a thermal evaporation technique and its characteristics after solder reflow.

Metal laser-powder-bed-fusion using laser-beam parts are particularly susceptible to contamination due to particles attached to the surface. This may compromise so-called technical cleanliness (e.g. in NASA RPTSTD-8070, ASTM G93, ISO 14952 or ISO 16232), which is important for many 3D-printed components, such as implants or liquid rocket engines. The purpose of the presented comparative study is to show how cleanliness is improved by design and different surface treatment methods.

Convex and concave test parts were designed, built and surface-treated by combinations of media blasting, electroless nickel plating and electrochemical polishing. After cleaning and analysing the technical cleanliness according to ASTM and ISO standards, effects on particle contamination, appearance, mass and dimensional accuracy are presented.

Contamination reduction factors are introduced for different particle sizes and surface treatment methods. Surface treatments were more effective for concave design features, however, the initial and resulting absolute particle contamination was higher. Results further indicate that there are trade-offs between cleanliness and other objectives in design. Design guidelines are introduced to solve conflicts in design when requirements for cleanliness exist.

This paper recommends designing parts and corresponding process chains for manufacturing simultaneously. Incorporating post-processing characteristics into the design phase is both feasible and essential. In the experimental study, electroless nickel plating in combination with prior glass bead blasting resulted in the lowest total remaining particle contamination. This process applied for cleanliness is a novelty, as well as a comparison between the different surface treatment methods.

Though Chile is cut off through geographical considerations from the mainstreams of knowledge in the corrosion protection field,there are several small centres of investigation, research and development that may be the nuclei for future growth. Engineers there have been forced to develop their own methods and have in many cases been remarkably successful. After a recent stay in Chile, which included a wide coverage of the industrial scene, Dr. Hoar presents a firmly outlined picture of the ‘corrosion situation’.

The purpose of this paper is to describe, review, classify and analyze the current challenges in three-dimensional printing processes for combined electrochemical and microfluidic fabrication areas, which include printing devices and sensors in specified areas.

A systematic review of the literature focusing on existing challenges is carried out. Focused toward sensors and devices in electrochemical and microfluidic areas, the challenges are oriented for a discussion exploring the suitability of printing varied geometries in an accurate manner. Classifications on challenges are based on four key categories such as process, material, size and application as the printer designs are mostly based on these parameters.

A key three-dimensional printing process methodologies have their unique advantages compared to conventional printing methods, still having the challenges to be addressed, in terms of parameters such as cost, performance, speed, quality, accuracy and resolution. Three-dimensional printing is yet to be applied for consumer usable products, which will boost the manufacturing sector. To be specific, the resolution of printing in desktop printers needs improvement. Printing scientific products are halted with prototyping stages. Challenges in three-dimensional printing sensors and devices have to be addressed by forming integrated processes.

The research is underway to define an integrated process-based on three-dimensional Printing. The detailed technical details are not shared for scientific output. The literature is focused to define the challenges.

The research can provide ideas to business on innovative designs. Research studies have scope for improvement ideas.

Review is focused on to have an integrated three-dimensional printer combining processes. This is a cost-oriented approach saving much of space reducing complexity.

To date, no other publication reviews the varied three-dimensional printing challenges by classifying according to process, material, size and application aspects. Study on resolution based data is performed and analyzed for improvements. Addressing the challenges will be the solution to identify an integrated process methodology with a cost-effective approach for printing macro/micro/nano objects and devices.

The filamentary growths of single crystals on material surfaces are termed whiskers. They are seen to nucleate and grow on certain electronic materials either from vapour and liquid phases or by a process induced by residual stresses in electroplated surfaces. Whisker growth does not depend on the existence of an electric field and surfaces prone to their growth may nucleate and form whiskers as a result of exposure to a space environment. This paper includes a detailed examination of tin whiskers which were found to have 1 to 4 micron diameters and lengths exceeding 2 mm. Some were found to carry currents between 22 and 32 mA before burning out. Conductive whiskers can cause extensive short circuit damage to spacecraft electronics particularly as miniature devices progressively employ closer spacings between conductors. Several modes of whisker growth on spacecraft electronic materials (molybdenum, tungsten, Kovar, tin) have been observed and are described. Tin, cadmium and zinc surfaces can support stress‐induced whisker growth and it is recommended that these metal finishes are excluded from spacecraft design and possibly replaced by a tin‐lead alloy.