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Research on technology acceptance of online entertainment with age, gender and cultural factors as moderator, is rarely conducted. Previous research predominantly focused on age or gender as moderator, neglecting the influence of cultural factors. Therefore, this study aims to investigate acceptance of online entertainment technology, incorporating age, gender and cultural factors as moderator.

Data were collected through a survey comprising 1,121 individuals aged 14–24 years from three cities in Indonesia. The proposed theoretical model examined the causal effect of acceptance and moderating effects due to individual gender, age, power distance, individualism, feminism and uncertainty avoidance (AU). Subsequently, structural equation modeling was used to evaluate the theoretical model, and the results confirmed several findings from previous research.

The findings confirmed the positive direct impact of habit and price value (PV) on behavioral intention and hedonic motivation, as well as social influence on habit. The recent findings derived from the moderating effect analysis showed that age, individualism and feminism played a moderating role in the effects on individual intention due to habit. Additionally, gender and AU moderated the effects on individual habits due to hedonic motivation.

This research contributes to the limited knowledge of technology acceptance of online entertainment, and also integrates the causal effects of individual intention due to habit, PV, hedonic motivation and social influence, considering the moderating role of culture, age and gender. Consequently, the investigation provides valuable insights into the literature by presenting evidence of age, gender and cultural differences in acceptance. Furthermore, it offers practical guidance to online entertainment application developers on designing applications to satisfy consumers of different ages, genders and cultures.

This paper seeks to decrease the soldering temperature of capacitors using Sn‐Bi plated Sn‐3.5 wt%Ag solder.

Sn‐Bi layers were electroplated on Sn‐3.5 wt%Ag solder. As soldering examples, type 1608 capacitors electroplated with Sn, and printed circuit boards (PCBs) with a surface coating of electroless‐plated Ni/Au, were selected. Sn‐3.5Ag foil coupons plated with Sn‐95.7 wt%Bi were inserted as solder between the capacitors and the lands on the PCBs. The samples were reflowed at 220°C, which is below the normal reflow temperatures of around 240 ∼ 250°C used with Pb‐free solders. During heating, Bi in the plated layer diffuses into the Sn‐3.5Ag core solder resulting in a transient decrease in soldering temperature based on the concept of transient liquid phase bonding.

The joints made with the Sn‐95.7%Bi plated Sn‐3.5Ag solder at 220°C showed good appearance, and evidence of significant Bi segregation was absent in the microstructure. The shear strengths of the capacitor joints bonded with Sn‐95.7%Bi plated Sn‐3.5%Ag solder were approximately 5,000‐6,000 gf. After 1,000 thermal cycles between −40 and +125°C, the shear strengths of the joints decreased approximately 5‐10 percent from the strengths in the as‐reflowed state for all plated solders. This confirmed that the soldered joints were stable and not significantly degraded by thermal cycles.

Reduced temperature soldering using Sn‐Bi plated Sn‐3.5%Ag solder was applied to attach capacitors to PCBs. In a production application, the foil coupons could be replaced by pre‐solder on the PCB pads.

The purpose of this paper is to investigate a Pb‐free solder alternative, specifically the effect of Bi on the microstructure and tensile strength of Sn‐3.7Ag solders casted under different cooling rates.

Sn‐3.7Ag solder paste was mechanically blended with different percentages of Bi particles (99.999 percent) to form composite solder pastes. The solder paste was cast under different cooling rates to form dog‐bone shape samples for tensile testing. The solder samples were subjected to tensile testing on an INSTRON 5543 tester with loading rate 10⁻³ s⁻¹. Both the as‐cast and tensile‐tested samples were mounted, ground and polished for microstructure and fracture surface analysis. Scanning electron microscopy/Energy dispersive X‐ray spectroscopy was used to characterize the microstructure, morphology, and composition.

The tensile strength of Sn‐3.7Ag solder increased with increased Bi addition. However, elongation decreased with increased Bi addition. The tensile strength of Sn‐3.7Ag‐xBi (x=0, 1, 2, 3, 4 wt%) solders increased with increased cooling rates when Bi is lower than 3 wt%. The reason for improved strength of Sn‐3.7Ag‐xBi solders is the result of the combination of the solid solution strengthening and precipitation strengthening effects of Bi.

Tensile testing Bi reinforced Sn‐3.7Ag solder formed under different cooling rates is new in the paper. With the additions of Bi to Sn‐3.7Ag, the solder strength has been increased, which may be beneficial to the electronics industry and other researchers seeking a better replacement for Sn−Pb solder.

The purpose of this paper is to study Bi‐11Ag solder for higher application temperatures. The aim of the research work was to determine the soldering, thermal and mechanical properties of Bi‐11Ag solder.

To determine the melting point interval of experimental Bi‐11Ag solder, DSC analysis was performed. The contact angles were studied on a copper, nickel and silver substrate by use of a sessile drop method. Wettability tests were realised at a temperature of 380°C in a shielding atmosphere (90% N₂+10% H₂). Based on experience achieved with wetting angle measurements, the specimens for measurement of shear strength of Cu, Ni and Ag/Bi‐11Ag joints were fabricated. EDX analysis was used for the study of the solder interaction with the surface of the three metallic substrates.

The best wettability at soldering in a shielding atmosphere was achieved with silver. The wetting angle at 30 min attained the value of 23°. The worst wettability was observed on copper, where at 30 min the wetting angle was 55°. Average shear strength varied from 31 to 45 MPa. The highest strength was obtained with the Cu substrate whereas the lowest was with the Ni substrate. The lowest strength achieved with the Ni substrate was caused by formation of brittle intermetallic phase NiBi₃. Joint formation is realised by eutectic reaction at the contact of Bi with the surface of the copper substrate. Similar joint formation by eutectic reaction occurs also at Bi interaction with the surface of the Ag substrate. At Bi interaction with the nickel substrate a new intermetallic phase (NiBi₃) is formed.

Wettability of Bi‐11Ag solder on Cu, Ag and Ni substrates was determined at application of a shielding atmosphere (90% N₂+10% H₂). Wettability was determined also at application of ZnCl₂‐NH₄Cl flux. The shear strength of Bi‐11Ag on different substrates was determined. The mechanism of joint formation was analysed.

This paper seeks to propose a business intelligence (BI) and enterprise resource planning (ERP) integrated framework that adds value to enterprise systems.

A conceptual approach is taken.

ERP systems integrate all facets of the business and make data available in real time. BI tools are capable of accessing data directly from ERP modules.

The value‐added system proposed allows enterprise‐wide transaction data to be collected and analyzed for organizational decision‐making processes.

Business intelligence (BI) systems and tools are deemed to be a transformative source with the potential to contribute to reshaping the way different healthcare organizations’ (HCOs) services are offered and managed. However, this emerging field of research still appears underdeveloped and fragmented. Hence, this paper aims to reconciling, analyzing and synthesizing different strands of managerial-oriented literature on BI in HCOs and to enhance both theoretical and applied future contributions.

A literature-based framework was developed to establish and guide a three-stage state-of-the-art systematic literature review (SLR). The SLR was undertaken adopting a hybrid methodology that combines a bibliometric and a content analysis.

In total, 34 peer-review articles were included. Results revealed significant heterogeneity in theoretical basis and methodological strategies. Nonetheless, the knowledge structure of this research’s stream seems to be primarily composed of five clusters of interconnected topics: (1) decision-making, relevant capabilities and value creation; (2) user satisfaction and quality; (3) process management, organizational change and financial effectiveness; (4) decision-support information, dashboard and key performance indicators; and (5) performance management and organizational effectiveness.

To the authors’ knowledge, this is the first SLR providing a business and management-related state-of-the-art on the topic. Besides, the paper offers an original framework disentangling future research directions from each emerged cluster into issues pertaining to BI implementation, utilization and impact in HCOs. The paper also discusses the need of future contributions to explore possible integrations of BI with emerging data-driven technologies (e.g. artificial intelligence) in HCOs, as the role of BI in addressing sustainability challenges.

The study investigates the influence of perceived security (PS) on behavioral intention (BI) via the trust attitude process and explores the moderating effects of gender. PS in mobile wallets enhances user trust (TR), attitude (ATT) and intention (INT). Using a multiple and serial mediation model, both TR and ATT were found to mediate the relationship between PS and BI.

Drawing on the stimulus-organism-response (S-O-R) theory, the proposed conceptual model comprises PS, TR, ATT and BI. An online survey was conducted with a cross-sectional sample of 744 mobile wallet users in India. Partial least squares structural equation modeling (PLS-SEM) was used to analyze the hypothesized relationships and test the mediation effects.

Results show that the stimulus, PS, has a positive and significant influence on TR and ATT, which eventually has a positive influence on BI. The research model explains 64.4 percent of the variance in BI. Further, both TR and ATT independently and parallelly mediate the relationship PS and BI. Lastly, gender is found to moderate the relationship between TR and BI and ATT and BI.

The research showed the importance of PS, TR and ATT towards mobile wallet adoption INTs. Further, the findings support the idea that developing TR and ATT is essential for shaping INTs. This suggests that mobile wallet service providers should invest in methods that not just enhance user TR but also reinforce a positive ATT towards the platform. To demonstrate TR, mobile wallet providers must ensure the confidentiality and privacy of user data, keep customer interests in mind and fulfill commitments. Lastly, for strengthening customer TR, excellent customer support is extremely important.

While prior researchers have majorly used technology acceptance model (TAM) and unified theory of acceptance and use of technology (UTAUT) models to explain adoption INTs, this study examines the relationship between PS, TR, ATT and BI through the lens of the SOR framework.

The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free solder for high-temperature applications.

Effect of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element.

The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC). The addition of Tb could effectively reduce the onset and melting point. The elastic modulus of Tb-containing solders was enhanced to about 90% at 0.5 Tb. The higher elastic modulus may be attributed to solid solution strengthening effect, solubility extension, microstructure refinement and precipitation hardening of uniform distribution Ag99.5Bi0.5 IMC particles which can reasonably modify the microstructure, as well as inhibit the segregation and hinder the motion of dislocations.

It is recommended that the lead-free Bi-0.5Ag-0.5Tb solder be a candidate instead of common solder alloy (Sn-37Pb) for high temperature and high performance applications.

Traditional indices of bi-dimensional inequality and polarization were developed for cardinal variables and cannot be used to quantify dispersion in ordinal measures of socioeconomic status and health. This chapter develops two approaches to the measurement of inequality and bi-polarization using only ordinal information. An empirical illustration is given for 24 European Union countries in 2004–2006 and 2011. Results suggest that inequalities and bi-polarization in income and health are especially large in Estonia and Portugal, and that inequalities have significantly increased in recent years in Austria, Belgium, Finland, Germany, and the Netherlands, whereas bi-polarization significantly decreased in France, Portugal, and the United Kingdom.

This paper aims to derive a reduced-order model for the heat transfer across the interface between a millimetric thermocapillary liquid bridge from silicone oil and the surrounding ambient gas.

Numerical solutions for the two-fluid model are computed covering a wide parametric space, making a total of 2,800 numerical flow simulations. Based on the computed data, a reduced single-fluid model for the liquid phase is devised, in which the heat transfer between the liquid and the gas is modeled by Newton’s heat transfer law, albeit with a space-dependent Biot function Bi(z), instead of a constant Biot number Bi.

An explicit robust fit of Bi(z) is obtained covering the whole range of parameters considered. The single-fluid model together with the Biot function derived yields very accurate results at much lesser computational cost than the corresponding two-phase fully-coupled simulation required for the two-fluid model.

Using this novel Biot function approach instead of a constant Biot number, the critical Reynolds number can be predicted much more accurately within single-phase linear stability solvers.

The Biot function for thermocapillary liquid bridges is derived from the full multiphase problem by a robust multi-stage fit procedure. The derived Biot function reproduces very well the theoretical boundary layer scalings.