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In the present work, we focus on developing an in-house parallel meshless local Petrov-Galerkin (MLPG) code for the analysis of heat conduction in two-dimensional and three-dimensional regular as well as complex geometries.

The parallel MLPG code has been implemented using open multi-processing (OpenMP) application programming interface (API) on the shared memory multicore CPU architecture. Numerical simulations have been performed to find the critical regions of the serial code, and an OpenMP-based parallel MLPG code is developed, considering the critical regions of the sequential code.

Based on performance parameters such as speed-up and parallel efficiency, the credibility of the parallelization procedure has been established. Maximum speed-up and parallel efficiency are 10.94 and 0.92 for regular three-dimensional geometry (343,000 nodes). Results demonstrate the suitability of parallelization for larger nodes as parallel efficiency and speed-up are more for the larger nodes.

Few attempts have been made in parallel implementation of the MLPG method for solving large-scale industrial problems. Although the literature suggests that message-passing interface (MPI) based parallel MLPG codes have been developed, the OpenMP model has rarely been touched. This work is an attempt at the development of OpenMP-based parallel MLPG code for the very first time.

The assembly simulation in tolerance analysis is one of the most important steps for the tolerance design of mechanical products. However, most assembly simulation methods are based on the rigid body assumption, and those assembly simulation methods considering deformation have a poor efficiency. This paper aims to propose a novel efficient and precise tolerance analysis method based on stable contact to improve the efficiency and reliability of assembly deformation simulation.

The proposed method comprehensively considers the initial rigid assembly state, the assembly deformation and the stability examination of assembly simulation to improve the reliability of tolerance analysis results. The assembly deformation of mating surfaces was first calculated based on the boundary element method with optimal initial assembly state, then the stability of assembly simulation results was assessed by the density-based spatial clustering of applications with noise algorithm to improve the reliability of tolerance analysis. Finally, combining the small displacement torsor theory, the tolerance scheme was statistically analyzed based on sufficient samples.

A case study of a guide rail model demonstrated the efficiency and effectiveness of the proposed method.

The present study only considered the form error when generating the skin model shape, and the waviness and the roughness of the matching surface were not considered.

To the best of the authors’ knowledge, the proposed method is original in the assembly simulation considering stable contact, which can effectively ensure the reliability of the assembly simulation while taking into account the computational efficiency.

In the current era of Industry 4.0, the manufacturing industries are striving toward mass production with mass customization by considering human–robot collaboration. This study aims to propose the reconfiguration of assembly systems by incorporating multiple humans with robots using a human–robot task allocation (HRTA) to enhance productivity.

A human–robot task scheduling approach has been developed by considering task suitability, resource availability and resource selection through multicriteria optimization using the Linear Regression with Optimal Point and Minimum Distance Calculation algorithm. Using line-balancing techniques, the approach estimates the optimum number of resources required for assembly tasks operating by minimum idle time.

The task allocation schedule for a case study involving a punching press was solved using human–robot collaboration, and the approach incorporated the optimum number of appropriate resources to handle different types of proportion of resources.

This proposed work integrates the task allocation by human–robot collaboration and decrease the idle time of resource by integrating optimum number of resources.

This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly.

In this work, through experiments and numerical simulations, an attempt has been made to increase the fundamental natural frequency of the PCB assembly as high as practically achievable so as to minimize the impacts of dynamic loads acting on it. An optimization tool in the finite element software (ANSYS) was used to search the specified design space for the optimal support location of the six fastening screws.

It is observed that by changing the support locations based on the optimization results the fundamental natural frequency can be raised up to 51.1% and the same is validated experimentally.

Manufacturers of PCBs used in computers fix the support locations based on symmetric feature of the board not on the dynamic behavior of the assembly. This work might lead manufacturers to redesign the location of other surface mount components.

This work provides guidelines for PCB manufacturers to finalize their support locating points which will improve the dynamic characteristics of the PCB assembly during its functioning.

This study provides a novel method to improve the life of PCB based on support locations optimization which includes majority of the surface mount components that contributes to the total mass the PCB assembly.

With hybrid simulation techniques getting popular for systems improvement in multiple fields, this study aims to provide insight on the use of hybrid simulation to assess the effect of lean manufacturing (LM) techniques on manufacturing facilities and the transition of a mass production (MP) facility to incorporating LM techniques.

In this paper, the authors apply a hybrid simulation approach to improve an educational automotive assembly line and provide guidelines for implementing different LM techniques. Specifically, the authors describe the design, development, verification and validation of a hybrid discrete-event and agent-based simulation model of a LEGO® car assembly line to analyze, improve and assess the system’s performance. The simulation approach examines the base model (MP) and an alternative scenario (just-in-time [JIT] with Heijunka).

The hybrid simulation approach effectively models the facility. The alternative simulation scenario (implementing JIT and Heijunka LM techniques) improved all examined performance metrics. In more detail, the system’s lead time was reduced by 47.37%, the throughput increased by 5.99% and the work-in-progress for workstations decreased by up to 56.73%.

This novel hybrid simulation approach provides insight and can be potentially extrapolated to model other manufacturing facilities and evaluate transition scenarios from MP to LM.

Snap fits are crucial in automotive applications for rapid assembly and disassembly of mating components, eliminating the need for fasteners. This study aims to focus on designing and analyzing serviceable cantilever fit snap connections used in automobile plastic components. Snap fits are classified into permanent and semi-permanent fittings, with permanent fittings having a snap clipping angle between 0° and 5° and semi-permanent fittings having a clipping angle between 15° and 45°. Polypropylene random copolymer is chosen for its exceptional fatigue resistance and elasticity.

The design process includes determining dimensions, computing assembly, disassembly pressures and creating three-dimensional computer-aided design models. Finite element analysis (FEA) is used to evaluate the snap-fit mechanism’s stress, deformation and general functionality in operational scenarios.

The study develops a modified snap-fit mechanism with decreased bending stress and enhanced mating force optimization. The maximum bending stress during assembly is 16.80 MPa, requiring a mating force of 7.58 N, while during disassembly, it is 37.3 MPa, requiring a mating force of 16.85 N. The optimized parameters significantly improve the performance and dependability of the snap-fit mechanism. The results emphasize the need of taking into account both the assembly and disassembly processes in snap-fit design, because the research demonstrates greater forces during disassembly. The approach developed integrates FEA and design for assembly (DFA) concepts to provide a solution for improving the efficiency and reliability of snap-fit connectors in automotive applications.

The research paper’s distinctiveness comes from the fact that it presents a thorough and realistic viewpoint on snap-fit design, emphasizes material selection, incorporates DFA principles and emphasizes the specific requirements of both assembly and disassembly operations. These discoveries may enhance the efficiency, reliability and sustainability of snap-fit connections in plastic automobile parts and beyond. In conclusion, the idea that disassembly needs to be done with a lot more force than installation in a snap-fit design can have a good effect on buzz, squeak and rattle and noise, vibration and harshness characteristics in automobiles.

In the context of fixed-wing aircraft wing assembly, there is a need for a rapid and precise measurement technique to determine the center distance between two double-hole components. This paper aims to propose an optical-based spatial point distance measurement technique using the spatial triangulation method. The purpose of this paper is to design a specialized measurement system, specifically a spherically mounted retroreflector nest (SMR nest), equipped with two laser displacement sensors and a rotary encoder as the core to achieve accurate distance measurements between the double holes.

To develop an efficient and accurate measurement system, the paper uses a combination of laser displacement sensors and a rotary encoder within the SMR nest. The system is designed, implemented and tested to meet the requirements of precise distance measurement. Software and hardware components have been developed and integrated for validation.

The optical-based distance measurement system achieves high precision at 0.04 mm and repeatability at 0.02 mm within a range of 412.084 mm to 1,590.591 mm. These results validate its suitability for efficient assembly processes, eliminating repetitive errors in aircraft wing assembly.

This paper proposes an optical-based spatial point distance measurement technique, as well as a unique design of a SMR nest and the introduction of two novel calibration techniques, all of which are validated by the developed software and hardware platform.

This paper establishes a quality model for automation assembly of range hood impeller based on generalized grey relational degree, it improves the debugging efficiency of the newly developed assembly workstation.

First, spot check the trial production impellers and obtain three indexes that reflect the assembly quality of the impellers. Then, analyze the parameters that affect the assembly quality of the impeller using grey relational analysis (GRA), establish a model for the assembly quality of the range hood impeller based on the generalized grey relational degree and identify the main parameters. After that, analyze the transmission structure of automation assembly workstation, identify the reasons that affect parameters and propose improvement plans. Finally, a trial production is conducted on the automation assembly workstation after adopting the improved plan to verify the quality model of impeller automation assembly.

The research shows that compared to manual assembly, the automation assembly quality of the impeller using GRA model has been improved, shortening the debugging cycle of the newly developed assembly workstation.

The newly developed automation equipment will have some problems in the trial production stage, which often rely on the experience of engineers for debugging. In this paper, the automation assembly quality model of range hood impeller based on GRA is established, which can not only ensure the quality of finished impeller but also shorten the debugging cycle of the equipment. In addition, GRA can be widely used in the commissioning of other automation equipment.

This study has developed a set of impeller automation assembly workstation. The debugging method in the trial production stage is beneficial to shorten the trial production time and improve the economic benefits.

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal cycling.

The BGA package samples are subjected to JEDEC Level 1 accelerated moisture treatment (85 °C/85%RH/168 h) with five times reflow at 270 °C. This is followed by multiple thermal cycling from 0 °C to 100 °C for 40 min per cycle, per IPC-7351B standards. For fracture investigation, the cross-sections of the samples are examined and analysed using the dye-and-pry technique and backscattered scanning electron microscopy. The packages' microstructures are characterized using an energy-dispersive X-ray spectroscopy approach. Also, the package assembly is investigated using the Darveaux numerical simulation method.

The study found that critical strain density is exhibited at the component pad/solder interface of the solder joint located at the most distant point from the axes of symmetry of the package assembly. The fracture mechanism is a crack fracture formed at the solder's exterior edges and grows across the joint's transverse section. It was established that Au content in the formed intermetallic compound greatly impacts fracture growth in the solder joint interface, with a composition above 5 Wt.% Au regarded as an unsafe level for reliability. The elongation of the crack is aided by the brittle nature of the Au-Sn interface through which the crack propagates. It is inferred that refining the solder matrix elemental compound can strengthen and improve the reliability of solder joints.

Inspection lead time and additional manufacturing expenses spent on investigating reliability issues in BGA solder joints can be reduced using the study's findings on understanding the solder joint fracture mechanism.

Limited studies exist on the thermal fracture mechanism of moisture-preconditioned BGA solder joints exposed to both multiple reflow and thermal cycling. This study applied both numerical and experimental techniques to examine the reliability issue.