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1 – 10 of 402Andrea Spaggiari and Filippo Favali
The purpose of this paper is to evaluate and exploit the combination of additive manufacturing polymeric technology and structural adhesives. The main advantage is to expand the…
Abstract
Purpose
The purpose of this paper is to evaluate and exploit the combination of additive manufacturing polymeric technology and structural adhesives. The main advantage is to expand the maximum dimension of the 3D printed parts, which is typically limited, by joining the parts with structural adhesive, without losing strength and stiffness and keeping the major asset of polymeric 3 D printing: freedom of shape of the system and low cost of parts.
Design/methodology/approach
The materials used in the paper are the following. The adhesive considered is a commercial inexpensive acrylic, quite similar to superglue, applicable with almost no surface preparation and fast curing, as time constraint is one of the key problems that affects industrial adhesive applications. The 3D printed parts were in acrylonitrile butadiene styrene (ABS), obtained with a Fortus 250mc FDM machine, from Stratasys. The work first compares flat overlap joint with joints designed to permit mechanical interlocking of the adherends and then to a monolithic component with the same geometry. Single lap, joggle lap and double lap joints are the configurations experimentally characterized following a design of experiment approach.
Findings
The results show a failure in the substrate, due to the low strength of the polymeric adherends for the first batch of typical bonded configurations, single lap, joggle lap and double lap. The central bonded area, with an increased global thickness, never does fail, and the adhesive is able to transfer the load both with and without mechanical interlocking. An additional set of scarf joints was also tested to promote adhesive failure as well as to retrieve the adhesive strength in this application. The results shows that bonding of polymeric AM parts is able to express its full potential compared with a monolithic solution even though the joint fails prematurely in the adherend due to the bending stresses and the notches present in the lap joints.
Research limitations/implications
Because of the 3D printed polymeric material adopted, the results may be generalized only when the elastic properties of the adherends and of the adhesive are similar, so it is not possible to extend the findings of the work to metallic additive manufactured components.
Practical implications
The paper shows that the adhesives are feasible way to expand the potentiality of 3 D printed equipment to obtain larger parts with equivalent mechanical properties. The paper also shows that the scarf joint, which fails in the adhesive first, can be used to extract information about the adhesive strength, useful for the designers which have to combine adhesive and additive manufactured polymeric parts.
Originality/value
To the best of the researchers’ knowledge, there are scarce quantitative information in technical literature about the performance of additive manufactured parts in combination with structural adhesives and this work provides an insight on this interesting subject. This manuscript provides a feasible way of using rapid prototyping techniques in combination with adhesive bonding to fully exploit the additive manufacturing capability and to create large and cost-effective 3 D printed parts.
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Ge Li, Qiushi Kang, Fanfan Niu and Chenxi Wang
Bumpless Cu/SiO2 hybrid bonding, which this paper aims to, is a key technology of three-dimensional (3D) high-density integration to promote the integrated circuits industry’s…
Abstract
Purpose
Bumpless Cu/SiO2 hybrid bonding, which this paper aims to, is a key technology of three-dimensional (3D) high-density integration to promote the integrated circuits industry’s continuous development, which achieves the stacks of chips vertically connected via through-silicon via. Surface-activated bonding (SAB) and thermal-compression bonding (TCB) are used, but both have some shortcomings. The SAB method is overdemanding in the bonding environment, and the TCB method requires a high temperature to remove copper oxide from surfaces, which increases the thermal budget and grossly damages the fine-pitch device.
Design/methodology/approach
In this review, methods to prevent and remove copper oxidation in the whole bonding process for a lower bonding temperature, such as wet treatment, plasma surface activation, nanotwinned copper and the metal passivation layer, are investigated.
Findings
The cooperative bonding method combining wet treatment and plasma activation shows outstanding technological superiority without the high cost and additional necessity of copper passivation in manufacture. Cu/SiO2 hybrid bonding has great potential to effectively enhance the integration density in future 3D packaging for artificial intelligence, the internet of things and other high-density chips.
Originality/value
To achieve heterogeneous bonding at a lower temperature, the SAB method, chemical treatment and the plasma-assisted bonding method (based on TCB) are used, and surface-enhanced measurements such as nanotwinned copper and the metal passivation layer are also applied to prevent surface copper oxide.
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