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Cables are ubiquitous in electronic-based systems. Electromagnetic emission of cables and crosstalk between wires is an important issue in electromagnetic compatibility and is to be minimized in the design phase. To facilitate the design, models of different complexity and accuracy, for instance, circuit models or finite element (FE) simulations, are used. The purpose of this study is to compare transmission line parameters obtained by measurements and simulations.

Transmission line parameters were determined by means of measurements in the frequency and time domain and by FE simulations in the frequency domain and compared. Finally, a Spice simulation with lumped elements was performed.

The determination of the effective permittivity of insulated wires seems to be a key issue in comparing measurements and simulations.

A space decomposition technique for a guided wave on an infinite configuration with constant cross-section has been introduced, where an analytic representation in the direction of propagation is used, and the transversal fields are approximated by FEs.

In this paper, we investigate the coevolution of the supply network and procurement strategies in the context of semiconductors and electronics for the automotive industry over 3 decades. We aim to explain how procurement strategy interrelates with changes in supply network structure and what the implications of a hub-centric structure network structure are for procurement in supply.

We collected in-depth primary and secondary data that stretched back to 1996 from a leading automotive European original equipment manufacturer (OEM) and its network. Using social network analysis (SNA), we identified OEMs’ procurement focus and mapped the evolution of the supply network, the links in the network, and the environmental forces impacting the strategies and the network.

Our findings describe the supply network for semiconductor and electronic components to the automotive industry. The findings suggest that a focus on cost can lead to a Tier 1-centric network structure with many tiers that can fail to assure supply or capture innovation when the external environment is marked by high uncertainty. In such situations, increasing complexity by creating more links in the network can improve transparency and contribute to supply assurance and innovation.

The findings indicate that managers should consider the role of the supply network in selecting their strategy to attain objectives of cost, innovation, and supply assurance.

This paper presents empirical-based insights into the automotive semiconductor and electronic component supply chain (SC), the unexpected implications of hub-centric supply networks, and the use of SNA in the SC in context.

This paper aims to perform thermal and mechanical characterization for silver-based sintered thermal joints. Layer quality affects thermal and mechanical performance, and it is important to achieve information about how materials and process parameters influence them.

Thermal investigation of the thermal joints analysis method was focused on determination of thermal resistance, where temperature measurements were performed using infrared camera. They were performed in two modes: steady-state analysis and dynamic analysis. Mechanical analysis based on measurements of mechanical shear force. Additional characterizations based on X-ray image analysis (image thresholding), optical microscope of polished cross-section and scanning electron microscope image analysis were proposed.

Sample surface modification affects thermal resistance. Silver metallization exhibits the lowest thermal resistance and the highest mechanical strength compared to the pure Si surface. The type of dynamic analysis affects the results of the thermal resistance.

Investigation of the layer quality influence on mechanical and thermal performance provided information about different joint types.

The study examines the remote integration process of advanced manufacturing technology (AMT) into the production system and identifies key challenges and mitigating actions for a smoother introduction and integration process.

The study adopts a case study approach to a cyber-physical production system at an industrial technology center using a mobile robot as an AMT.

By applying the plug-and-produce concept, the study exemplifies an AMT's remote integration process into a cyber-physical production system in nine steps. Eleven key challenges and twelve mitigation actions for remote integration are described based on technology–organization–environment theory. Finally, a remote integration framework is proposed to facilitate AMT integration into production systems.

The study presents results purely from a practical perspective, which could reduce dilemmas in early decision-making related to smart production. The proposed framework can improve flexibility and decrease the time needed to configure new AMTs in existing production systems.

The area of remote integration for AMT has not been addressed in depth before. The consequences of lacking in-depth studies for remote integration imply that current implementation processes do not match the needs and the existing situation in the industry and often underestimate the complexity of considering both technological and organizational issues. The new integrated framework can already be deployed by industry professionals in their efforts to integrate new technologies with shorter time to volume and increased quality but also as a means for training employees in critical competencies required for remote integration.

This study aims to address the problem of low-temperature wave soldering in industry production with Sn-9Zn-2.5 Bi-1.5In alloys and develop qualified process parameters. Sn–Zn eutectic alloys are lead-free solders applied in consumer electronics due to their low melting point, high strength, and low cost. In the electronic assembly industry, Sn–Zn eutectic alloys have great potential for use.

This paper explored developing and implementing process parameters for low-temperature wave soldering of Sn–Zn alloys (SN-9ZN-2.5BI-1.5 In). A two-factor, three-level design of the experiments experiment was designed to simulate various conditions parameters encountered in Sn–Zn soldering, developed the nitrogen protection device of waving soldering and proposed the optimal process parameters to realize mass production of low-temperature wave soldering on Sn–Zn alloys.

The Sn-9Zn-2.5 Bi-1.5In alloy can overcome the Zn oxidation problem, achieve low-temperature wave soldering and meet IPC standards, but requires the development of nitrogen protection devices and the optimization of a series of process parameters. The design experiment reveals that preheating temperature, soldering temperature and flux affect failure phenomena. Finally, combined with the process test results, an effective method to support mass production.

In term of overcome Zn’s oxidation characteristics, anti-oxidation wave welding device needs to be studied. Various process parameters need to be developed to achieve a welding process with lower temperature than that of lead solder(Sn–Pb) and lead-free SAC(Sn-0.3Ag-0.7Cu). The process window of Sn–Zn series alloy (Sn-9Zn-2.5 Bi-1.5In alloy) is narrow. A more stringent quality control chart is required to make mass production.

In this research, the soldering temperature of Sn-9Zn-2.5 Bi-1.5In is 5 °C and 25 °C lower than Sn–Pb and Sn-0.3Ag-0.7Cu(SAC0307). To the best of the authors’ knowledge, this work was the first time to apply Sn–Zn solder alloy under actual production conditions on wave soldering, which was of great significance for the study of wave soldering of the same kind of solder alloy.

Low-temperature wave soldering can supported green manufacturing widely, offering a new path to achieve carbon emissions for many factories and also combat to international climate change.

There are many research papers on Sn–Zn alloys, but methods of achieving low-temperature wave soldering to meet IPC standards are infrequent. Especially the process control method that can be mass-produced is more challenging. In addition, the metal storage is very high and the cost is relatively low, which is of great help to provide enterprise competitiveness and can also support the development of green manufacturing, which has a good role in promoting the broader development of the Sn–Zn series.

This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

The emergence of distributed manufacturing (DM) is examined as a new form of localised production, distinct from previous manifestations of multi-domestic and indigenous production.

Supply network (SN) configuration and infrastructural provisioning perspectives were used to examine the literature on established localised production models as well as DM. A multiple case study was then undertaken to describe and explore the DM model further. A maximum variation sampling procedure was used to select five exemplar cases.

Three main contributions emerge from this study. First, the research uniquely brings together two bodies of literature, namely SN configuration and infrastructure provisioning to explore the DM context. Second, the research applies these theoretical lenses to establish the distinctive nature of DM across seven dimensions of analysis. Third, emerging DM design rules are identified and compared with the more established models of localised production, drawing on both literature and DM case evidence.

This study provides a rich SN configuration and infrastructural provisioning view on DM leading to a set of design rules for DM adoption, thus supporting practitioners in their efforts to develop viable DM implementation plans.

The authors contribute to the intra- and inter-organisational requirements for the emerging DM context by providing new perspectives through the combined lenses of SN configuration and infrastructural provisioning approaches.

For many decades, it has been recognized that maintenance activities should be adapted to the specific usage of a system. For that reason, many advanced policies have been developed, such as condition-based and load-based maintenance policies. However, these policies require advanced monitoring techniques and rather detailed understanding of the failure behavior, which requires the support of an OEM or expert, prohibiting application by an operator in many cases. The present work proposes a maintenance policy that relieves the high (technical) demands set by these existing policies and provides a more accurate specification of the required (dynamic) maintenance interval than traditional usage-based maintenance.

The methodology followed starts with a review and critical assessment of existing maintenance policies, which are classified according to six different aspects. Based on the need for a technically less demanding policy that appears from this comparison, a new policy is developed. The consecutive steps required for this functional usage profiles based maintenance policy are then critically discussed: usage profile definition, monitoring, profile severity quantification and the possible extension to the fleet level. After the description of the proposed policy, it is demonstrated in three case studies on real systems.

A maintenance policy based on a simple usage registration procedure appears to be feasible, which enables a significantly more efficient maintenance process than the traditional usage-based policies. This is demonstrated by the policy proposed here.

The proposed maintenance policy based on functional usage profiles offers the operators of fleets of systems the opportunity to increase the efficiency and effectiveness of their maintenance process, without the need for a high investment in advanced monitoring systems and in experts interpreting the results.

The original contribution of this work is the explicit definition of a new maintenance policy, which combines the benefits of considering the effects of usage or environment severity with a limited investment in monitoring technology.

In this paper, we examine the comparative advantage of Korea and China while focusing on their technology level. The three digit SITC (Standard International Trade Classification) data is classified by technology level and the revealed comparative advantage (RCA) is derived from 1992-2009 by using UN COMTRADE data. For careful interpretation of the comparative advantage and technology levels, we also examined intra-industry trade and unit values of bilateral Korea-China trade, and semi-conductor industry technology. We found that the revealed comparative advantage has moved from low technology products to high technology products in Korea. China still maintains a comparative advantage in low technology products such as textiles and clothing, but at the same time, China’s high and medium-high technology products have recently gained a comparative advantage. The perception that China only has a comparative advantage for labor intensive products with low technology should be changed based on our analysis. However, China’s advancement in technology should not be overestimated. When comparing the unit value of basic materials of Korea’s and China’s exports, we found that Korea’s export product prices are on average higher than that of China’s, although the gap is reducing. A wider technology gap between Korea and China still exists in the semi-conductor industry, which is one of the most advanced high technology industries throughout the world.

This paper describes a two-month summer intensive course designed to introduce participants with a hands-on technical craft on robotics and to acquire experience in the low-level details of embedded systems. Attendants started this course with a brief introduction to robotics; learned to draw, design and create a personalized 3D structure for their mobile robotic platform and developed skills in embedded systems. They were familiarize with the practices used in robotics, learning to connect all sensors and actuator, developing a typical application on differential kinematic using Arduino, exploring ROS features under Raspberry Pi environment and Arduino – Raspberry Pi communication. Different paradigms and some real applications and programming were addressed on the topic of Artificial Intelligence. Throughout the course, participants were introduced to programming languages (including Python and C++), advanced programming concepts such as ROS, basic API development, system concepts such as I2C and UART serial interfaces, PWM motor control and sensor fusion to improve robotic navigation and localization. This paper describes not just the concept, layout and methodology used on RobotCraft 2017 but also presents the participants knowledge background and their overall opinions, leading to focus on lessons learned and suggestions for future editions.