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The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology.

The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test.

To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated.

The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

Carpal tunnel syndrome (CTS) is a hand disease caused by the pressing of the median nerve present in the palmar side of the wrist. It causes severe pain in the wrist, triggering disturbance during sleep. Different products like splints, braces and gloves are available in the market to alleviate this disease but there was still a need to improve the wearability, comfort and cost of the product. This study was about designing a comfortable and cost-effective wearable system for mild-to-moderate CTS. Transcutaneous electrical nerve stimulation (TENS) therapy has been used to reduce the pain in the wrist.

After simulation by using Proteus software (which allowed the researchers to draw and simulate electrical circuits using ISIS, ARES and PCB design tools virtually), the circuit with optimum frequency, i.e. 33 Hz was selected, and the circuit was developed on a printed circuit board (PCB). The developed circuit was integrated successfully into the half glove structure.

The developed product had good thermophysiological comfort and hand properties as compared to the commercially available product of the same kind. In vivo testing (It involves the testing with living subjects like animals, plants or human beings) was performed which resulted in 85% confirmed viability of the product against CTS. A glove with an integrated circuit was developed successfully to accommodate various sizes without any sex specifications in a cost-effective way to mitigate the issue of CTS.

Industrial workers, individuals frequently using their hands or those diagnosed with CTS may wish to use this product as therapy. The attention could not be paid to the aesthetic or visual appeal of the developed product.

A very comfortable glove with integrated TENS electrodes was developed successfully to accommodate various sizes without any sex specifications in a cost-effective way to mitigate the issues of CTS.

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic component assemblies requires the adoption of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly.

In this study, simplifying assumptions were used. These involved substituting dynamic imposed displacement loading with an equivalent static loading, replacing the spherical shape of the interconnections with simplified shapes (cylindrical and cubic) and transitioning from a three-dimensional modelling approach to an equivalent two-dimensional model. The validity of these simplifications was confirmed through both quantitative and qualitative comparisons of the numerical results obtained. The maximum principal plastic strain in the solder balls and copper pads served as the criteria for comparison.

The simplified hypotheses were validated through quantitative and qualitative comparisons of the results from various models. Consequently, it was determined that the replacement of dynamic loading with equivalent static loading had no significant impact on the results. Similarly, substituting the spherical shape of interconnections with an equivalent shape and transitioning from a three-dimensional approach to a two-dimensional one did not substantially affect the precision of the obtained results.

This study serves as a valuable resource for researchers seeking to model accelerated reliability tests, particularly in the context of four-point bending tests. The results obtained in this study will assist other researchers in streamlining their numerical models, thereby reducing calculation costs through the utilization of the simplified hypotheses introduced and validated herein.

This paper aims to discuss the ethical aspects of hardware reverse engineering (HRE) and propose an ethical framework for HRE when used to mitigate cyber risks of the digital supply chain of critical infrastructure operators.

A thorough review and analysis of existing relevant literature was performed to establish the current state of knowledge in the field. Ethical frameworks proposed for other areas/disciplines and identified pertinent ethical principles have been used to inform the proposed framework’s development.

The proposed framework provides actionable guidance to security professionals engaged with such activities to support them in assessing whether an HRE project conforms to ethical principles. Recommendations on action needed to complement the framework are also proposed. According to the proposed framework, reverse engineering is neither unethical nor illegal if performed honourably. Collaboration with vendors and suppliers at an industry-wide level is critical for appropriately endorsing the proposed framework.

To the best of the authors’ knowledge, no ethical framework currently guides cybersecurity research, far less of cybersecurity vulnerability research and reverse engineering.

The purpose of this paper is to develop a prototype of a wearable medical device in the form of a bandage with a real-time data monitoring platform, which can be used domestically for diabetic patients to identify the possibility of foot ulceration at the early stage.

The prototype can measure blood volumetric change and temperature variation in the forefoot area simultaneously. The waveform extracted using a pulsatile-blood-flow signal was used to assess blood perfusion-related information, and hence, predict ischemic ulcers. The temperature difference between ulcerated and the reference was used to predict neuropathic ulcers. The medical device can be used as a bandage during the application wherein the sensory module is placed inside the hollow pocket of the bandage. A platform was developed through a mobile application where doctors can extract real-time information, and hence, determine the possibility of ulceration.

The height of the peaks in the pulsatile-blood-flow signal measured from the subject with foot ischemic ulcers is significantly less than that of the subject without ischemic ulcers. In the presence of ischemic ulcers, the captured waveform flattens. Therefore, the blood perfusion from arteries to the tissue of the forefoot is considerably low for the subject with ischemic ulcers. According to the temperature difference data measured over 25 consecutive days, the temperature difference of the subject with neuropathic ulcers occasionally exceeded the 4 °F range but mostly had higher values closer to the 4 °F range. However, the temperature difference of the subject who had no complications of neuropathic ulcers did not exceed the 4 °F range, and the majority of the measurements occupy a narrow range from −2°F to 2 °F.

The proposed prototype of wearable medical apparatus can monitor both temperature variation and pulsatile-blood-flow signal on the forefoot simultaneously and thereby predict both ischemic and neuropathic diabetes using a single device. Most importantly, the wearable medical device can be used domestically without clinical assistance with a real-time data monitoring platform to predict the possibility of ulceration and the course of action thereof.

This paper aims to compare and evaluate the influence of package designs and characteristics on the mechanical reliability of electronic assemblies when subjected to harmonic vibrations.

Using finite element analysis (FEA), the effect of package design-related parameters, including the interconnect array configuration, i.e. full vs perimeter, and package size, on solder mechanical stresses are fully addressed.

The results of FEA simulations revealed that the number of solder rows or columns available in the array, could significantly affect solder stresses. In addition, smaller packages result in lower solder stresses and differing distributions.

In literature, there are no papers that discuss the effect of solder array layout on electronic packages vibration reliability. In addition, general rules for designing electronic assemblies subjected to harmonic vibration loadings are proposed in this paper.

The production of commodities from renewable organic material has gained enormous interest due to the rising public understanding of conscious development. Natural fibers are accessible in environment, and their parameters depend on their physical traits and chemically engineered makeup. Grewia optiva (GO) comes under the category of bast fibers, also known as Bhimal. This study aims to realize the consequences of alkali treatment on the characterization of natural fibers, their developed yarn and then the woven mat.

Raw fiber was treated with 20% alkali solution. After treatment, it was evaluated for changes in the general laboratory system. This treatment is known as mercerization, through which the parameters of cellulose fibers can be enhanced. After this process, the content of cellulose increases due to the removal of the hydroxyl group. The removal of microfibrils, hemicellulose and the introduction of hydrogen bonds increase the interactive capacity of fiber. The job was divided into different sections, including acquiring fiber, developing yarn and creating a mat.

The quality of the surface of the fiber was enhanced after the treatment. Its diameter was reduced to 54.72 microns. In the developed woven mat, it was densified using water treatment and attained grams per square meter (GSM) of 389.7.

The usage of mercerization softens the fiber to twist into yarn, which is finally woven into a mat. Treatment of fabric or mat makes it denser to impart better strength. A woven mat of natural fibers provides maximum strength to the composites.

This study aims to investigate the influence of different solder alloy materials on passive devices during laser soldering process. Solder alloy material has been found to significantly influence the solder joint’s quality, such as void formation that can lead to cracks, filling time that affects productivity and fillet shape that determines the solder joint’s reliability.

Finite volume method (FVM)-based simulation that was validated using real laser soldering experiment is used to evaluate the effect of various solder alloy materials, including SAC305, SAC387, SAC396 and SAC405 in laser soldering. These solders are commonly used to assemble the pin-through hole (PTH) capacitor onto the printed circuit board.

The simulation results show how the void ratio, filling time and flow characteristics of different solder alloy materials affect the quality of the solder joint. The optimal solder alloy is SAC396 due to its low void ratio of 1.95%, fastest filling time (1.3 s) to fill a 98% PTH barrel and excellent flow characteristics. The results give the ideal setting for the parameters that can increase the effectiveness of the laser soldering process, which include reducing filling time from 2.2 s to less than 1.5 s while maintaining a high-quality solder joint with a void ratio of less than 2%. Industries that emphasize reliable soldering and effective joint formation gain the advantage of minimal occurrence of void formation, quick filling time and exceptional flowability offered by this solution.

This research is expected not only to improve solder joint reliability but also to drive advancements in laser soldering technology, supporting the development of efficient and reliable microelectronics assembly processes for future electronic devices. The optimized laser soldering material will enable the production of superior passive devices, meeting the growing demands of the electronics market for smaller, high-performance electronic products.

The comparison of different solder alloy materials for PTH capacitor assembly during the laser soldering process has not been reported to date. Additionally, volume of fluid numerical analysis of the quality and reliability of different solder alloy joints has never been conducted on real PTH capacitor assemblies.

This study aims to introduce a novel technique for nonlinear sensor time constant estimation and sensor dynamic compensation in hot-bar soldering using an extended Kalman filter (EKF) to estimate the temperature of the thermocouple.

Temperature optimal control is combined with a closed-loop proportional integral differential (PID) control method based on an EKF. Different control methods for measuring the temperature of the thermode in terms of temperature control, error and antidisturbance are studied. A soldering process in a semi-industrial environment is performed. The proposed control method was applied to the soldering of flexible printed circuits and circuit boards. An infrared camera was used to measure the top-surface temperature.

The proposed method can not only estimate the soldering temperature but also eliminate the noise of the system. The performance of this methodology was exemplary, characterized by rapid convergence and negligible error margins. Compared with the conventional control, the temperature variability of the proposed control is significantly attenuated.

An EKF was designed to estimate the temperature of the thermocouple during hot-bar soldering. Using the EKF and PID controller, the nonlinear properties of the system could be effectively overcome and the effects of disturbances and system noise could be decreased. The proposed method significantly enhanced the temperature control performance of hot-bar soldering, effectively suppressing overshoot and shortening the adjustment time, thereby achieving precise temperature control of the controlled object.

The purpose of this paper was to prepare a ternary hierarchical rough particle to accelerate the anti-corrosive design for coastal concrete infrastructures.

A kind of micro-nano hydrophobic ternary microparticles was fabricated from SiO₂/halloysite nanotubes (HNTs) and recycled concrete powders (RCPs), which was then mixed with sodium silicate and silane to form an inorganic slurry. The slurry was further sprayed on the concrete surface to construct a superhydrophobic coating (SHC). Transmission electron microscopy and energy-dispersive X-ray spectroscopy mappings demonstrate that the nano-sized SiO₂ has been grafted on the sub-micron HNTs and then further adhered to the surface of micro-sized RCP, forming a kind of superhydrophobic particles (SiO₂/HNTs@RCP) featured of abundant micro-nano hierarchical structures.

The SHC surface presents excellent superhydrophobicity with the water contact angle >156°. Electrochemical tests indicate that the corrosion rate of mild steel rebar in coated concrete reduces three-order magnitudes relative to the uncoated one in 3.5% NaCl solution. Water uptake and chloride ion (Cl^-) diffusion tests show that the SHC exhibits high H₂O and Cl^- ions barrier properties thanks to the pore-sealing and water-repellence properties of SiO₂/HNTs@RCP particles. Furthermore, the SHC possesses considerable mechanical durability and outstanding self-cleaning ability.

SHC inhibits water uptake, Cl^- diffusion and rebar corrosion of concrete, which will promote the sustainable application of concrete waste in anti-corrosive concrete projects.